公开(公告)号：US20140304977A1

公开(公告)日：2014-10-16

申请号：US14356209

申请日：2012-08-31

Applicant: SHENZHEN SUNTAK MULTILAYER PCB CO., LTD.

Inventor： Jianyuan Song ,  Weihong Peng ,  Pingping Xie ,  Dong Liu

IPC: H05K3/00

CPC classification number: H05K3/00 ,  H05K1/0269 ,  H05K3/0017 ,  H05K3/0044 ,  H05K3/0047 ,  H05K3/0073 ,  H05K3/12 ,  H05K3/188 ,  H05K3/3452 ,  H05K3/42 ,  H05K3/425 ,  H05K3/428 ,  H05K3/4623 ,  H05K3/4629 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2203/0315 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49179

Abstract: A fabrication process of a stepped circuit board, comprises the following steps of: A) cutting a circuit board substrate, printing patterns on an inner layer thereof, performing etching, stepped groove grinding, washer milling, brownification and lamination processing on the inner layer, and then drilling holes on an outer layer thereof; B) depositing copper on the outer layer of the circuit board substrate with drilled holes, and then electroplating the entire circuit board substrate; C) performing pattern transfer; D) performing pattern copper plating on the circuit board substrate, and grinding the shape of a connecting piece (SET) on the circuit board substrate, and then etching the outer layer; E) printing a solder mask and texts in a silk-screen manner; F) depositing nickel immersion gold on the entire substrate, then printing characters in a silk-screen manner; and G) testing and inspecting the electrical performance and appearance of a finished board.

Abstract translation: 步进电路板的制造工艺包括以下步骤：A）切割电路板基板，在其内层上印刷图案，对内层进行蚀刻，阶梯槽研磨，垫片研磨，褐化和层压处理， 然后在其外层上钻孔; B）在钻孔的电路板基板的外层上沉积铜，然后电镀整个电路板基板; C）执行模式转移; D）在电路板基板上进行图案镀铜，并研磨电路板基板上的连接件（SET）的形状，然后蚀刻外层; E）以丝网印刷方式印刷焊接面罩和文字; F）在整个基板上沉积镍浸金，然后以丝网印刷方式印刷字符; 和G）测试和检查成品板的电气性能和外观。