公开(公告)号：US20110024111A1

公开(公告)日：2011-02-03

申请号：US12832735

申请日：2010-07-08

Applicant: Terje Moen ,  Ezio Toffanin ,  Timo Jokela ,  Tage Thorkildsen

Inventor： Terje Moen ,  Ezio Toffanin ,  Timo Jokela ,  Tage Thorkildsen

IPC: E21B43/04 ,  E03B3/18

CPC classification number: E21B47/1015 ,  E21B43/08

Abstract: A downhole screen assembly for dispensing a tracer material and methods for using the same are provided. The downhole screen assembly can include a body having a screen disposed thereabout. The downhole screen assembly can also include chamber proximate the screen. The downhole screen assembly can further include a first member disposed about the body. The first member can have a port in fluid communication with the chamber. The downhole screen assembly can further include a second member at least partially disposed on the first member. The second member can be removable and can seal the port.

Abstract translation: 提供了用于分配示踪材料的井下筛网组件及其使用方法。 井下筛网组件可以包括具有布置在其周围的筛网的主体。 井下筛网组件还可以包括靠近筛网的室。 所述井下筛网组件还可包括围绕所述主体设置的第一构件。 第一个构件可以具有与腔室流体连通的端口。 井下筛网组件还可包括至少部分地设置在第一构件上的第二构件。 第二个构件可以是可拆卸的，可以密封端口。

公开(公告)号：US07696005B2

公开(公告)日：2010-04-13

申请号：US10572340

申请日：2004-09-15

Applicant: Antti Iihola ,  Timo Jokela

Inventor： Antti Iihola ,  Timo Jokela

IPC: H01K3/10

CPC classification number: H05K1/188 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49156 ,  H01L2924/00

Abstract: This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet (1). At least one recess (2) is made in the sheet (1) and extends through the insulating-material layer (1) as far as the conductive layer on the opposite surface (1a). A component (6) is set in the recess, with its contact surface towards the conductive layer and the component (6) is attached to the conductive layer. After this, a conductive pattern (14) is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component (6) set in the recess.

Abstract translation: 该出版物公开了一种制造电子模块的方法，其中制造从绝缘材料片（1）开始。 在片材（1）中形成至少一个凹部（2），并延伸通过绝缘材料层（1）至相对表面（1a）上的导电层。 将部件（6）设置在凹部中，其接触表面朝向导电层，并且部件（6）附接到导电层。 之后，从导电图案形成导电图案（14），所述导电图案封闭凹部，所述导电图案与设置在凹部中的部件（6）的至少一些接触区域或接触突起电连接。

公开(公告)号：US08985207B2

公开(公告)日：2015-03-24

申请号：US13154477

申请日：2011-06-07

Applicant: Tage Thorkildsen ,  Timo Jokela ,  Pavel Petukhov ,  Marius Destad ,  Edvin Eimstad Riisem

Inventor： Tage Thorkildsen ,  Timo Jokela ,  Pavel Petukhov ,  Marius Destad ,  Edvin Eimstad Riisem

IPC: E21B43/04 ,  E21B34/06

CPC classification number: E21B34/063 ,  E21B43/04 ,  E21B43/08 ,  Y10T137/1624 ,  Y10T137/1789

Abstract: A completion assembly is run downhole into a well. The assembly includes a valve and a material that is adapted to initially configure the valve to prevent fluid flow through the valve in at least one direction. The technique includes performing a downhole completion operation in the well and disintegrating the material to allow the prevented fluid flow through a nozzle of the valve. The nozzle is used to regulate production or injection in the well.

Abstract translation: 一个完井组件在井下进入一个井。 组件包括阀和材料，其适于初始构造阀以防止流体在至少一个方向上流过阀。 该技术包括在井中进行井下完井操作并使材料崩解，以防止流体流过阀的喷嘴。 喷嘴用于调节井中的生产或注入。

公开(公告)号：US20100188823A1

公开(公告)日：2010-07-29

申请号：US12753329

申请日：2010-04-02

Applicant: ANTTI IIHOLA ,  TIMO JOKELA

Inventor： ANTTI IIHOLA ,  TIMO JOKELA

IPC: H05K1/14

CPC classification number: H05K1/188 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49156 ,  H01L2924/00

Abstract: This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet (1). At least one recess (2) is made in the sheet (1) and extends through the insulating-material layer (1) as far as the conductive layer on the opposite surface (1a). A component (6) is set in the recess, with its contact surface towards the conductive layer and the component (6) is attached to the conductive layer. After this, a conductive pattern (14) is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component (6) set in the recess.

Abstract translation: 该出版物公开了一种制造电子模块的方法，其中制造从绝缘材料片（1）开始。 在片材（1）中形成至少一个凹部（2），并延伸通过绝缘材料层（1）至相对表面（1a）上的导电层。 将部件（6）设置在凹部中，其接触表面朝向导电层，并且部件（6）附接到导电层。 之后，从导电图案形成导电图案（14），所述导电图案封闭凹部，所述导电图案与设置在凹部中的部件（6）的至少一些接触区域或接触突起电连接。

公开(公告)号：US20080261338A1

公开(公告)日：2008-10-23

申请号：US11570673

申请日：2005-06-13

Applicant: Antti Ilhola ,  Timo Jokela ,  Petteri Palm ,  Risto Tuominen

Inventor： Antti Ilhola ,  Timo Jokela ,  Petteri Palm ,  Risto Tuominen

IPC: H05K13/04 ,  H01L21/00

CPC classification number: H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83385 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12044 ,  H05K1/188 ,  H05K3/025 ,  H05K2203/1469 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2924/00

Abstract: Method for manufacturing an electronic module, which electronic module includes a component (6), which is connected electrically to a conductor-pattern layer (14). In the method contact openings (17) are made in the conductor layer (4), the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6). After this, the component (6) and the conductor layer (4) are aligned relative to each other, in such a way that the contact areas (7) of the component (6) come to the positions of the contact openings (17), and the component (6) is secured. After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is made that connects the component (6) to the conductor layer (4). After the making of the contact the conductor layer (4) is patterned to form a conductor-pattern layer (14).

Abstract translation: 电子模块的制造方法，该电子模块包括与导体图案层（14）电连接的部件（6）。 在该方法中，接触开口（17）制成在导体层（4）中，其相互位置对应于部件（6）的接触区域（7）的相互位置。 之后，组件（6）和导体层（4）相对于彼此对齐，使得部件（6）的接触区域（7）到达接触开口（17）的位置， ，并且元件（6）被固定。 此后，至少在部件（6）的接触开口（17）和接触区域（7）中，制成将部件（6）连接到导体层（4）的导体材料。 在制作接触之后，将导体层（4）图案化以形成导体图案层（14）。

公开(公告)号：US20070166886A1

公开(公告)日：2007-07-19

申请号：US10572340

申请日：2004-09-15

Applicant: Antti Iihola ,  Timo Jokela

Inventor： Antti Iihola ,  Timo Jokela

IPC: H01L21/00

CPC classification number: H05K1/188 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49156 ,  H01L2924/00

Abstract: This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet (1). At least one recess (2) is made in the sheet (1) and extends through the insulating-material layer (1) as far as the conductive layer on the opposite surface (1a). A component (6) is set in the recess, with its contact surface towards the conductive layer and the component (6) is attached to the conductive layer. After this, a conductive pattern (14) is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component (6) set in the recess.

Abstract translation: 该出版物公开了一种制造电子模块的方法，其中制造从绝缘材料片（1）开始。 在片材（1）中形成至少一个凹部（2），并延伸穿过绝缘材料层（1）至相对表面（1a）上的导电层。 将部件（6）设置在凹部中，其接触表面朝向导电层，并且部件（6）附接到导电层。 之后，从导电图案形成导电图案（14），所述导电图案封闭凹部，所述导电图案与设置在凹部中的部件（6）的至少一些接触区域或接触突起电连接。

公开(公告)号：US20150124411A1

公开(公告)日：2015-05-07

申请号：US14580257

申请日：2014-12-23

Applicant: Antti Iihola ,  Timo Jokela

Inventor： Antti Iihola ,  Timo Jokela

IPC: H05K1/18 ,  H05K3/10 ,  H05K3/32 ,  H05K1/11

Abstract: This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module.

Abstract translation: 该出版物公开了一种电子模块，其包括在第一导电图案层的至少一个表面上的第一导电图案层和第一绝缘材料层，第一绝缘材料层中的至少一个开口延伸穿过第一绝缘层， 材料层，具有与接触端子的接触表面的部件，所述部件至少部分地布置在开口内，其接触端子电耦合到第一导电图案层;第二绝缘材料层，设置在第一绝缘材料层上 以及嵌入在第一和第二绝缘材料层之间的导电图案。 该出版物另外公开了一种用于制造电子模块的方法。

公开(公告)号：US08240032B2

公开(公告)日：2012-08-14

申请号：US11570673

申请日：2005-06-13

Applicant: Antti Iihola ,  Timo Jokela ,  Petteri Palm ,  Risto Tuominen

Inventor： Antti Iihola ,  Timo Jokela ,  Petteri Palm ,  Risto Tuominen

IPC: H01L24/19 ,  H05K3/30

CPC classification number: H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83385 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12044 ,  H05K1/188 ,  H05K3/025 ,  H05K2203/1469 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2924/00

Abstract: Method for manufacturing an electronic module, which electronic module includes a component (6), which is connected electrically to a conductor-pattern layer (14). In the method contact openings (17) are made in the conductor layer (4), the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6). After this, the component (6) and the conductor layer (4) are aligned relative to each other, in such a way that the contact areas (7) of the component (6) come to the positions of the contact openings (17), and the component (6) is secured. After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is made that connects the component (6) to the conductor layer (4). After the making of the contact the conductor layer (4) is patterned to form a conductor-pattern layer (14).

Abstract translation: 电子模块的制造方法，该电子模块包括与导体图案层（14）电连接的部件（6）。 在该方法中，接触开口（17）制成在导体层（4）中，其相互位置对应于部件（6）的接触区域（7）的相互位置。 之后，组件（6）和导体层（4）相对于彼此对齐，使得部件（6）的接触区域（7）到达接触开口（17）的位置， ，并且元件（6）被固定。 此后，至少在部件（6）的接触开口（17）和接触区域（7）中，制造将部件（6）连接到导体层（4）的导体材料。 在制作接触之后，将导体层（4）图案化以形成导体图案层（14）。

公开(公告)号：US20110303420A1

公开(公告)日：2011-12-15

申请号：US13154477

申请日：2011-06-07

Applicant: Tage Thorkildsen ,  Timo Jokela ,  Pavel Petukhov ,  Marius Destad ,  Edvin Eimstad Riisem

Inventor： Tage Thorkildsen ,  Timo Jokela ,  Pavel Petukhov ,  Marius Destad ,  Edvin Eimstad Riisem

IPC: E21B34/06 ,  E21B43/00

CPC classification number: E21B34/063 ,  E21B43/04 ,  E21B43/08 ,  Y10T137/1624 ,  Y10T137/1789

Abstract: A technique includes running a completion assembly downhole into a well. The assembly includes a valve and a material that is adapted to initially configure the valve to prevent fluid flow through the valve in at least one direction. The technique includes performing a downhole completion operation in the well and disintegrating the material to allow the prevented fluid flow through a nozzle of the valve. The nozzle is used to regulate production or injection in the well.

Abstract translation: 一种技术包括将井下的完井组件运行到井中。 组件包括阀和材料，其适于初始构造阀以防止流体在至少一个方向上流过阀。 该技术包括在井中进行井下完井操作并使材料崩解，以防止流体流过阀的喷嘴。 喷嘴用于调节井中的生产或注入。

公开(公告)号：US09232658B2

公开(公告)日：2016-01-05

申请号：US12753329

申请日：2010-04-02

Applicant: Antti Iihola ,  Timo Jokela

Inventor： Antti Iihola ,  Timo Jokela

IPC: H01L23/02 ,  H05K1/18 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H05K3/46

CPC classification number: H05K1/188 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49156 ,  H01L2924/00

Abstract: This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet (1). At least one recess (2) is made in the sheet (1) and extends through the insulating-material layer (1) as far as the conductive layer on the opposite surface (1a). A component (6) is set in the recess, with its contact surface towards the conductive layer and the component (6) is attached to the conductive layer. After this, a conductive pattern (14) is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component (6) set in the recess.

Abstract translation: 该出版物公开了一种制造电子模块的方法，其中制造从绝缘材料片（1）开始。 在片材（1）中形成至少一个凹部（2），并延伸通过绝缘材料层（1）至相对表面（1a）上的导电层。 将部件（6）设置在凹部中，其接触表面朝向导电层，并且部件（6）附接到导电层。 之后，从导电图案形成导电图案（14），所述导电图案封闭凹部，所述导电图案与设置在凹部中的部件（6）的至少一些接触区域或接触突起电连接。