METHOD OF EDGE BEVEL RINSE
    1.
    发明申请
    METHOD OF EDGE BEVEL RINSE 失效
    边缘波纹法

    公开(公告)号:US20070190698A1

    公开(公告)日:2007-08-16

    申请号:US11279561

    申请日:2006-04-12

    CPC classification number: G03F7/168 H01L21/6708 Y10S438/947

    Abstract: A method of edge bevel rinse. First, a wafer having a coating material layer disposed thereon is provided. A light beam is optically projected on the wafer to form a reference pattern. The reference pattern defines a central region, and a bevel region surrounding the central region on the surface of the wafer. Subsequently, the coating material layer positioned in the bevel region is removed according to the reference pattern.

    Abstract translation: 边缘斜面冲洗的方法。 首先,提供其上设置有涂层层的晶片。 将光束光学投影在晶片上以形成参考图案。 参考图案限定了中心区域和围绕晶片表面上的中心区域的斜面区域。 随后,根据参考图案去除位于斜面区域中的涂层层。

    Method of edge bevel rinse
    2.
    发明授权
    Method of edge bevel rinse 失效
    边缘斜面冲洗方法

    公开(公告)号:US07413963B2

    公开(公告)日:2008-08-19

    申请号:US11279561

    申请日:2006-04-12

    CPC classification number: G03F7/168 H01L21/6708 Y10S438/947

    Abstract: A method of edge bevel rinse. First, a wafer having a coating material layer disposed thereon is provided. A light beam is optically projected on the wafer to form a reference pattern. The reference pattern defines a central region, and a bevel region surrounding the central region on the surface of the wafer. Subsequently, the coating material layer positioned in the bevel region is removed according to the reference pattern.

    Abstract translation: 边缘斜面冲洗的方法。 首先,提供其上设置有涂层层的晶片。 将光束光学投影在晶片上以形成参考图案。 参考图案限定了中心区域和围绕晶片表面上的中心区域的斜面区域。 随后,根据参考图案去除位于斜面区域中的涂层层。

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