Method for the binning of radiation-emitting, optoelectronic semiconductor components
    1.
    发明授权
    Method for the binning of radiation-emitting, optoelectronic semiconductor components 有权
    辐射发射,光电子半导体元件分组的方法

    公开(公告)号:US08531668B2

    公开(公告)日:2013-09-10

    申请号:US12959343

    申请日:2010-12-02

    CPC classification number: G01J3/46 G01J3/462 G01J3/50 G01J3/505

    Abstract: A method for the binning of a radiation-emitting, optoelectronic semiconductor component (20) is specified, comprising the following steps: providing a radiation-emitting, optoelectronic semiconductor component (20), determining the color locus (8) of the light emitted by the radiation-emitting, optoelectronic semiconductor component (20) during operation, classifying the radiation-emitting, optoelectronic semiconductor component (20) into a predefined color locus range (6) comprising the color locus determined.

    Abstract translation: 规定了辐射发射的光电子半导体部件(20)的合并方法,包括以下步骤:提供辐射发射光电子半导体部件(20),确定发射的光电子半导体部件(20)发出的光的颜色轨迹(8) 在操作期间的辐射发射光电子半导体部件(20)将辐射发射的光电子半导体部件(20)分类成包括确定的颜色轨迹的预定颜色轨迹范围(6)。

    Method for the Binning of Radiation-Emitting, Optoelectronic Semiconductor Components
    2.
    发明申请
    Method for the Binning of Radiation-Emitting, Optoelectronic Semiconductor Components 有权
    辐射发射分光光度半导体元件的方法

    公开(公告)号:US20110157589A1

    公开(公告)日:2011-06-30

    申请号:US12959343

    申请日:2010-12-02

    CPC classification number: G01J3/46 G01J3/462 G01J3/50 G01J3/505

    Abstract: A method for the binning of a radiation-emitting, optoelectronic semiconductor component (20) is specified, comprising the following steps: providing a radiation-emitting, optoelectronic semiconductor component (20), determining the color locus (8) of the light emitted by the radiation-emitting, optoelectronic semiconductor component (20) during operation, classifying the radiation-emitting, optoelectronic semiconductor component (20) into a predefined color locus range (6) comprising the color locus determined.

    Abstract translation: 规定了辐射发射的光电子半导体部件(20)的合并方法,包括以下步骤:提供辐射发射光电子半导体部件(20),确定发射的光电子半导体部件(20)发出的光的颜色轨迹(8) 在操作期间的辐射发射光电子半导体部件(20)将辐射发射的光电子半导体部件(20)分类成包括确定的颜色轨迹的预定颜色轨迹范围(6)。

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