公开(公告)号：US06695921B2

公开(公告)日：2004-02-24

申请号：US10170957

申请日：2002-06-13

Applicant: Hsi-Kuei Cheng ,  Ting-Chu Wang ,  Yu-Ku Lin ,  Chin-Te Huang ,  Huai-Tei Yang ,  Chun-Chang Chen ,  Yi-Lang Wang

Inventor： Hsi-Kuei Cheng ,  Ting-Chu Wang ,  Yu-Ku Lin ,  Chin-Te Huang ,  Huai-Tei Yang ,  Chun-Chang Chen ,  Yi-Lang Wang

IPC: B05C1302

CPC classification number: H01L21/68735 ,  H01L21/6875 ,  Y10S269/903

Abstract: An improved hoop support for semiconductor wafers reduces contamination of the wafer during edge beveling operations through the use of support pins that make only line contact with the wafer. The support pins are spaced around the periphery of the hoop and possess a triangular cross section. Two intersecting sides of the pins form an edge that defines the line contact with the wafer. These intersecting sides are preferably inclined relative to the wafer at an angle of between 60 and 80 degrees.

Abstract translation: 用于半导体晶片的改进的环形支撑通过使用仅与晶片线接触的支撑销来减少边缘斜切操作期间晶片的污染。 支撑销围绕环的周边间隔开并且具有三角形横截面。 销的两个相交的侧面形成限定与晶片的线接触的边缘。 这些相交侧优选以60度和80度之间的角度相对于晶片倾斜。