公开(公告)号：US20080036481A1

公开(公告)日：2008-02-14

申请号：US11880960

申请日：2007-07-24

Applicant: Chee Fong ,  Harjit Singh ,  Jelena Larsen ,  Raul Rodriquez-Montanez ,  Rodney Amen

Inventor： Chee Fong ,  Harjit Singh ,  Jelena Larsen ,  Raul Rodriquez-Montanez ,  Rodney Amen

IPC: G01R31/02 ,  H01R9/00

CPC classification number: G01R31/2818 ,  H05K1/0268 ,  H05K3/0094 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2203/043 ,  H05K2203/1394 ,  Y10T29/49151

Abstract: A circuit board with vias that are suitable for use as test pads can be made according to a method whereby a first end of a via is blocked prior to heating solder paste that covers the opposite end of the via. As a result, air is trapped in the via when the solder paste is heated, which prevents melted solder paste from flowing in. Instead, the solder paste forms a dome shaped test pad over the via, which facilitates contact with the test probe. When applied to OSP circuit boards, the result is an OSP board with at least via that has a blocking material at one end and a solder dome over the opposite end.

Abstract translation: 可以根据以下方法制造适合用作测试焊盘的通孔的电路板，其中在加热覆盖通孔的相对端的焊膏之前，通孔的第一端被阻挡。 结果，当焊膏被加热时，空气被捕获在通孔中，这防止熔化的焊膏流入。替代地，焊膏在通孔上形成圆顶形的测试焊盘，这便于与测试探针接触。 当应用于OSP电路板时，其结果是具有至少通孔的OSP板，其一端具有阻挡材料，在另一端具有焊料圆顶。

公开(公告)号：US20070068701A1

公开(公告)日：2007-03-29

申请号：US11235728

申请日：2005-09-26

Applicant: Chee Fong ,  Harjit Singh ,  Jelena Larsen ,  Raul Rodriguez-Montanez ,  Rodney Amen

Inventor： Chee Fong ,  Harjit Singh ,  Jelena Larsen ,  Raul Rodriguez-Montanez ,  Rodney Amen

IPC: H05K1/11 ,  H01R12/04

CPC classification number: G01R31/2818 ,  H05K1/0268 ,  H05K3/0094 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2203/043 ,  H05K2203/1394 ,  Y10T29/49151

Abstract: A circuit board with vias that are suitable for use as test pads can be made according to a method whereby a first end of a via is blocked prior to heating solder paste that covers the opposite end of the via. As a result, air is trapped in the via when the solder paste is heated, which prevents melted solder paste from flowing in. Instead, the solder paste forms a dome shaped test pad over the via, which facilitates contact with the test probe. When applied to OSP circuit boards, the result is an OSP board with at least via that has a blocking material at one end and a solder dome over the opposite end.

Abstract translation: 可以根据以下方法制造适合用作测试焊盘的通孔的电路板，其中在加热覆盖通孔的相对端的焊膏之前，通孔的第一端被阻挡。 结果，当焊膏被加热时，空气被捕获在通孔中，这防止熔化的焊膏流入。替代地，焊膏在通孔上形成圆顶形的测试焊盘，这便于与测试探针接触。 当应用于OSP电路板时，其结果是具有至少通孔的OSP板，其一端具有阻挡材料，在另一端具有焊料圆顶。