公开(公告)号：US09943930B2

公开(公告)日：2018-04-17

申请号：US14749703

申请日：2015-06-25

Applicant: Koninklijke Philips N.V. ,  Mat-Tech B.V.

Inventor： Nicolaas Johannes Antonius Van Veen ,  Mohammad Hossain Biglari

IPC: B23K1/20 ,  B23K35/26 ,  B23K35/24 ,  B23K35/28 ,  B23K35/02 ,  H05K3/34 ,  H01L23/00 ,  H05K1/14

CPC classification number: B23K35/262 ,  B23K35/0222 ,  B23K35/24 ,  B23K35/26 ,  B23K35/264 ,  B23K35/28 ,  B23K35/286 ,  H01L24/29 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/14 ,  H05K3/3484 ,  H05K2201/0215 ,  Y10T428/12028 ,  Y10T428/1216 ,  Y10T428/24826 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.