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公开(公告)号：US20120234462A1
公开(公告)日：2012-09-20
申请号：US13418467
申请日：2012-03-13
Applicant: Togo MATSUI , Minoru DOOKA , Hiroyoshi TAKASHIMA , Kenichi OKAJIMA
Inventor： Togo MATSUI , Minoru DOOKA , Hiroyoshi TAKASHIMA , Kenichi OKAJIMA
CPC classification number: H01L21/64 , B26D1/04 , B32B37/00 , B32B37/02 , B32B37/10 , B32B37/12 , B32B37/16 , B32B38/0004 , B32B38/04 , B32B2038/042 , C04B35/00 , C04B35/468 , C04B37/00 , C04B37/006 , C04B2237/12 , C04B2237/32 , H01G4/06 , H01G4/12 , H01G4/30 , H01G4/308 , H01G13/00 , H05K3/0058 , Y10T156/1052 , Y10T156/1348
Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.
Abstract translation: 在单块陶瓷电子部件的制造方法中，在切割母块之后获得的排列成行和列方向的多个绿色芯片彼此间隔开，然后翻滚，从而均匀地使每个 绿色芯片是开放的表面。 此后，将粘合剂施加到侧表面。 然后，通过将侧面陶瓷生片放置在固定弹性体上，将绿色芯片的侧面压靠在侧面陶瓷生片上，将侧面陶瓷生片冲压并粘贴在侧面。
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公开(公告)号：US07874068B2
公开(公告)日：2011-01-25
申请号：US12631966
申请日：2009-12-07
Applicant: Minoru Dooka , Kazunori Kunimoto , Katsunori Ogata , Naohiro Yamada
Inventor： Minoru Dooka , Kazunori Kunimoto , Katsunori Ogata , Naohiro Yamada
IPC: H05K3/30
CPC classification number: H01G13/006 , H01G4/232 , H01G4/30 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49144 , Y10T156/1092
Abstract: A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.
Abstract translation: 电子芯片部件的制造方法包括以下步骤：通过将糊剂涂布在电子部件主体的第一端面上形成第一糊剂层，第二端面粘贴在具有粘合剂表面的基板上，并干燥该糊料，转动 电子部件主体180度，以便在滑动件与电子部件主体的第一端面接触的状态下，通过相对于基板滑动滑块来将电子部件主体的第一端面粘贴到基板上 通过将糊剂涂覆到电子部件主体的第二端面上并干燥该糊料，并焙烧第一和第二糊料层，形成第二糊剂层。
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公开(公告)号：US20110088840A1
公开(公告)日：2011-04-21
申请号：US12980382
申请日：2010-12-29
Applicant: Minoru DOOKA , Kazunori KUNIMOTO , Katsunori OGATA , Naohiro YAMADA
Inventor： Minoru DOOKA , Kazunori KUNIMOTO , Katsunori OGATA , Naohiro YAMADA
IPC: B32B37/00
CPC classification number: H01G13/006 , H01G4/232 , H01G4/30 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49144 , Y10T156/1092
Abstract: A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.
Abstract translation: 电子芯片部件的制造方法包括以下步骤：通过将糊剂涂布在电子部件主体的第一端面上形成第一糊剂层，第二端面粘贴在具有粘合剂表面的基板上，并干燥该糊料，转动 电子部件主体180度，以便在滑动件与电子部件主体的第一端面接触的状态下，通过相对于基板滑动滑块来将电子部件主体的第一端面粘贴到基板上 通过将糊剂涂覆到电子部件主体的第二端面上并干燥该糊料，并焙烧第一和第二糊料层，形成第二糊剂层。
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Patent Agency Ranking
公开(公告)号：US08839510B2
公开(公告)日：2014-09-23
申请号：US12980382
申请日：2010-12-29
Applicant: Minoru Dooka , Kazunori Kunimoto , Katsunori Ogata , Naohiro Yamada
Inventor： Minoru Dooka , Kazunori Kunimoto , Katsunori Ogata , Naohiro Yamada
CPC classification number: H01G13/006 , H01G4/232 , H01G4/30 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49144 , Y10T156/1092
Abstract: A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.
Abstract translation: 电子芯片部件的制造方法包括以下步骤：通过将糊剂涂布在电子部件主体的第一端面上形成第一糊剂层，第二端面粘贴在具有粘合剂表面的基板上，并干燥该糊料，转动 电子部件主体180度，以便在滑动件与电子部件主体的第一端面接触的状态下，通过相对于基板滑动滑块来将电子部件主体的第一端面粘贴到基板上 通过将糊剂涂覆到电子部件主体的第二端面上并干燥该糊料，并焙烧第一和第二糊料层，形成第二糊剂层。
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公开(公告)号：US08584332B2
公开(公告)日：2013-11-19
申请号：US13418464
申请日：2012-03-13
Applicant: Togo Matsui , Minoru Dooka , Hiroyoshi Takashima , Kenichi Okajima
Inventor： Togo Matsui , Minoru Dooka , Hiroyoshi Takashima , Kenichi Okajima
IPC: H01G7/00
CPC classification number: H01G4/30 , H01G4/002 , H01G4/12 , H01G13/00 , Y10T29/43 , Y10T29/435 , Y10T29/5157
Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.
Abstract translation: 在单块陶瓷电子部件的制造方法中，通过使用涂布板将陶瓷膏施加到在切割母体块之后获得的沿行和列方向排列的多个绿色芯片中的每一个的侧面。 在涂布工序中，通过使绿色芯片和涂布板沿着侧面延伸的方向相对移动，同时将绿色芯片与涂布板分离，将陶瓷浆料转移到侧面， 陶瓷浆料连接绿色芯片和应用板。
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公开(公告)号：US08795454B2
公开(公告)日：2014-08-05
申请号：US13418467
申请日：2012-03-13
Applicant: Togo Matsui , Minoru Dooka , Hiroyoshi Takashima , Kenichi Okajima
Inventor： Togo Matsui , Minoru Dooka , Hiroyoshi Takashima , Kenichi Okajima
CPC classification number: H01L21/64 , B26D1/04 , B32B37/00 , B32B37/02 , B32B37/10 , B32B37/12 , B32B37/16 , B32B38/0004 , B32B38/04 , B32B2038/042 , C04B35/00 , C04B35/468 , C04B37/00 , C04B37/006 , C04B2237/12 , C04B2237/32 , H01G4/06 , H01G4/12 , H01G4/30 , H01G4/308 , H01G13/00 , H05K3/0058 , Y10T156/1052 , Y10T156/1348
Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.
Abstract translation: 在单块陶瓷电子部件的制造方法中，在切割母块之后获得的排列成行和列方向的多个绿色芯片彼此间隔开，然后翻滚，从而均匀地使每个 绿色芯片是开放的表面。 此后，将粘合剂施加到侧表面。 然后，通过将侧面陶瓷生片放置在固定弹性体上，将绿色芯片的侧面压靠在侧面陶瓷生片上，将侧面陶瓷生片冲压并粘贴在侧面。
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公开(公告)号：US20120233828A1
公开(公告)日：2012-09-20
申请号：US13418464
申请日：2012-03-13
Applicant: Togo MATSUI , Minoru DOOKA , Hiroyoshi TAKASHIMA , Kenichi OKAJIMA
Inventor： Togo MATSUI , Minoru DOOKA , Hiroyoshi TAKASHIMA , Kenichi OKAJIMA
CPC classification number: H01G4/30 , H01G4/002 , H01G4/12 , H01G13/00 , Y10T29/43 , Y10T29/435 , Y10T29/5157
Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.
Abstract translation: 在单块陶瓷电子部件的制造方法中，通过使用涂布板将陶瓷膏施加到在切割母体块之后获得的沿行和列方向排列的多个绿色芯片中的每一个的侧面。 在涂布工序中，通过使绿色芯片和涂布板沿着侧面延伸的方向相对移动，同时将绿色芯片与涂布板分离，将陶瓷浆料转移到侧面， 陶瓷浆料连接绿色芯片和应用板。
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公开(公告)号：US20100146778A1
公开(公告)日：2010-06-17
申请号：US12631966
申请日：2009-12-07
Applicant: Minoru DOOKA , Kazunori KUNIMOTO , Katsunori OGATA , Naohiro YAMADA
Inventor： Minoru DOOKA , Kazunori KUNIMOTO , Katsunori OGATA , Naohiro YAMADA
IPC: H05K3/30
CPC classification number: H01G13/006 , H01G4/232 , H01G4/30 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49144 , Y10T156/1092
Abstract: A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.
Abstract translation: 电子芯片部件的制造方法包括以下步骤：通过将糊剂涂布在电子部件主体的第一端面上形成第一糊剂层，第二端面粘贴在具有粘合剂表面的基板上，并干燥该糊料，转动 电子部件主体180度，以便在滑动件与电子部件主体的第一端面接触的状态下，通过相对于基板滑动滑块来将电子部件主体的第一端面粘贴到基板上 通过将糊剂涂覆到电子部件主体的第二端面上并干燥该糊料，并焙烧第一和第二糊料层，形成第二糊剂层。
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