Coated Graphite Article And Reactive Ion Etch Manufacturing And Refurbishment Of Graphite Article
    2.
    发明申请
    Coated Graphite Article And Reactive Ion Etch Manufacturing And Refurbishment Of Graphite Article 审中-公开
    涂层石墨制品和反应离子蚀刻制造和石墨翻新文章

    公开(公告)号:US20130108863A1

    公开(公告)日:2013-05-02

    申请号:US13583316

    申请日:2011-04-15

    Abstract: In accordance with an embodiment of the invention, there is provided a coated graphite article. The article comprises graphite; and a conductive coating overlaying at least a portion of the graphite. The conductive coating comprises a through-thickness resistance of less than about 50 ohms as measured through the thickness of the graphite and the conductive coating. In accordance with another embodiment of the invention, there is provided a method for manufacturing a graphite article comprising a conductive coating. The method comprises treating graphite of the article with a reactive ion etch process; and after treating the graphite with the reactive ion etch process, applying the conductive coating over at least a portion of the graphite. In a further embodiment according to the invention, there is provided a method for refurbishing a graphite article comprising graphite and an overlaying conductive coating. The method comprises removing the overlaying conductive coating of the graphite article with a reactive ion etch process; and applying a new conductive coating over at least a portion of the graphite.

    Abstract translation: 根据本发明的实施例,提供了一种涂覆石墨制品。 该物品包括石墨; 以及覆盖至少一部分石墨的导电涂层。 导电涂层包括通过石墨和导电涂层的厚度测量的小于约50欧姆的贯穿厚度电阻。 根据本发明的另一个实施例,提供了一种用于制造包括导电涂层的石墨制品的方法。 该方法包括用反应离子蚀刻工艺处理制品的石墨; 并且在用反应离子蚀刻工艺处理石墨之后,将导电涂层施加在石墨的至少一部分上。 在根据本发明的另一实施例中,提供了一种用于翻新包含石墨和覆盖导电涂层的石墨制品的方法。 该方法包括用反应离子蚀刻工艺去除石墨制品的覆盖导电涂层; 以及在所述石墨的至少一部分上施加新的导电涂层。

    Electrostatic chuck with polymer protrusions
    4.
    发明授权
    Electrostatic chuck with polymer protrusions 有权
    具有聚合物突起的静电卡盘

    公开(公告)号:US08879233B2

    公开(公告)日:2014-11-04

    申请号:US13266657

    申请日:2010-05-13

    CPC classification number: H01L21/6831 H01L21/6875

    Abstract: In accordance with an embodiment of the invention, there is provided an electrostatic chuck. The electrostatic chuck comprises a surface layer activated by a voltage in an electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface layer includes a plurality of polymer protrusions and a charge control layer to which the plurality of polymer protrusions adhere, the plurality of polymer protrusions extending to a height above portions of the charge control layer surrounding the plurality of polymer protrusions to support the substrate upon the plurality of polymer protrusions during electrostatic clamping of the substrate.

    Abstract translation: 根据本发明的实施例,提供了一种静电卡盘。 静电卡盘包括由电极中的电压激活的表面层,以形成电荷以将基板静电夹持到静电卡盘。 表面层包括多个聚合物突起和电荷控制层,多个聚合物突起粘附在该电荷控制层上,多个聚合物突起延伸到围绕多个聚合物突起的电荷控制层的部分上方的高度,以将基底支撑在 在基板的静电夹持期间的多个聚合物突起。

    Electrostatic Chuck With Polymer Protrusions
    5.
    发明申请
    Electrostatic Chuck With Polymer Protrusions 有权
    带聚合物突起的静电卡盘

    公开(公告)号:US20120044609A1

    公开(公告)日:2012-02-23

    申请号:US13266657

    申请日:2010-05-13

    CPC classification number: H01L21/6831 H01L21/6875

    Abstract: In accordance with an embodiment of the invention, there is provided an electrostatic chuck. The electrostatic chuck comprises a surface layer activated by a voltage in an electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface layer includes a plurality of polymer protrusions and a charge control layer to which the plurality of polymer protrusions adhere, the plurality of polymer protrusions extending to a height above portions of the charge control layer surrounding the plurality of polymer protrusions to support the substrate upon the plurality of polymer protrusions during electrostatic clamping of the substrate.

    Abstract translation: 根据本发明的实施例,提供了一种静电卡盘。 静电卡盘包括由电极中的电压激活的表面层,以形成电荷以将基板静电夹持到静电卡盘。 表面层包括多个聚合物突起和电荷控制层,多个聚合物突起粘附在该电荷控制层上,多个聚合物突起延伸到围绕多个聚合物突起的电荷控制层的部分上方的高度,以将基底支撑在 在基板的静电夹持期间的多个聚合物突起。

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