公开(公告)号：US06317342B1

公开(公告)日：2001-11-13

申请号：US09401310

申请日：1999-09-23

Applicant: J. Mark Noworolski ,  Seth R. Sanders

Inventor： J. Mark Noworolski ,  Seth R. Sanders

IPC: H02M318

CPC classification number: H02M3/07 ,  H02M3/1588 ,  H02M3/44 ,  Y02B70/1466

Abstract: The present invention, generally speaking, provides an inductor-free power converter based on mechanical resonance using a single MEM device. Mechanical resonance and silicon strain energy are used as building blocks for a power converter, such as a boost converter. In such a “micromechanical boost converter,” arbitrary step-up voltages can be developed using only a single micromechanical component. A dramatic improvement in power density is obtained as compared to conventional capacitor and inductor technologies. For typical MEM applications, such a converter, operating without discrete parts, can readily be fabricated together with the MEM device it powers. For non-MEM applications (e.g., the on-chip generation of high voltages, as for EEPROM programming, for example), the improvement in power density offers significant benefits, particularly for portable equipment.

Abstract translation: 一般而言，本发明提供了一种基于使用单个MEM器件的机械谐振的无电感器功率转换器。 机械共振和硅应变能用作功率转换器（如升压转换器）的构建块。 在这种“微型机械升压转换器”中，可以仅使用单个微机械部件来开发任意的升压电压。 与传统的电容器和电感器技术相比，获得了功率密度的显着提高。 对于典型的MEM应用，这种不具有分立部件的转换器可以容易地与其供电的MEM器件一起制造。 对于非MEM应用（例如，例如，对于EEPROM编程的片上产生高电压），功率密度的改进提供了显着的益处，特别是对于便携式设备。

公开(公告)号：US5428245A

公开(公告)日：1995-06-27

申请号：US239346

申请日：1994-05-06

Applicant: Peng-Cheng Lin ,  Seth R. Sanders ,  Hem P. Takiar

Inventor： Peng-Cheng Lin ,  Seth R. Sanders ,  Hem P. Takiar

IPC: G01R1/20 ,  H01L23/495 ,  H01L23/48

CPC classification number: H01L23/495 ,  G01R1/20 ,  H01L23/49541 ,  H01L2924/0002 ,  Y10S257/924

Abstract: A lead frame for use in an integrated circuit package is disclosed herein. The lead frame includes a magnetic component winding wherein the winding is formed as an integral part of the lead frame. Additional windings may be formed as an integral part of the lead frame and then folded into position over the first winding to form a multiple layered magnetic component winding. In one embodiment, the lead frame based winding is coated with a magnetic material to form a lead frame based inductor. There is also disclosed a method of producing a lead frame including a magnetic component winding wherein the winding is formed as an integral part of the lead frame.

Abstract translation: 本文公开了一种用于集成电路封装的引线框架。 引线框架包括磁性部件绕组，其中绕组形成为引线框架的整体部分。 另外的绕组可以形成为引线框架的整体部分，然后折叠到第一绕组上的位置以形成多层磁性部件绕组。 在一个实施例中，基于引线框的绕组被涂覆有磁性材料以形成基于引线框架的电感器。 还公开了一种制造包括磁性部件绕组的引线框架的方法，其中绕组形成为引线框架的整体部分。