公开(公告)号：US09706693B2

公开(公告)日：2017-07-11

申请号：US13750184

申请日：2013-01-25

Applicant: Christopher Hunt ,  John Lewison ,  Robin Pittson

Inventor： Christopher Hunt ,  John Lewison ,  Robin Pittson

IPC: H05K1/00 ,  H05K13/00 ,  H05K3/32 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H05K3/00

CPC classification number: H05K13/00 ,  H05K1/0277 ,  H05K1/181 ,  H05K3/0058 ,  H05K3/22 ,  H05K3/321 ,  H05K2201/2009 ,  H05K2203/0769 ,  H05K2203/0776 ,  H05K2203/088 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/10 ,  Y10T156/1111 ,  Y10T156/1153

Abstract: An electronic circuit assembly comprises a substrate and circuit components attached to the substrate by means of an electrically conductive adhesive, wherein the adhesive is releasable under predetermined release conditions, whereby to enable the circuit components to be removed from the substrate for recovery or re-use.

公开(公告)号：US20130188323A1

公开(公告)日：2013-07-25

申请号：US13750184

申请日：2013-01-25

Applicant: Christopher Hunt ,  John Lewison ,  Robin Pittson

Inventor： Christopher Hunt ,  John Lewison ,  Robin Pittson

IPC: H05K13/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K13/00 ,  H05K1/0277 ,  H05K1/181 ,  H05K3/0058 ,  H05K3/22 ,  H05K3/321 ,  H05K2201/2009 ,  H05K2203/0769 ,  H05K2203/0776 ,  H05K2203/088 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/10 ,  Y10T156/1111 ,  Y10T156/1153

Abstract: An electronic circuit assembly comprises a substrate and circuit components attached to the substrate by means of an electrically conductive adhesive, wherein the adhesive is releasable under predetermined release conditions, whereby to enable the circuit components to be removed from the substrate for recovery or re-use.

Abstract translation: 电子电路组件包括基板和通过导电粘合剂附接到基板的电路部件，其中粘合剂在预定的释放条件下可释放，由此使电路部件能够从基板移除以便回收或重新使用 。