公开(公告)号：US5114066A

公开(公告)日：1992-05-19

申请号：US616035

申请日：1990-11-20

Applicant: Gonzalo Amador ,  Randy O. Burrows ,  George C. Epp

Inventor： Gonzalo Amador ,  Randy O. Burrows ,  George C. Epp

IPC: B23K20/00

CPC classification number: H01L24/85 ,  B23K20/007 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/19043

Abstract: A voice coil actuated wire tensioner is used on a wire bonder in conjunction with a primary wire clamp to provide accurate control of the bond wire and looping of the bond wire between ball bonding of one end of a bond wire and stitch bonding of the other end of the bond wire.

Abstract translation: 在线接合器上使用音圈致动线张紧器与主线夹连接，以在接合线的一端的球接合和另一端的针脚接合之间提供对接合线的接合线的精确控制和接合线的环绕 的电线。

公开(公告)号：US5215940A

公开(公告)日：1993-06-01

申请号：US474911

申请日：1990-02-05

Applicant: John W. Orcutt ,  Randy O. Burrows

Inventor： John W. Orcutt ,  Randy O. Burrows

IPC: B23K20/00 ,  H01L21/603

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K20/007 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  B23K2201/40 ,  H01L2224/05554 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082

Abstract: A method for looping the bond wires used to connected a semiconductor bond pad to a lead frame finger during bonding to improve the clearance between adjacent bond wires.

Abstract translation: 用于在接合期间使用于将半导体接合焊盘连接到引线框架指状物的接合线的环路的方法，以改善相邻接合线之间的间隙。