公开(公告)号：US20130045572A1

公开(公告)日：2013-02-21

申请号：US13210135

申请日：2011-08-15

Applicant: Lee Han Meng @ Eugene Lee ,  Yien Sien Khoo ,  Kuan Yee Woo

Inventor： Lee Han Meng @ Eugene Lee ,  Yien Sien Khoo ,  Kuan Yee Woo

IPC: H01L23/495

CPC classification number: H01L23/495 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49589 ,  H01L2224/16

Abstract: In one aspect of the invention, an integrated circuit package is described. The integrated circuit package includes a substrate formed from a dielectric material that includes multiple electrical contacts and conductive paths. An upper lead frame is attached with and underlies the substrate. The upper lead frame is electrically connected with at least one of the contacts on the substrate. The active surface of an integrated circuit die is electrically and physically coupled to the upper lead frame through multiple electrical connectors. A lower lead frame may be attached with the back surface of the integrated circuit die. A passive device is positioned on and electrically connected with one of the contacts on the substrate and/or the upper lead frame.

Abstract translation: 在本发明的一个方面，描述了集成电路封装。 集成电路封装包括由包括多个电触点和导电路径的介电材料形成的基板。 上引线框架与基板相连并且在其下方。 上引线框架与基板上的至少一个触点电连接。 集成电路管芯的有源表面通过多个电连接器电性和物理地耦合到上引线框架。 下引线框架可以与集成电路管芯的背面连接。 无源器件位于衬底和/或上引线框架上的触点之一上并与之电连接。

公开(公告)号：US20110140253A1

公开(公告)日：2011-06-16

申请号：US12637657

申请日：2009-12-14

Applicant: Shaw Wei LEE ,  Yee Kim LEE ,  Ein Sun NG ,  Lee Han Meng @ Eugene LEE ,  Ting Soon Peter CHIN

Inventor： Shaw Wei LEE ,  Yee Kim LEE ,  Ein Sun NG ,  Lee Han Meng @ Eugene LEE ,  Ting Soon Peter CHIN

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/49582 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A variety of semiconductor package arrangements and packaging methods are described that improve the reliability of bonding wires that down bond a die to a die attach pad. In one aspect, selected portions of the top surface of a lead frame (which may be in panel form) are plated (e.g., silver plated) to facilitate wire bonding. The plating covers some, but not all of a die attach surface of the die attach pad. In some preferred embodiments, the plating on the die attach pad is arranged as a peripheral ring that surrounds an unplated central region of the die support surface. In other embodiments, the plating on the die attach pad takes the form of bars or other geometric patterns that do not fully cover the die support surface. Unplated portions of the die support surface are roughened to improve the adherence of the die to the die attach pad, thereby reducing the probability of die attach pad delamination and the associated risks to down bonded bonding wires. The described lead frames may be used in a variety of packages. Most commonly, a die is attached to the die support surface of the die attach pad and electrically connected to the lead frame leads by wire bonding as appropriate. At least one of the die's bond pads (typically the ground bond pad(s)) is down bonded to the die attach pad. The die, the bonding wires and at least portions of the lead frame are then typically encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.

Abstract translation: 描述了各种半导体封装布置和封装方法，其提高将管芯下模焊接到管芯附接焊盘的接合线的可靠性。 在一个方面，引线框架（其可以是面板形式）的顶表面的选定部分被电镀（例如镀银），以便于引线接合。 电镀覆盖了芯片附着垫的一些但不是全部的芯片附着表面。 在一些优选实施例中，管芯附接垫上的镀层被布置为围绕模具支撑表面的未镀覆的中心区域的周边环。 在其他实施例中，管芯附接垫上的电镀采用不完全覆盖管芯支撑表面的棒或其它几何图案的形式。 模具支撑表面的未镀层的部分被粗糙化以改善模具与管芯附接垫的粘附，从而降低管芯附着垫分层的可能性以及与下焊接焊接线的相关风险。 所描述的引线框架可以用于各种封装。 最常见的是，模具附接到管芯附接垫的管芯支撑表面，并且通过适当的引线接合电连接到引线框架引线。 管芯的接合焊盘（通常为接地焊盘）中的至少一个被下接合到管芯附接焊盘。 然后，模具，接合线和引线框架的至少一部分通常用塑料密封剂材料封装，同时使裸片附接垫的接触表面暴露以便于将管芯附接垫电耦合到外部设备。

公开(公告)号：US08847370B2

公开(公告)日：2014-09-30

申请号：US13270134

申请日：2011-10-10

Applicant: Lee Han Meng Eugene Lee ,  Kok Leong Yeo ,  Kooi Choon Ooi ,  Chen Seong Chua

Inventor： Lee Han Meng Eugene Lee ,  Kok Leong Yeo ,  Kooi Choon Ooi ,  Chen Seong Chua

IPC: H01L23/495 ,  B29C45/14 ,  H01L23/31 ,  H01L21/78 ,  H01L23/00 ,  H01L21/56

CPC classification number: B29C45/14 ,  B29C45/14655 ,  H01L21/56 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/49572 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00

Abstract: In one aspect of the present invention, an integrated circuit package with an exposed die and a protective housing will be described. The housing extends beyond the exposed back surface of the die to help protect it from damage. The integrated circuit package includes a lead frame and an integrated circuit die. The integrated circuit die is electrically and physically attached to the lead frame. The housing encapsulates the lead frame and the die. The housing also includes a recessed region at the bottom of the package where the back surface of the die is exposed. There is a protruding protective structure at the bottom of the package that helps to protect the die and prevent its exposed back surface from coming in contact with an external object.

Abstract translation: 在本发明的一个方面，将描述具有外露模具和保护壳体的集成电路封装。 外壳延伸超过模具的暴露后表面，以帮助防止损坏。 集成电路封装包括引线框架和集成电路管芯。 集成电路管芯电连接并物理连接到引线框架上。 壳体封装引线框架和模具。 壳体还包括在封装的底部处的裸露区域，其中裸片的背表面被暴露。 在包装底部有一个突出的保护结构，有助于保护模具并防止其暴露的背面与外部物体接触。

公开(公告)号：US20130087901A1

公开(公告)日：2013-04-11

申请号：US13270134

申请日：2011-10-10

Applicant: Lee Han Meng @ Eugene LEE ,  Kok Leong YEO ,  Kooi Choon OOI ,  Chen Seong CHUA

Inventor： Lee Han Meng @ Eugene LEE ,  Kok Leong YEO ,  Kooi Choon OOI ,  Chen Seong CHUA

IPC: H01L23/495 ,  H01L21/78 ,  B29C45/14 ,  H01L21/56

CPC classification number: B29C45/14 ,  B29C45/14655 ,  H01L21/56 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/49572 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00

Abstract: In one aspect of the present invention, an integrated circuit package with an exposed die and a protective housing will be described. The housing extends beyond the exposed back surface of the die to help protect it from damage. The integrated circuit package includes a lead frame and an integrated circuit die. The integrated circuit die is electrically and physically attached to the lead frame. The housing encapsulates the lead frame and the die. The housing also includes a recessed region at the bottom of the package where the back surface of the die is exposed. There is a protruding protective structure at the bottom of the package that helps to protect the die and prevent its exposed back surface from coming in contact with an external object.

Abstract translation: 在本发明的一个方面，将描述具有外露模具和保护壳体的集成电路封装。 外壳延伸超过模具的暴露后表面，以帮助防止损坏。 集成电路封装包括引线框架和集成电路管芯。 集成电路管芯电连接并物理连接到引线框架上。 壳体封装引线框架和模具。 壳体还包括在封装的底部处的裸露区域，其中裸片的背表面被暴露。 在包装底部有一个突出的保护结构，有助于保护模具并防止其暴露的背面与外部物体接触。

公开(公告)号：US08304887B2

公开(公告)日：2012-11-06

申请号：US12635624

申请日：2009-12-10

Applicant: Lee Han Meng @ Eugene Lee ,  Kuan Yee Woo

Inventor： Lee Han Meng @ Eugene Lee ,  Kuan Yee Woo

IPC: H01L23/52

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/552 ,  H01L24/27 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/83192 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025

Abstract: An integrated circuit package is described that includes a substrate, a leadframe and one or more integrated circuits that are positioned between the substrate and the leadframe. Multiple electrical components may be attached to one or both sides of the substrate. The active face of the integrated circuit is electrically and physically connected to the substrate. The back side of the integrated circuit is mounted on a die attach pad of the leadframe. The leadframe includes multiple leads that are physically attached to and electrically coupled with the substrate. A molding material encapsulates portions of the substrate, the leadframe and the integrated circuit. Methods for forming such packages are also described.

Abstract translation: 描述了一种集成电路封装，其包括衬底，引线框和位于衬底和引线框之间的一个或多个集成电路。 多个电气部件可以附接到基板的一侧或两侧。 集成电路的主动面与基板电连接并物理连接。 集成电路的背面安装在引线框架的管芯附着垫上。 引线框架包括物理附接到基板并与其电耦合的多个引线。 成型材料封装基板，引线框架和集成电路的部分。 还描述了形成这种包装的方法。

公开(公告)号：US08779566B2

公开(公告)日：2014-07-15

申请号：US13210135

申请日：2011-08-15

Applicant: Lee Han Meng @ Eugene Lee ,  Yien Sien Khoo ,  Kuan Yee Woo

Inventor： Lee Han Meng @ Eugene Lee ,  Yien Sien Khoo ,  Kuan Yee Woo

IPC: H01L23/495 ,  H01L23/522 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01L23/495 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49589 ,  H01L2224/16

Abstract: In one aspect of the invention, an integrated circuit package is described. The integrated circuit package includes a substrate formed from a dielectric material that includes multiple electrical contacts and conductive paths. An upper lead frame is attached with and underlies the substrate. The upper lead frame is electrically connected with at least one of the contacts on the substrate. The active surface of an integrated circuit die is electrically and physically coupled to the upper lead frame through multiple electrical connectors. A lower lead frame may be attached with the back surface of the integrated circuit die. A passive device is positioned on and electrically connected with one of the contacts on the substrate and/or the upper lead frame.

Abstract translation: 在本发明的一个方面，描述了集成电路封装。 集成电路封装包括由包括多个电触点和导电路径的介电材料形成的基板。 上引线框架与基板相连并且在其下方。 上引线框架与基板上的至少一个触点电连接。 集成电路管芯的有源表面通过多个电连接器电性和物理耦合到上引线框架。 下引线框架可以与集成电路管芯的背面连接。 无源器件位于衬底和/或上引线框架上的触点之一上并与之电连接。

公开(公告)号：US20130127029A1

公开(公告)日：2013-05-23

申请号：US13300189

申请日：2011-11-18

Applicant: Lee Han Meng @ Eugene LEE ,  Wei Fen Sueann LIM ,  Chen Seong CHUA ,  Kooi Choon OOI

Inventor： Lee Han Meng @ Eugene LEE ,  Wei Fen Sueann LIM ,  Chen Seong CHUA ,  Kooi Choon OOI

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/15747 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00

Abstract: A leadframe, device package, and mode of construction configured to attain a thin profile and improved thermal performance. Leadframes of this invention include a raised die attachment pad arrange above distal ends of leadframe leads. A package will further include a die electrically coupled with an underside surface of the raised die attachment pad, in one example, using ball bonds, the whole sealed in an encapsulant that exposed a bottom portion of the die and a portion of a lead. Two leadframe stacks of such packages are also disclosed as are methods of manufacture.

Abstract translation: 引线框架，器件封装和结构模式，可以实现薄型化和改善热性能。 本发明的引线框架包括在引线框引线的远端上方布置的凸起的芯片附接垫。 在一个示例中，包装还将包括与凸起的芯片附接垫的下表面电耦合的模具，其使用球形接合，整体密封在暴露模具的底部部分和引线的一部分的密封剂中。 还公开了这种包装的两个引线框架堆叠，如制造方法。

公开(公告)号：US20120080781A1

公开(公告)日：2012-04-05

申请号：US13324749

申请日：2011-12-13

Applicant: Felix C. LI ,  Yee Kim LEE ,  Peng Soon LIM ,  Terh Kuen YII ,  Lee Han Meng@Eugene LEE

Inventor： Felix C. LI ,  Yee Kim LEE ,  Peng Soon LIM ,  Terh Kuen YII ,  Lee Han Meng@Eugene LEE

IPC: H01L23/495

CPC classification number: H01L23/49551 ,  H01L23/49503 ,  H01L23/49562 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. The leadframe having an “up-set” bonding pad arranged with a bonding support for supporting a plurality of wire bonds and a large mold flow aperture in the up-set bonding pad. The package encapsulated in a mold material that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.

Abstract translation: 一种半导体封装，其被配置为获得薄型和低湿度敏感性。 本发明的封装可以包括安装在引线框架的管芯附接部位上的半导体管芯，并且还与围绕管芯附接焊盘布置并沿所述第一方向延伸的多个细长I / O引线连接。 该引线框架具有一个“上部”焊盘，其布置有用于支撑多个引线接合的接合支撑件和在上压接焊盘中的大的模具流动孔。 该包装封装在模制材料中，该模具材料围绕粘合支撑件并流过大型模具流动孔径以建立良好的支撑的线接合，使得该包装具有低湿度敏感性。

公开(公告)号：US08097934B1

公开(公告)日：2012-01-17

申请号：US12191158

申请日：2008-08-13

Applicant: Felix C. Li ,  Yee Kim Lee ,  Peng Soon Lim ,  Terh Kuen Yii ,  Lee Han Meng@Eugene Lee

Inventor： Felix C. Li ,  Yee Kim Lee ,  Peng Soon Lim ,  Terh Kuen Yii ,  Lee Han Meng@Eugene Lee

IPC: H01L23/495

CPC classification number: H01L23/49551 ,  H01L23/49503 ,  H01L23/49562 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A lead frame and package construction configured to attain a thin profile and low moisture sensitivity. Lead frames of this invention may include a die attach pad having a die attachment site and an elongate ground lead that extends from the die attach pad. The lead frame includes a plurality of elongate I/O leads arranged about the die attach pad and extending away from the die attach pad in at least two directions. An inventive lead frame features “up-set” bonding pads electrically connected with the die attach pad and arranged with a bonding surface for supporting a plurality of wire bonds. The bonding surfaces also constructed to define at least one mold flow aperture for each up-set bonding pad. A package incorporating the lead frame is further disclosed such that the package includes an encapsulant that surrounds the bonding support and flows through the mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity. Such packages can be constructed in single inline configuration, dual inline configuration, quad package configurations.

Abstract translation: 引线框架和封装结构，其构造为获得薄型和低湿度敏感性。 本发明的引线框架可以包括具有管芯附接位置的管芯附接垫和从管芯附接垫延伸的细长接地引线。 引线框架包括多个细长的I / O引线，其围绕管芯附接垫布置并且在至少两个方向上远离管芯附接垫延伸。 本发明的引线框架具有与芯片附接焊盘电连接的“上放置”焊盘，并布置有用于支撑多个引线键合的接合表面。 接合表面还被构造成为每个上定位焊盘限定至少一个模流通孔。 进一步公开了包括引线框架的封装，使得封装件包括密封剂，该密封剂围绕粘合支撑件并流过模具流动孔径以建立良好支撑的引线键合，使得封装具有低湿度敏感性。 这种封装可以采用单列直插式配置，双列直插式配置，四包装配置。

公开(公告)号：US20110140262A1

公开(公告)日：2011-06-16

申请号：US12635624

申请日：2009-12-10

Applicant: Lee Han Meng @ Eugene LEE ,  Kuan Yee WOO

Inventor： Lee Han Meng @ Eugene LEE ,  Kuan Yee WOO

IPC: H01L23/52 ,  H01L23/495 ,  H01L23/36 ,  H01L21/60

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/552 ,  H01L24/27 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/83192 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025

Abstract: An integrated circuit package is described that includes a substrate, a leadframe and one or more integrated circuits that are positioned between the substrate and the leadframe. Multiple electrical components may be attached to one or both sides of the substrate. The active face of the integrated circuit is electrically and physically connected to the substrate. The back side of the integrated circuit is mounted on a die attach pad of the leadframe. The leadframe includes multiple leads that are physically attached to and electrically coupled with the substrate. A molding material encapsulates portions of the substrate, the leadframe and the integrated circuit. Methods for forming such packages are also described.

Abstract translation: 描述了一种集成电路封装，其包括衬底，引线框和位于衬底和引线框之间的一个或多个集成电路。 多个电气部件可以附接到基板的一侧或两侧。 集成电路的主动面与基板电连接并物理连接。 集成电路的背面安装在引线框架的管芯附着垫上。 引线框架包括物理附接到基板并与其电耦合的多个引线。 成型材料封装基板，引线框架和集成电路的部分。 还描述了形成这种包装的方法。