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公开(公告)号：US20060011544A1
公开(公告)日：2006-01-19
申请号：US11083381
申请日：2005-03-16
Applicant: Sunity Sharma , Subhash Narang , Lawrence Dubois , Anoop Nagar , Donald Schleich
Inventor： Sunity Sharma , Subhash Narang , Lawrence Dubois , Anoop Nagar , Donald Schleich
IPC: B01D61/36
CPC classification number: B01D61/145 , B01D61/00 , B01D61/002 , B01D61/005 , B01D61/025 , B01D61/027 , B01D61/147 , B01D61/243 , B01D61/362 , B01D61/364 , B01D61/422 , B01D61/56 , B01D61/58 , B01D63/046 , B01D2319/06 , C02F1/44 , C02F1/445
Abstract: A membrane purification system and method are described in which a first membrane, an osmotically active agent, and a second membrane are utilized to separate fluid components. In general, fluid is moved through the first membrane into an osmosis compartment containing the osmotically active agent by the osmotic force of an osmotically active agent disposed between the first membrane and the second membrane. The fluid is forced from the osmotically active agent and through the second membrane while the second membrane retains the osmotically active agent in the osmosis compartment. The osmotically active agent may include a polymer.
Abstract translation: 描述了膜纯化系统和方法，其中使用第一膜，渗透活性剂和第二膜来分离流体组分。 通常，通过设置在第一膜和第二膜之间的渗透活性剂的渗透力将流体通过第一膜移动到含有渗透活性剂的渗透室中。 流体从渗透活性剂被迫并通过第二膜，而第二膜将渗透活性剂保留在渗透室中。 渗透活性剂可以包括聚合物。
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公开(公告)号：US08110254B1
公开(公告)日：2012-02-07
申请号：US11854271
申请日：2007-09-12
Applicant: Sunity Sharma , Jaspreet Singh Dhau
Inventor： Sunity Sharma , Jaspreet Singh Dhau
CPC classification number: H05K3/1283 , H05K1/0393 , H05K3/182 , H05K2203/0709 , Y10S428/901 , Y10T428/24917 , Y10T428/2857
Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
Abstract translation: 本发明提供一种电路创建技术，其通过将活性和元素钯添加到基底的表面上来改善导线生产。 钯在表面上以微量的形式设置，并且本身不形成导电层，但是根据钯的图案有助于随后将金属沉积到表面上以形成导电线。
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公开(公告)号：US06548122B1
公开(公告)日：2003-04-15
申请号：US09444031
申请日：1999-11-19
Applicant: Sunity Sharma , Subhash Narang , Kuldip Bhasin , Madan Lal Sharma
Inventor： Sunity Sharma , Subhash Narang , Kuldip Bhasin , Madan Lal Sharma
IPC: B32B300
CPC classification number: H05K3/105 , G03F7/16 , H05K3/1241 , Y10S428/901 , Y10T428/24909
Abstract: Methods and apparatus are provided in which a metal precursor is formed in a process that includes the following steps: depositing a metal precursor on a substrate; adding an energy to reduce the metal precursor and to precipitate metal on the substrate as a continuous metal layer; and selecting the metal precursor and the energy such that the purity of the continuous metal layer is greater than 85%, and/or the deposited layer has an electrical conductivity substantially that of a pure metal. Methods and apparatus are also provided in which a metal is deposited onto a substrate by a process which includes the following steps: depositing the metal precursor onto the substrate in a desired pattern; and applying sufficient energy to decompose the precursor to precipitate metal in a continuous metal layer in the desired pattern.
Abstract translation: 提供了一种方法和装置，其中在包括以下步骤的方法中形成金属前体：在基底上沉积金属前体; 添加能量以减少金属前体并将金属沉积在基底上作为连续的金属层; 并且选择金属前体和能量使得连续金属层的纯度大于85％，和/或沉积层具有基本上纯金属的电导率。 还提供了一种方法和装置，其中通过包括以下步骤的方法将金属沉积到基底上：将金属前体以期望的图案沉积到基底上; 并施加足够的能量以分解前体以使所需图案中连续金属层中的金属沉淀。
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公开(公告)号：US5980813A
公开(公告)日：1999-11-09
申请号：US105858
申请日：1998-06-26
Applicant: Subhash C. Narang , Susanna C. Ventura , Sunity Sharma , John S. Stotts
Inventor： Subhash C. Narang , Susanna C. Ventura , Sunity Sharma , John S. Stotts
CPC classification number: B29C67/0092 , B29K2995/0073
Abstract: Novel compositions and methods are provided for use in the stepwise, layer by layer fabrication of three-dimensional objects, in which a build material contains a metal having a covalent bond to a non-metal, and the layers are processed to produce the three-dimensional object at least in part through a chemical reaction which alters the covalent bond of the metal. In a first aspect of the invention the build material includes a metal that is covalently bound to a polymeric precursor. In another aspect of the invention, the build material includes a metal, Me, that is covalently bound to a first ligand, L.sub.1. Following deposition of the build material, the first ligand undergoes a redox reaction with a second ligand, L.sub.2, thereby breaking the covalent bond of the metal. In more preferred embodiments of this class, L.sub.1 and L.sub.2 react to form a gas, and the metal reacts to form an oxide such as MeSO.sub.x, MeNO.sub.x, MeCO.sub.x and so forth. In yet another aspect of the invention, multiple build materials are employed to provide non-uniformities such as electrical, thermal, and magnetic conduction paths, structural supports, chemical and wear resistant areas, and so forth.
Abstract translation: 提供了新颖的组合物和方法用于逐层逐层制造三维物体，其中构建材料包含与非金属共价键的金属，并且这些层被加工以产生三维物体， 至少部分地通过化学反应改变金属的共价键。 在本发明的第一方面，构建材料包括与聚合物前体共价结合的金属。 在本发明的另一方面，构建材料包括与第一配体L1共价结合的金属Me。 在构建材料沉积之后，第一配体与第二配体L2进行氧化还原反应，从而破坏金属的共价键。 在该类的更优选的实施方案中，L1和L2反应形成气体，并且金属反应形成氧化物，例如MeSO x，MeNO x，MeCO x等。 在本发明的另一方面，使用多种构建材料来提供不均匀性，例如电，热和磁传导路径，结构支撑，化学和耐磨区域等。
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公开(公告)号：US20120100286A1
公开(公告)日：2012-04-26
申请号：US13341828
申请日：2011-12-30
Applicant: Sunity Sharma , Jaspreet Singh Dhau
Inventor： Sunity Sharma , Jaspreet Singh Dhau
IPC: B05D5/12
CPC classification number: H05K3/1283 , H05K1/0393 , H05K3/182 , H05K2203/0709 , Y10S428/901 , Y10T428/24917 , Y10T428/2857
Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
Abstract translation: 本发明提供一种电路创建技术，其通过将活性和元素钯添加到基底的表面上来改善导线生产。 钯在表面上以微量的形式设置，并且本身不形成导电层，但是根据钯的图案有助于随后将金属沉积到表面上以形成导电线。
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Patent Agency Ranking
公开(公告)号：US20110174524A1
公开(公告)日：2011-07-21
申请号：US13078831
申请日：2011-04-01
Applicant: Sunity SHARMA , Jaspreet Singh DHAU
Inventor： Sunity SHARMA , Jaspreet Singh DHAU
CPC classification number: C23C18/2033 , C23C18/1653 , C23C18/30 , H05K1/0284 , H05K1/0393 , H05K3/182 , H05K2201/0999 , H05K2203/0709 , Y10S428/901 , Y10T428/24917 , Y10T428/2857
Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
Abstract translation: 本发明提供一种电路创建技术，其通过将活性和元素钯添加到基底的表面上来改善导线生产。 钯在表面上以微量的形式设置，并且本身不形成导电层，但是根据钯的图案有助于随后将金属沉积到表面上以形成导电线。
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公开(公告)号：US07981508B1
公开(公告)日：2011-07-19
申请号：US11854274
申请日：2007-09-12
Applicant: Sunity Sharma , Jaspreet Singh Dhau
Inventor： Sunity Sharma , Jaspreet Singh Dhau
IPC: B32B9/00
CPC classification number: C23C18/2033 , C23C18/1653 , C23C18/30 , H05K1/0284 , H05K1/0393 , H05K3/182 , H05K2201/0999 , H05K2203/0709 , Y10S428/901 , Y10T428/24917 , Y10T428/2857
Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
Abstract translation: 本发明提供一种电路创建技术，其通过将活性和元素钯添加到基底的表面上来改善导线生产。 钯在表面上以微量的形式设置，并且本身不形成导电层，但是根据钯的图案有助于随后将金属沉积到表面上以形成导电线。
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公开(公告)号：US06991876B2
公开(公告)日：2006-01-31
申请号：US10264931
申请日：2002-10-04
Applicant: Subhash Narang , Susanna Ventura , Sunity Sharma
Inventor： Subhash Narang , Susanna Ventura , Sunity Sharma
CPC classification number: H01M10/052 , H01M4/364 , H01M4/38 , H01M4/40 , H01M4/405 , H01M4/58 , H01M4/583 , H01M4/60 , H01M4/621 , H01M4/625 , H01M6/16 , H01M6/181 , H01M10/0565 , H01M10/0566 , Y02T10/7011
Abstract: A battery includes an anode comprising a metal, a cathode comprising an active oxygen species, and a non-aqueous electrolyte, wherein oxidation of the metal and reduction of the active oxygen species provides the current of the battery.
Abstract translation: 电池包括包含金属的阳极，包含活性氧的阴极和非水电解质，其中金属的氧化和活性氧的还原提供电池的电流。
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公开(公告)号：US08911608B1
公开(公告)日：2014-12-16
申请号：US12779867
申请日：2010-05-13
Applicant: Sunity Sharma , Jaspreet Singh Dhau
Inventor： Sunity Sharma , Jaspreet Singh Dhau
CPC classification number: C23C18/2033 , C23C18/1653 , C23C18/30 , H05K1/0284 , H05K1/0393 , H05K3/182 , H05K2201/0999 , H05K2203/0709 , Y10S428/901 , Y10T428/24917 , Y10T428/2857
Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
Abstract translation: 本发明提供一种电路创建技术，其通过将活性和元素钯添加到基底的表面上来改善导线生产。 钯在表面上以微量的形式设置，并且本身不形成导电层，但是根据钯的图案有助于随后将金属沉积到表面上以形成导电线。
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公开(公告)号：US08124226B2
公开(公告)日：2012-02-28
申请号：US13078831
申请日：2011-04-01
Applicant: Sunity Sharma , Jaspreet Singh Dhau
Inventor： Sunity Sharma , Jaspreet Singh Dhau
IPC: B32B9/00
CPC classification number: C23C18/2033 , C23C18/1653 , C23C18/30 , H05K1/0284 , H05K1/0393 , H05K3/182 , H05K2201/0999 , H05K2203/0709 , Y10S428/901 , Y10T428/24917 , Y10T428/2857
Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
Abstract translation: 本发明提供一种电路创建技术，其通过将活性和元素钯添加到基底的表面上来改善导线生产。 钯在表面上以微量的形式设置，并且本身不形成导电层，但是根据钯的图案有助于随后将金属沉积到表面上以形成导电线。
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