公开(公告)号：US20090029065A1

公开(公告)日：2009-01-29

申请号：US11994199

申请日：2006-02-08

Applicant: Nobuto Terada ,  Ritsuko Yoshihara ,  Yorishige Matsuba

Inventor： Nobuto Terada ,  Ritsuko Yoshihara ,  Yorishige Matsuba

IPC: B01J19/12 ,  B05D5/12

CPC classification number: C23C18/1608 ,  C23C18/2006 ,  C23C18/204 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/30 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/185 ,  H05K3/387 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2203/302

Abstract: The present invention provides a novel approach for selectively forming an electroless plated metal layer which enables selective formation of an electroless plated metal layer in an intended shape of the circuit pattern on a surface of a non-conductive substrate, without using a plating mask layer, in a form that a surface of an adhesive layer and the plated metal layer are in direct contact with each other. In the method, an adhesive layer of a curable binder resin is provided to a surface of a non-conductive substrate on which metal fine particles having an average particle size of 1 to 200 nm are closely exposed at a high area density, and an energy beam is irradiated to a region corresponding to the shape of a circuit pattern, and the non-conductive substrate is subjected to a deforming process and then to electroless plating, so that an electroless plated metal layer is selectively formed only to the energy beam irradiated region which is fixedly attached to the surface of the non-conductive substrate via the adhesive layer with a high adhesion.

Abstract translation: 本发明提供一种选择性地形成化学镀金属层的新颖方法，其能够在不使用电镀掩模层的情况下，在非导电性基板的表面上选择性地形成电路图案的预期形状的无电镀金属层， 其形式是粘合剂层的表面和电镀金属层彼此直接接触。 在该方法中，在平均粒径为1〜200nm的金属微粒以高面积密度紧密地暴露的非导电性基材的表面上设置可固化粘合剂树脂的粘合剂层， 将光束照射到与电路图案的形状对应的区域，对非导电性基板进行变形处理，然后进行化学镀，使得无电镀金属层仅选择性地形成到能量束照射区域 其通过具有高粘合力的粘合剂层固定地附接到非导电基板的表面。