公开(公告)号：US20050085578A1

公开(公告)日：2005-04-21

申请号：US10915218

申请日：2004-08-09

Applicant: Shuichi Iguchi

Inventor： Shuichi Iguchi

IPC: C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01B1/00 ,  H01B1/22 ,  H01L21/52 ,  H03H9/02 ,  H03H9/05 ,  H03H9/25 ,  H02N2/00

CPC classification number: H03H9/1071 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2224/85181 ,  H01L2924/16195 ,  H03H9/0585 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A piezo electric device in which a SAW element 5 is mounted on a base 1 of a package 4 having bonding pads 10,10 connected through bonding wires to corresponding connection terminals 11,11 in the package and having a lid 2 being joined to the base by seam welding and hermetically sealed thereto. The SAW element 5 is bonded and affixed to a mounting surface 6 in the base 1 using a conductive adhesive 7 which contains 80 to 85% resin material by weight and a 20 to 15% flaky conductive filler by weight, or using a conductive adhesive which contains 82.5 to 85% resin material by weight and a 17.5 to 15% conductive filler by weight, wherein the conductive filler comprises a 30% small particulate conductive filler 21 by weight and a 70% large particulate conductive filler 22 by weight.

Abstract translation: 一种压电装置，其中SAW元件5安装在具有接合焊盘10,10的封装4的基座1上，接合焊盘10,10通过接合线连接到封装中的相应的连接端子11,11，并且具有与基座 通过缝焊和气密密封。 SAW元件5使用包含重量百分比为80-85％的树脂材料的导电粘合剂7和重量为20至15％的片状导电填料或使用导电粘合剂将导电粘合剂7粘合并固定到基座1中的安装表面6上， 含有82.5至85重量％的树脂材料和17.5至15重量％的导电填料，其中导电填料包含30重量％的小颗粒导电填料21和70重量％的大颗粒状导电填料22。