公开(公告)号：US20120138990A1

公开(公告)日：2012-06-07

申请号：US13310131

申请日：2011-12-02

Applicant: Yoshihito SATO ,  Nobuhiro Arai ,  Jun Matsui ,  Shingetsu Yamada ,  Shuuji Suzuki

Inventor： Yoshihito SATO ,  Nobuhiro Arai ,  Jun Matsui ,  Shingetsu Yamada ,  Shuuji Suzuki

IPC: H01L33/46

CPC classification number: H01L33/641 ,  H01L23/142 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The invention provides a metal substrate and a light source device ensuring that a semiconductor chip working as a light source can be firmly joined by using a metal joining material, such that heat generated in the mounted semiconductor chip can be efficiently dissipated through a metal plate. The metal substrate includes a heat dissipating metal plate made of a metal except for Au, an insulating resin-made white film stacked on a part of the heat dissipating metal plate, and a light source mounting surface-forming layer stacked on another part of the heat dissipating metal plate. The metal substrate is such that the light source mounting surface-forming layer is a metal layer directly contacting the heat dissipating metal plate, and the light source mounting surface is a surface of an Au layer which is the outermost layer of the light source mounting surface-forming layer.

Abstract translation: 本发明提供一种金属基板和光源装置，其确保通过使用金属接合材料可以将作为光源工作的半导体芯片牢固地接合，使得能够通过金属板有效地散发在安装的半导体芯片中产生的热量。 金属基板包括由金除外的金属制成的散热金属板，层叠在散热金属板的一部分上的绝缘树脂制白色膜和层叠在该散热金属板的另一部分上的光源安装面形成层 散热金属板。 金属基板使得光源安装表面形成层是直接接触散热金属板的金属层，光源安装表面是作为光源安装表面的最外层的Au层的表面 形成层。

公开(公告)号：US06797367B2

公开(公告)日：2004-09-28

申请号：US10357183

申请日：2003-02-03

Applicant: Minoru Ogawa ,  Masahiro Izumi ,  Shigeyasu Itoh ,  Shingetsu Yamada ,  Shuuji Suzuki ,  Hiroo Kurosaki

Inventor： Minoru Ogawa ,  Masahiro Izumi ,  Shigeyasu Itoh ,  Shingetsu Yamada ,  Shuuji Suzuki ,  Hiroo Kurosaki

IPC: B32B300

CPC classification number: H05K3/4632 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/09701 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/095 ,  H05K3/041 ,  H05K3/045 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2203/0108 ,  H05K2203/065 ,  Y02P20/582 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T428/24917 ,  Y10T428/249994

Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.

Abstract translation: 具有耐热性高的多层布线基板，其能够低温熔融而不发生树脂流动，能够实现高精度，细致的导电布线，理想地应用于低体积高混合物制造配置，并且还具有 与使用这种多层布线板的半导体装置安装板一起提供对环境的影响很小，以及制造这种多层布线板的方法。 在多层布线板中，形成布线电路和通孔的槽形成在由包含结晶熔融峰值温度至少为260℃的聚芳基酮树脂的热塑性树脂组合物形成的绝缘基板和无定形聚醚酰亚胺树脂中 主要成分，金属箔被嵌入槽内，使得箔的表面突出到绝缘基板的表面，并且通过固化导电膏形成的导电材料用于填充通孔。

公开(公告)号：US20110042124A1

公开(公告)日：2011-02-24

申请号：US12745651

申请日：2008-12-03

Applicant: Jun Matsui ,  Shingetsu Yamada

Inventor： Jun Matsui ,  Shingetsu Yamada

IPC: H01B17/00 ,  H05K1/00 ,  H05K3/06 ,  H05K3/00

CPC classification number: H05K1/183 ,  H01L33/486 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/12044 ,  H05K1/0274 ,  H05K1/0373 ,  H05K3/4617 ,  H05K3/4632 ,  H05K3/4688 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/063 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention provides a multilayer wiring substrate comprising: a plurality of wiring substrate laminated each other; and a cavity portion. In the multilayer wiring substrate, a wiring substrate 1 being arranged along the bottom face of the cavity portion and a wiring substrate 2 being arranged at an upper layer side of the wiring substrate 1, the wiring substrate 1 and/or the wiring substrate 2 respectively comprising an insulating base material having a predetermined properties, the wiring substrate 2 being provided with a cavity hole. Thus, it is possible to provide a multilayer wiring substrate having a cavity portion and even a function of reflector.

Abstract translation: 本发明提供一种多层布线基板，包括：多个彼此层叠的布线基板; 和空腔部分。 在多层布线基板中，布线基板1沿着空腔部的底面配置，布线基板2分别配置在布线基板1，布线基板1和/或布线基板2的上层侧 包括具有预定特性的绝缘基材，所述布线基板2设置有空腔孔。 因此，可以提供具有空腔部分和甚至反射器功能的多层布线基板。

公开(公告)号：US06228467B1

公开(公告)日：2001-05-08

申请号：US09381283

申请日：1999-09-21

Applicant: Kouichirou Taniguchi ,  Jun Takagi ,  Hideo Yamano ,  Shingetsu Yamada ,  Kouji Kondo ,  Kaoru Nomoto

Inventor： Kouichirou Taniguchi ,  Jun Takagi ,  Hideo Yamano ,  Shingetsu Yamada ,  Kouji Kondo ,  Kaoru Nomoto

IPC: B32B300

CPC classification number: H05K3/4632 ,  C08L71/00 ,  C08L79/08 ,  H05K1/0353 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0129 ,  H05K2201/10378 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/31511 ,  C08L2666/22

Abstract: A base plate for a printed circuit board, having a conductive foil heat-bonded to at least one side of a film insulator which comprises from 65 to 35 wt % of a polyarylketone resin and from 35 to 65 wt % of a non-crystalline polyether imide resin and of which the glass transition temperature is from 150 to 230° C. and the peak temperature of crystal fusion is at least 260° C., as measured when the temperature is raised in the differential scanning calorimetry, if necessary after forming a through-hole and filling a conductive paste therein, and of which, after the heat bonding, the heat of crystal fusion &Dgr;Hm and the heat of crystallization &Dgr;Hc generated by crystallization during the temperature rise, as measured when the temperature is raised by the differential scanning calorimetry, satisfy the following relation: [(&Dgr;Hm−&Dgr;Hc)/&Dgr;Hm]≦0.5.

Abstract translation: 一种用于印刷电路板的基板，其具有热粘合到膜绝缘体的至少一侧的导电箔，该导电箔包含65至35重量％的聚芳基酮树脂和35至65重量％的非结晶聚醚 酰亚胺树脂，玻璃化转变温度为150〜230℃，晶体熔融峰值温度为260℃以上，如果需要，则在差示扫描量热法中测定，如果需要，在形成 通孔，并在其中填充导电膏，其中在热粘结之后，通过差示扫描升高温度时测量的结晶熔融DELTAHm的热量和通过结晶在温度升高期间产生的结晶热量DELTAHc 量热法，满足以下关系：

公开(公告)号：US08044304B2

公开(公告)日：2011-10-25

申请号：US11814531

申请日：2006-01-24

Applicant: Shingetsu Yamada

Inventor： Shingetsu Yamada

IPC: H05K1/00

CPC classification number: H05K3/4617 ,  H05K3/4626 ,  H05K2201/0129 ,  H05K2201/0394 ,  H05K2201/10378

Abstract: A multilayer printed circuit board is characterized in that circuit boards 1 and 2 and a circuit board 3 are laminated alternately to form a multilayer body using a simultaneous lamination method, the circuit boards 1 and 2 including a film-, thin plate-, or sheet-like insulating substrate 11 made of a thermosetting resin containing any one of epoxy resin, bismaleimide/triazine resin, and allylic polyphenylene ether resin as a major component, the circuit board 3 including a film-, thin plate-, or sheet-like insulating substrate 21 made of a thermoplastic resin containing a polyaryl ketone resin and amorphous polyether imide resin having a crystal-fusing peak temperature of 260° C. or more. By the present invention, it is possible to provide a multilayer printed circuit board which has small fusion or flow deformation at the time of simultaneous lamination, which does not have unevenness in positional precision in the lamination direction, which has no need for the processes to be readjusted, and which has high reliability in interlayer electrical connection.

Abstract translation: 多层印刷电路板的特征在于，电路板1和2和电路板3交替层叠以形成使用同时层压方法的多层体，电路板1和2包括膜，薄板或片 由含有环氧树脂，双马来酰亚胺/三嗪树脂和烯丙基聚苯醚树脂中的任何一种的热固性树脂制成的绝缘基板11作为主要成分，电路板3包括薄膜，薄板或片状绝缘体 由包含聚芳基酮树脂的热塑性树脂制成的基材21和具有260℃以上的晶体熔融峰值温度的无定形聚醚酰亚胺树脂。 通过本发明，可以提供一种在同时层叠时具有小的熔融或流动变形的多层印刷电路板，其不会在层叠方向上的位置精度不均匀，这不需要处理 重新调整，层间电连接具有较高的可靠性。

公开(公告)号：US06499217B1

公开(公告)日：2002-12-31

申请号：US09700992

申请日：2001-02-06

Applicant: Shingetsu Yamada ,  Jun Takagi ,  Koichiro Taniguchi ,  Kaoru Nomoto ,  Toshihiro Miyake ,  Kazuya Sanada ,  Makoto Totani

Inventor： Shingetsu Yamada ,  Jun Takagi ,  Koichiro Taniguchi ,  Kaoru Nomoto ,  Toshihiro Miyake ,  Kazuya Sanada ,  Makoto Totani

IPC: H01K322

CPC classification number: H01K3/22 ,  H05K1/0313 ,  H05K1/0353 ,  H05K3/0014 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158

Abstract: An efficient method of manufacturing a three-dimensional printed wiring board is provided in which a conductor foil can be reliably heat-fused to the board at a relatively low temperature and the three-dimensional shape such as convex and concave of a mold can be reproduced precisely with no residual stress. The method comprises the steps of providing a filmy insulator comprising a thermoplastic resin composition containing 65-35 wt % of a polyaryl ketone resin having a crystal-melting peak temperature of 260° C. or over, and 35-65 wt % of an amorphous polyetherimide resin, and having a glass transition temperature as measured when the temperature is increased for differential scanning calorie measurement of 150-230° C. superposing a conductor foil on one or both sides of the filmy insulating member, heat-fusing the conductor foil so that the thermoplastic resin composition will satisfy the relation between the crystal-melting calorie &Dgr; Hm and the crystallizing calorie &Dgr; Hc as expressed by the following formula (I), etching the conductor foil to form a conductor circuit, and deforming the printed wiring circuit obtained three-dimensionally. [(&Dgr;Hm−&Dgr;Hc)/&Dgr;Hm]≦0.5  (I): [(&Dgr;Hm−&Dgr;Hc)/&Dgr;Hm]≧0.7  (II):

Abstract translation: 提供一种制造三维印刷电路板的有效方法，其中导体箔可以在相对低的温度下可靠地热熔到板上，并且可以再现模具的凸和凹的三维形状 精确地没有残余应力。该方法包括提供一种薄膜绝缘体的步骤，该薄膜绝缘体包含含有65-35重量％的结晶熔融峰值温度为260℃或更高的聚芳基酮树脂的热塑性树脂组合物， 65重量％的无定形聚醚酰亚胺树脂，并且当在膜绝缘构件的一面或两面上叠加导体箔的150-230℃的差示扫描热量测量的温度升高时测量的玻璃化转变温度，热量 使导体箔使热塑性树脂组合物满足结晶熔融热量DELTA Hm与结晶热量DELTA Hc之间的关系，如 由下式（I）表示，蚀刻导体箔以形成导体电路，并且使得三维获得的印刷线路电路变形。

公开(公告)号：US5441804A

公开(公告)日：1995-08-15

申请号：US285516

申请日：1994-08-04

Applicant: Toshiyuki Akitake ,  Shingetsu Yamada

Inventor： Toshiyuki Akitake ,  Shingetsu Yamada

IPC: C23C14/14 ,  C23C14/50 ,  G11B11/105 ,  B05D5/12

CPC classification number: C23C14/14 ,  C23C14/505 ,  G11B11/10582 ,  G11B11/10586 ,  Y10S428/90 ,  Y10S428/928 ,  Y10T428/12535 ,  Y10T428/12542 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12875 ,  Y10T428/12931 ,  Y10T428/12951 ,  Y10T428/12993 ,  Y10T428/265 ,  Y10T428/31663

Abstract: A magneto-optical recording medium has on the substrate a recording layer made of a multi-layered metallic thin film comprising a first unit layer and a second unit layer. The first unit layer is composed of (Fe.sub.x Co.sub.1-x).sub.1-y M.sub.y where M represents at least one metal selected from the group consisting of Pt, Pd and Au, 0.5.ltoreq..times..ltoreq.1.0, and 0.01.ltoreq.y.ltoreq.0.1. The second unit layer is composed of a% least one metal selected from the group consisting of Nd, Dy, Gd and Tb. The first and second unit layers are superimposed alternately one on another.

Abstract translation: 磁光记录介质在衬底上具有由包括第一单元层和第二单元层的多层金属薄膜制成的记录层。 第一单元层由（FexCo1-x）1-yMy组成，其中M表示选自Pt，Pd和Au中的至少一种金属，0.5≤x≤1.0，和0.01≤y

公开(公告)号：US20090020319A1

公开(公告)日：2009-01-22

申请号：US11814531

申请日：2006-01-24

Applicant: Shingetsu Yamada

Inventor： Shingetsu Yamada

IPC: H05K1/03

CPC classification number: H05K3/4617 ,  H05K3/4626 ,  H05K2201/0129 ,  H05K2201/0394 ,  H05K2201/10378

Abstract: A multilayer printed circuit board is characterized in that circuit boards 1 and 2 and a circuit board 3 are laminated alternately to form a multilayer body using a simultaneous lamination method, the circuit boards 1 and 2 including a film-, thin plate-, or sheet-like insulating substrate 11 made of a thermosetting resin containing any one of epoxy resin, bismaleimide/triazine resin, and allylic polyphenylene ether resin as a major component, the circuit board 3 including a film-, thin plate-, or sheet-like insulating substrate 21 made of a thermoplastic resin containing a polyaryl ketone resin and amorphous polyether imide resin having a crystal-fusing peak temperature of 260° C. or more. By the present invention, it is possible to provide a multilayer printed circuit board which has small fusion or flow deformation at the time of simultaneous lamination, which does not have unevenness in positional precision in the lamination direction, which has no need for the processes to be readjusted, and which has high reliability in interlayer electrical connection.

Abstract translation: 多层印刷电路板的特征在于，电路板1和2和电路板3交替层叠以形成使用同时层压方法的多层体，电路板1和2包括膜，薄板或片 由含有环氧树脂，双马来酰亚胺/三嗪树脂和烯丙基聚苯醚树脂中的任何一种的热固性树脂制成的绝缘基板11作为主要成分，电路板3包括薄膜，薄板或片状绝缘体 由包含聚芳基酮树脂的热塑性树脂制成的基材21和具有260℃以上的晶体熔融峰值温度的无定形聚醚酰亚胺树脂。 通过本发明，可以提供一种在同时层叠时具有小的熔融或流动变形的多层印刷电路板，其不会在层叠方向上的位置精度不均匀，这不需要处理 重新调整，层间电连接具有较高的可靠性。

公开(公告)号：US20080116611A1

公开(公告)日：2008-05-22

申请号：US11943410

申请日：2007-11-20

Applicant: Minoru Ogawa ,  Masahiro Izumi ,  Shigeyasu Itoh ,  Shingetsu Yamada ,  Shuuji Suzuki ,  Hiroo Kurosaki

Inventor： Minoru Ogawa ,  Masahiro Izumi ,  Shigeyasu Itoh ,  Shingetsu Yamada ,  Shuuji Suzuki ,  Hiroo Kurosaki

IPC: B29C59/00

CPC classification number: H05K3/4632 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/09701 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/095 ,  H05K3/041 ,  H05K3/045 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2203/0108 ,  H05K2203/065 ,  Y02P20/582 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T428/24917 ,  Y10T428/249994

Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring. can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.

Abstract translation: 具有高耐热性的多层线路板，能够在不发生树脂流动的情况下进行低温融合，能够实现高精度，细致的导电布线。 可以理想地应用于低体积高混合物制造配置，并且与使用这种多层布线板的半导体器件安装板一起提供的环境几乎没有影响，以及制造这种多层布线板的方法。 在多层布线板中，形成布线电路和通孔的槽形成在由包含结晶熔融峰值温度至少为260℃的聚芳基酮树脂的热塑性树脂组合物形成的绝缘基板和无定形聚醚酰亚胺树脂作为 主要成分，金属箔被嵌入槽内，使得箔的表面突出到绝缘基板的表面，并且通过固化导电膏形成的导电材料用于填充通孔。

公开(公告)号：US07022399B2

公开(公告)日：2006-04-04

申请号：US10357097

申请日：2003-02-03

Applicant: Minoru Ogawa ,  Masahiro Izumi ,  Shigeyasu Itoh ,  Shingetsu Yamada ,  Shuuji Suzuki ,  Hiroo Kurosaki

Inventor： Minoru Ogawa ,  Masahiro Izumi ,  Shigeyasu Itoh ,  Shingetsu Yamada ,  Shuuji Suzuki ,  Hiroo Kurosaki

IPC: B32B15/00 ,  B32B3/00 ,  B32B7/00

CPC classification number: H05K3/4632 ,  H01L21/4857 ,  H01L23/145 ,  H01L23/49822 ,  H01L24/24 ,  H01L24/82 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H05K1/185 ,  H05K3/041 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2203/0108 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249994 ,  H01L2924/00

Abstract: The present invention provides a semiconductor device integrated multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, thereby enabling the production of high density, ultra small three dimensional mounting modules and the like, can also be ideally applied to low volume high mix manufacturing configurations, and has little impact on the environment, and also provides a method of manufacturing such a semiconductor device integrated multilayer wiring board. In the semiconductor device integrated multilayer wiring board, a wiring substrate is formed by embedding conductive wiring within an insulating substrate, formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as primary constituents, so that the surface of the wiring protrudes to the surface of the resin, and a plurality of these wiring substrates are laminated together, IC chips are mounted onto some of the wiring substrates, the insulating substrates of the wiring substrates are bonded together by thermal fusion, and the conductive wiring of each of the wiring substrates, and the wiring electrically connecting the wiring substrates together, is formed from a conductive material produced by curing a conductive paste.

Abstract translation: 本发明提供一种具有高耐热性的半导体器件集成多层布线板，其能够在不发生树脂流动的情况下进行低温熔融，能够实现高精度，细致的导电布线，从而能够生产高密度， 超小三维安装模块等也可以理想地应用于低体积高混合物制造配置，并且对环境影响很小，并且还提供了制造这种半导体器件集成多层布线板的方法。 在半导体装置集成多层布线基板中，通过将导电布线嵌入绝缘基板内而形成布线基板，绝缘基板由包含结晶熔融峰值温度为260℃以上的聚芳基酮树脂的热塑性树脂组合物形成，无定形聚醚酰亚胺 树脂作为主要成分，使得布线的表面突出到树脂的表面，并且多个这些布线基板层叠在一起，将IC芯片安装到一些布线基板上，布线基板的绝缘基板 通过热熔接结合在一起，并且每个布线基板的导电布线以及将布线基板电连接在一起的布线由通过固化导电浆料制成的导电材料形成。