公开(公告)号：US20230228626A1

公开(公告)日：2023-07-20

申请号：US18120927

申请日：2023-03-13

Applicant: MEGA AI Lab Co., Ltd.

Inventor： Youngtack SHIM ,  Dongha J. YANG

IPC: G01J5/48 ,  G06T7/60 ,  H04N23/20

CPC classification number: G01J5/485 ,  G06T7/60 ,  H04N23/20 ,  G01J2005/0077

Abstract: The disclosure relates to various temperature reference systems capable of generating at least one reference temperature. Such systems may provide the reference temperature to an IR camera which may then use the reference temperature in measuring a temperature of a target who has an unknown temperature. More particularly, this disclosure discloses various temperature reference units or their pink bodies of which temperature is to be detected and used as the reference temperature by the IR camera, and various configurations and methods of preventing or minimizing inherent errors which are caused by thermal conduction as well as thermal convection on and across such a temperature reference unit. This disclosure also relates to various methods of fabricating, installing, and using the pink bodies, temperature reference units, and temperature reference systems, in conjunction with an IR camera, a processor or other thermal imaging equipment.

公开(公告)号：US20210335012A1

公开(公告)日：2021-10-28

申请号：US17154510

申请日：2021-01-21

Applicant: MEGA AI Lab Co., Ltd.

Inventor： Youngtack SHIM ,  Dongha J. YANG

IPC: G06T7/90 ,  G06F1/20 ,  H04N5/33

Abstract: The disclosure relates to various temperature reference systems capable of generating at least one reference temperature. Such systems may provide the reference temperature to an IR camera which may then use the reference temperature in measuring a temperature of a target who has an unknown temperature. More particularly, this disclosure discloses various temperature reference units or their pink bodies of which temperature is to be detected and used as the reference temperature by the IR camera, and various configurations and methods of preventing or minimizing inherent errors which are caused by thermal conduction as well as thermal convection on and across such a temperature reference unit. This disclosure also relates to various methods of fabricating, installing, and using the pink bodies, temperature reference units, and temperature reference systems, in conjunction with an IR camera, a processor or other thermal imaging equipment.