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公开(公告)号:US10083771B2
公开(公告)日:2018-09-25
申请号:US14753174
申请日:2015-06-29
Applicant: Tower Semiconductor Ltd. , RedCat Devices Srl
Inventor: Yakov Roizin , Cristiano Calligaro
IPC: G21H1/06 , H01L27/142 , G11C11/417 , G11C5/14 , H01L27/06
CPC classification number: G21H1/06 , G11C5/14 , G11C11/417 , H01L27/0617 , H01L27/142
Abstract: An electronic device is proposed. The electronic device comprises: at least one electronic component formed in a chip of semiconductor material; at least one radioisotope power source unit comprising a radioactive material. The at least one radioisotope power source unit is embedded in the chip of semiconductor material together with the at least one electronic component. Moreover, the at least one radioisotope power source unit is arranged for providing electric power to said at least one electronic component by absorbing particles emitted by said radioactive material comprised in the least one radioisotope power source unit.
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2.
公开(公告)号:US20160379729A1
公开(公告)日:2016-12-29
申请号:US14753174
申请日:2015-06-29
Applicant: Tower Semiconductor Ltd. , RedCat Devices Srl
Inventor: Yakov Roizin , Cristiano Calligaro
IPC: G21H1/06 , G11C11/417 , H01L31/18 , H01L31/115 , H01L27/142
CPC classification number: G21H1/06 , G11C5/14 , G11C11/417 , H01L27/0617 , H01L27/142
Abstract: An electronic device is proposed. The electronic device comprises: at least one electronic component formed in a chip of semiconductor material; at least one radioisotope power source unit comprising a radioactive material. The at least one radioisotope power source unit is embedded in the chip of semiconductor material together with the at least one electronic component. Moreover, the at least one radioisotope power source unit is arranged for providing electric power to said at least one electronic component by absorbing particles emitted by said radioactive material comprised in the least one radioisotope power source unit.
Abstract translation: 提出了一种电子设备。 电子设备包括:形成在半导体材料芯片中的至少一个电子部件; 至少一个包括放射性物质的放射性同位素电源单元。 所述至少一个放射性同位素电源单元与所述至少一个电子部件一起嵌入到所述半导体材料的芯片中。 此外,所述至少一个放射性同位素电源单元被布置成通过吸收由所述至少一个放射性同位素电源单元中包含的所述放射性物质发射的颗粒来向所述至少一个电子部件提供电力。
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