公开(公告)号：US3996574A

公开(公告)日：1976-12-07

申请号：US552267

申请日：1975-02-24

Applicant: Andrew Henry Bobeck ,  Bruce Hamilton McGahey ,  William Martin Melbert, Jr. ,  Terry Brice Prince ,  Martin James Stevenson

Inventor： Andrew Henry Bobeck ,  Bruce Hamilton McGahey ,  William Martin Melbert, Jr. ,  Terry Brice Prince ,  Martin James Stevenson

IPC: G11C11/14 ,  G11C19/08 ,  H01F10/06

CPC classification number: H01F10/06 ,  G11C19/085

Abstract: A dual-in-line package (DIP) for a bubble memory is achieved by mounting the bubble chip in a cantilevered position in the plane of a rigid conductor arrangement which is interconnected to a DIP base. The lead track arrangement forms a rigid support for the chip fixing the chip in a position for receiving the orthogonal coils which characteristically supply the rotating field for field-access bubble operation.

Abstract translation: 通过将气泡芯片安装在与DIP基座互连的刚性导体装置的平面中的悬臂位置来实现用于气泡存储器的双列直插封装（DIP）。 引导轨布置形成用于将芯片固定在用于接收正交线圈的位置的芯片的刚性支撑，其特征在于提供用于场接触气泡操作的旋转场。