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公开(公告)号：US07208967B2
公开(公告)日：2007-04-24
申请号：US11223248
申请日：2005-09-06
Applicant: Swee Cheng Ho , Teik Sean Toh , Tzyy Haw Tan
Inventor： Swee Cheng Ho , Teik Sean Toh , Tzyy Haw Tan
IPC: G01R31/02
CPC classification number: G01R31/2806 , G01R1/07328 , G01R31/048 , G01R31/2896
Abstract: Test modules, systems, and methods employing capacitors for the testing of the solder joint connections between a printed circuit board (PCB) and a socket of a device are presented in embodiments of the current invention. A test module having capacitors in parallel, and in particular embedded capacitors, can be used to test tied traces and their solder joint connections by measuring the total capacitance of the capacitors. Embodiments of the current invention present no-power tests that can be used with a variety of testing platforms and test fixtures, such as in-circuit testing (ICT) and manufacturing defect analysis (MDA.) Additionally, the test module can be used with a variety of sockets, such as a ball grid array, a pinned grid array, and a land grid array.
Abstract translation: 在本发明的实施例中给出了使用电容器测试印刷电路板（PCB）和器件插座之间的焊点连接的测试模块，系统和方法。 可以使用具有并联电容器，特别是嵌入式电容器的测试模块，通过测量电容器的总电容来测试连接迹线及其焊点连接。 本发明的实施例提出了可以与各种测试平台和测试夹具一起使用的无功功率测试，例如在线测试（ICT）和制造缺陷分析（MDA）。另外，测试模块可以与 各种插座，例如球栅阵列，钉扎网格阵列和平台网格阵列。
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公开(公告)号：US07129729B2
公开(公告)日：2006-10-31
申请号：US11223249
申请日：2005-09-06
Applicant: Swee Cheng Ho , Teik Sean Toh , Tzyy Haw Tan
Inventor： Swee Cheng Ho , Teik Sean Toh , Tzyy Haw Tan
IPC: G01R31/02
CPC classification number: G01R31/2806 , G01R1/07328 , G01R31/048 , G01R31/2896
Abstract: Test modules, systems, and methods employing capacitors for the testing of the solder joint connections between a printed circuit board (PCB) and a socket of a device are presented in embodiments of the current invention. A test module having capacitors in parallel, and in particular embedded capacitors, can be used to test tied traces and their solder joint connections by measuring the total capacitance of the capacitors. Embodiments of the current invention present no-power tests that can be used with a variety of testing platforms and test fixtures, such as in-circuit testing (ICT) and manufacturing defect analysis (MDA.) Additionally, the test module can be used with a variety of sockets, such as a ball grid array, a pinned grid array, and a land grid array.
Abstract translation: 在本发明的实施例中给出了使用电容器测试印刷电路板（PCB）和设备的插座之间的焊点连接的测试模块，系统和方法。 可以使用具有并联电容器，特别是嵌入式电容器的测试模块，通过测量电容器的总电容来测试连接迹线及其焊点连接。 本发明的实施例提出了可以与各种测试平台和测试夹具一起使用的无功功率测试，例如在线测试（ICT）和制造缺陷分析（MDA）。另外，测试模块可以与 各种插座，例如球栅阵列，钉扎网格阵列和平台网格阵列。
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公开(公告)号：US06956387B2
公开(公告)日：2005-10-18
申请号：US10641916
申请日：2003-08-15
Applicant: Swee Cheng Ho , Teik Sean Toh , Tzyy Haw Tan
Inventor： Swee Cheng Ho , Teik Sean Toh , Tzyy Haw Tan
CPC classification number: G01R31/2806 , G01R1/07328 , G01R31/048 , G01R31/2896
Abstract: Test modules, systems, and methods employing capacitors for the testing of the solder joint connections between a printed circuit board (PCB) and a socket of a device are presented in embodiments of the current invention. A test module having capacitors in parallel, and in particular embedded capacitors, can be used to test tied traces and their solder joint connections by measuring the total capacitance of the capacitors. Embodiments of the current invention present no-power tests that can be used with a variety of testing platforms and test fixtures, such as in-circuit testing (ICT) and manufacturing defect analysis (MDA.) Additionally, the test module can be used with a variety of sockets, such as a ball grid array, a pinned grid array, and a land grid array.
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