SPEAKER MOUNTING ASSEMBLY
    1.
    发明公开

    公开(公告)号:US20240107209A1

    公开(公告)日:2024-03-28

    申请号:US18475483

    申请日:2023-09-27

    Inventor: Wesley SIU

    CPC classification number: H04R1/021 H04R1/025 H04R1/026 H04R2201/025

    Abstract: A speaker mounting assembly for mounting a speaker in multiple configurations, the speaker mounting assembly comprising a bracket having a substantially V-shaped profile, wherein the bracket comprises a first mounting plate and a second mounting plate meeting at a flattened vertex, wherein the flattened vertex forms a third mounting plate, and fixing apertures in each of the first, second and third mounting plates.

    Speaker system
    2.
    发明授权

    公开(公告)号:US11544033B2

    公开(公告)日:2023-01-03

    申请号:US17165109

    申请日:2021-02-02

    Inventor: Wesley Siu

    Abstract: A fixed speaker system comprising a speaker housing mountable in or to a ceiling, wall or floor; at least one speaker for outputting audio content, wherein each speaker comprises at least one speaker input and at least one speaker output; a processor configured to receive the or each speaker input and generate the or each speaker output; an amplifier coupled to the processor and configured to drive the speaker; a DC power input configured for direct electrical coupling with a mains power source; a power-over-ethernet (POE) interface module, comprising an interface housing that is removably connected to the speaker housing, wherein the module is configured to input power from a POE source to the DC power input.

    SPEAKER SYSTEM
    4.
    发明申请

    公开(公告)号:US20210247949A1

    公开(公告)日:2021-08-12

    申请号:US17165109

    申请日:2021-02-02

    Inventor: Wesley SIU

    Abstract: A fixed speaker system comprising a speaker housing mountable in or to a ceiling, wall or floor; at least one speaker for outputting audio content, wherein each speaker comprises at least one speaker input and at least one speaker output; a processor configured to receive the or each speaker input and generate the or each speaker output; an amplifier coupled to the processor and configured to drive the speaker; a DC power input configured for direct electrical coupling with a mains power source; a power-over-ethernet (POE) interface module, comprising an interface housing that is removably connected to the speaker housing, wherein the module is configured to input power from a POE source to the DC power input.

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