公开(公告)号：US12243730B2

公开(公告)日：2025-03-04

申请号：US18020017

申请日：2021-06-25

Applicant: SINGULUS TECHNOLOGIES AG

Inventor： Peter Weipert

IPC: H01J37/34 ,  C23C14/34

Abstract: The present invention relates to a slit diaphragm, a slit diaphragm system comprising at least two slit diaphragms arranged adjacent to each other and to a coating module and coating facility comprising a slit diaphragm.

公开(公告)号：US11062929B2

公开(公告)日：2021-07-13

申请号：US16223014

申请日：2018-12-17

Applicant: SINGULUS TECHNOLOGIES AG

Inventor： Jens Eckstein ,  Peter Reustle ,  Mathias Hohlmayer ,  Uemit Seyhan ,  Benjamin Mandlmeier ,  Michael Reising ,  Stefan Kempf ,  Jan-Christof Jacobi

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/306 ,  H01L21/02 ,  B05C1/02

Abstract: A device for treating substrates by a treating liquid has at least one rotatably supported support roller which a substrate to be treated rests on during operation. The support roller has a hollow cylinder having a porous rigid material which the substrate to be treated rests on during operation. The device is configured to deliver, during operation, treating liquid via the interior of the hollow cylinder of the at least one support roller through the porous rigid material to the external surface of the hollow cylinder in order to treat at least one surface of the substrate by the treating liquid. The device is configured to treat several substrates in the form of plate-shaped separate wafers arranged one behind the other and/or next to one another in the device, by the treating liquid and to transport the substrates in a transport plane during the treatment.

公开(公告)号：US20190211446A1

公开(公告)日：2019-07-11

申请号：US16323962

申请日：2017-06-27

Applicant: Singulus Technologies AG

Inventor： Alexey IVANOV ,  Andreas KLEPL ,  Johannes RICHTER

IPC: C23C16/458 ,  C23C16/455 ,  C23C16/46 ,  C23C16/52 ,  H01J37/32

CPC classification number: C23C16/52 ,  C23C16/45565 ,  C23C16/4557 ,  C23C16/45574 ,  C23C16/4584 ,  C23C16/46 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/32522 ,  H01J37/32715 ,  H01J37/32724

Abstract: A system and a corresponding method for simultaneous rotation and levitation of a substrate during deposition and/or etching of the substrate are disclosed. The system comprises a carrier located below the substrate, wherein the carrier comprises at least two gas inlets to provide gas to a bottom surface of the substrate to levitate the substrate above the carrier. The system further comprises at least one holding member connected to the carrier and being configured to restrict horizontal drifting of the substrate.

公开(公告)号：US20240339354A1

公开(公告)日：2024-10-10

申请号：US18294883

申请日：2022-07-15

Applicant: SINGULUS TECHNOLOGIES AG

Inventor： Sergiy BORODIN ,  Andreas LUDWIG

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68785 ,  H01L21/67098

Abstract: the present invention relates to a spacer device for a heating system for heating large-area substrates, a heating system for heating large-area substrates, and a method for heating large-area substrates.

公开(公告)号：US11597998B2

公开(公告)日：2023-03-07

申请号：US16767743

申请日：2018-11-28

Applicant: SINGULUS TECHNOLOGIES AG

Inventor： Bernhard Cord ,  Michael Reising ,  Dieter Scherger

IPC: C23C14/56 ,  C23C14/26 ,  C23C14/50

Abstract: A vacuum lock for a vacuum coating plant comprises a chamber for receiving a substrate carrier, wherein the chamber comprises a first and a second inner surface. A conveyor is configured for conveying the substrate carrier. The vacuum lock comprises a flow channel assembly for evacuating and venting the chamber, the flow channel assembly being configured to cause a gas flow between both the first inner surface and a first substrate carrier surface facing the first inner surface and between the second inner surface and a second substrate carrier surface facing the second inner surface. The substrate carrier can be positioned between the first and the second inner surfaces such that a ratio of a first distance between the first inner surface and the first substrate carrier surface to a length (L) of the substrate carrier is smaller than 0.1, and a ratio of a second distance between the second inner surface and the second substrate carrier surface to a length (L) of the substrate carrier is smaller than 0.1.

公开(公告)号：US20210189559A1

公开(公告)日：2021-06-24

申请号：US17252456

申请日：2019-03-20

Applicant: SINGULUS TECHNOLOGIES AG

Inventor： Oliver Hohn ,  Michael Reising ,  Johannes Grübler ,  Kurt Pietsch ,  Jörg Koch

IPC: C23C16/448 ,  G05D23/19 ,  B01B1/00 ,  C23C16/52

Abstract: The present invention is directed to a method and an apparatus for providing vapor for a discontinuous process.

公开(公告)号：US20200224306A1

公开(公告)日：2020-07-16

申请号：US16703950

申请日：2019-12-05

Applicant: Singulus Technologies AG

Inventor： Berthold OCKER ,  Wolfram MAASS ,  Oliver HOHN

IPC: C23C14/54 ,  C23C14/34 ,  G01B11/06

Abstract: The disclosure relates to a method of determining a velocity profile for the movement of a substrate to be coated relative to a coating source.

公开(公告)号：US20190122914A1

公开(公告)日：2019-04-25

申请号：US16223014

申请日：2018-12-17

Applicant: SINGULUS TECHNOLOGIES AG

Inventor： Jens ECKSTEIN ,  Peter REUSTLE ,  Mathias HOHLMAYER ,  Uemit SEYHAN ,  Benjamin MANDLMEIER ,  Michael REISING ,  Stefan KEMPF ,  Jan-Christof JACOBI

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/306 ,  H01L21/02 ,  B05C1/02

Abstract: A device for treating substrates by a treating liquid has at least one rotatably supported support roller which a substrate to be treated rests on during operation. The support roller has a hollow cylinder having a porous rigid material which the substrate to be treated rests on during operation. The device is configured to deliver, during operation, treating liquid via the interior of the hollow cylinder of the at least one support roller through the porous rigid material to the external surface of the hollow cylinder in order to treat at least one surface of the substrate by the treating liquid. The device is configured to treat several substrates in the form of plate-shaped separate wafers arranged one behind the other and/or next to one another in the device, by the treating liquid and to transport the substrates in a transport plane during the treatment.

公开(公告)号：US20180195166A1

公开(公告)日：2018-07-12

申请号：US15116049

申请日：2015-12-11

Applicant: SINGULUS TECHNOLOGIES AG

Inventor： Stefan KEMPF ,  Holger SCHRAMM

IPC: C23C14/56 ,  B65G35/06

CPC classification number: C23C14/566 ,  B65G35/066 ,  C23C16/54

Abstract: A continuous system for transmitting accelerating forces and decelerating forces by interlocking, consisting of at least one carrier system having at least two connecting elements, a plurality of transport systems arranged one behind the other, wherein each transport system has a cam drum or cylindrical cam having a helical groove and the connecting elements of the carrier system are suitable for interlockingly engaging with the groove of the cam drum, and at least one motor, which drives the cam drums.

公开(公告)号：US12188122B2

公开(公告)日：2025-01-07

申请号：US17252456

申请日：2019-03-20

Applicant: SINGULUS TECHNOLOGIES AG

Inventor： Oliver Hohn ,  Michael Reising ,  Johannes Grübler ,  Kurt Pietsch ,  Jörg Koch

IPC: C23C16/448 ,  B01B1/00 ,  C23C16/52 ,  G05D23/19

Abstract: The present invention is directed to a method and an apparatus for providing vapor for a discontinuous process.