Abstract:
A circuit for compensating for MOS device response to supply voltage variations, as well as temperature and process variations, in an integrated circuit device. The compensation circuit produces a reference voltage which modulates the gate bias voltage of a MOS transistor such that the gate-to-source bias of the MOS transistor is varied to compensate for variations in the supply voltage as well as for variations in the temperature and manufacturing process. The circuit pulls up the reference voltage toward the supply voltage as the supply increases, thereby increasing the gate drive on the MOS transistor. The circuit provides compensation for both AC and DC supply variations. The MOS transistor is used to modulate the available current sinking capability in an IC device output buffer, such that as the MOS gate drive increases, the current sinking capability is reduced, thereby slowing the output state transitions as the supply increases, and reducing noise caused by supply variations.
Abstract:
A driver circuit for use in an array of picture elements in a liquid crystal display is capable of displaying one set of image data while receiving a second set of image data. A first select switch transistor responsive to a first select signal controls the coupling of a first image to a first storage capacitor. A second select switch transistor responsive to a second select signal controls the coupling of a second image to a second storage capacitor. The first storage capacitor may be selectively coupled to an output node by means of a first enable switch transistor responsive to a first enable signal. The second storage capacitor may be selectively coupled to the same output node by means of a second enable switch transistor responsive to a second enable signal. By proper manipulation of the switch transistors, one storage capacitor may be coupled to the output node while the other storage capacitor is isolated from the output node and receiving new image data.
Abstract:
A fuse circuit includes a fusible element and a feedback path which causes the circuit to behave as if the fusible element is fully blown even though the fusible element in fact is partially intact. While a partially intact fuse normally would result in a continuous drain of power, the feedback path cuts off the current flow through the partially intact fusible element.
Abstract:
A power-on-reset circuit includes a first charging stage for building up a charge during power up. The rising voltage of the first charging stage is sensed and used to control means for charging up a second charging stage. When the second charging stage reaches a first voltage level, a circuit is tripped to pull the potential of the first to ground. The grounding of the first charging stage is fed back to the charging means which shuts off its power burning components and maintains the first voltage level at the second charging stage.
Abstract:
A programmable logic device (PLD) architecture includes a plurality of PLD single-bit logic cells. Each single bit logic cell is comprised of all CMOS logic devices including a programmable cell unit, a settable latch, a signal path with inverter, and an output logic gate. The single path is coupled to the cell unit, the settable latch, and the output logic gate to create a positive feedback loop to improve speed and noise immunity. Each single bit logic gate is a basic building block for a modular low power consumption, high speed, zero DC current, high noise immunity programmable logic device (PLD) which includes an array of word lines and bit lines arranged in rows and columns for addressing, an array of OR gates, and a plurality of output logic circuits.
Abstract:
A reference cell for use in a high speed sensing circuit includes a first sub-circuit and a second sub-circuit. The first sub-circuit has a structure similar to memory cells within odd number rows of a main memory array. The second sub-circuit has a structure similar to memory cells within even numbered rows of the main memory array. If a target cell within the main memory array lies within an odd numbered row, then the first sub-circuit is selected, and if the target cell lies within an even numbered row, then second sub-circuit is selected. Both of the first and second sub-circuits include a reference transistors having its control gate broken into two parts. A first part is a poly 1 layer and is separated from the channel region by a tunneling oxide. A second part is a metal or poly 2 layer over the first part and separated from the first part by a gate oxide. A via is used to connect the first part to the second part.
Abstract:
A non-volatile, low, and zero power, high speed self-sensing programmable device and architecture including a non-volatile self-sensing cell. The non-volatile self-sensing cell is connected out of the speed path of the programmable device, permitting rapid, non-volatile programming and reading operations to be conducted. According to one version, two self-sensing cells are provided with a means for selecting one of the cells for programming or read operation. Each non-volatile self-sensing cell includes a latch having cross-coupled, pull-up transistors and non-volatile pull-down cells. The cross-coupled pull-up transistors are field effect transistors having gates which are connected to the opposite sources of the cross-coupled pull-up transistors.
Abstract:
The present invention relates to an MOS integrated circuit employing a plurality of floating gate type, erasable, programmable read-only memory (EPROM) devices. The improvement of the invention comprises a clamp coupled to the control gates of the EPROMs, the clamp being adapted to clamp the voltage on these gates in the range of the typical supply voltage for the circuit, whereby, after an EPROM cell is properly charged, it will continue to read out as a properly charged cell even though some of the actual charge on its floating gate may have leaked.
Abstract:
A metal-oxide-semiconductor (MOS) static decoding circuit for selecting an addressed line in a high density memory array, or the like, is disclosed. The circuit may be laid-out along array lines where the lines have a pitch of approximately 12.25 microns. Three levels of decoding are employed. The highest level permits the pulling-up of a common node in the second level decoder. The third level of decoding selects one of a plurality of array lines coupled to this node. Zero threshold voltage MOS devices are employed for coupling the first and third decoders to the second decoder.
Abstract:
A bit/column latch comprising a pair of first and second cross-coupled CMOS inverters. Each inverter of the pair comprises an NMOS transistor and a PMOS transistor. The first CMOS inverter has the source of its NMOS transistor coupled to ground via a control transistor and has its output connected to the associated bit line. When low voltage data intended for the associated memory cell appears on the bit line, the control transistor is barely turned on to weaken the NMOS transistor of the first inverter. This makes it easier for the data on the bit line to turn on the NMOS transistor of the second inverter so as to switch the bit latch from storing a ‘low’ to storing a ‘high’. In other words, the data bit from the bit line is loaded into the bit latch. After that, the control transistor is strongly turned on and therefore it becomes transparent to the latch. As a result, the latch is stable when the bit line later ramps up to a high programming level.