公开(公告)号：US20050135072A1

公开(公告)日：2005-06-23

申请号：US10743527

申请日：2003-12-22

Applicant: Liangfeng Xu ,  Tommi Reinikainen ,  Arni Kujala ,  Wei Ren ,  Ian Niemi ,  Ilkka Kartio

Inventor： Liangfeng Xu ,  Tommi Reinikainen ,  Arni Kujala ,  Wei Ren ,  Ian Niemi ,  Ilkka Kartio

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0265 ,  H05K3/4641 ,  H05K2201/0352 ,  H05K2201/0358

Abstract: A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive layers and insulative layers. The outermost three layers form an interconnect structure constructed of two conductive layers surrounding an insulative-coated conductive layer. The thicknesses of the various layers are optimized to have an increased resistance to mechanical shock resulting from, for instance, a drop onto a hard surface. In addition, the optimized PWB structure has a minimized thickness and an improved resistance to connection failures resulting from cyclical thermal loads.

Abstract translation: 提供了一种多层印刷线路板（PWB）结构以及包括PWB在内的移动终端，优化了降低可靠性，热负载下的可靠电气连接和最小厚度。 PWB包括交替的导电层和绝缘层。 最外面的三层形成由围绕绝缘涂覆的导电层的两个导电层构成的互连结构。 各层的厚度被优化以具有增加的抗机械冲击的抵抗力，例如由硬质表面上的液滴引起的机械冲击。 此外，优化的PWB结构具有最小化的厚度和改善的耐循环热负载引起的连接故障。

公开(公告)号：US07230187B2

公开(公告)日：2007-06-12

申请号：US10743527

申请日：2003-12-22

Applicant: Liangfeng Xu ,  Tommi Reinikainen ,  Arni Kujala ,  Wei Ren ,  Ian Niemi ,  Ilkka Kartio

Inventor： Liangfeng Xu ,  Tommi Reinikainen ,  Arni Kujala ,  Wei Ren ,  Ian Niemi ,  Ilkka Kartio

IPC: H05K1/03

CPC classification number: H05K1/0265 ,  H05K3/4641 ,  H05K2201/0352 ,  H05K2201/0358

Abstract: A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive layers and insulative layers. The outermost three layers form an interconnect structure constructed of two conductive layers surrounding an insulative-coated conductive layer. The thicknesses of the various layers are optimized to have an increased resistance to mechanical shock resulting from, for instance, a drop onto a hard surface. In addition, the optimized PWB structure has a minimized thickness and an improved resistance to connection failures resulting from cyclical thermal loads.

Abstract translation: 提供了一种多层印刷线路板（PWB）结构以及包括PWB在内的移动终端，优化了降低可靠性，热负载下的可靠电气连接和最小厚度。 PWB包括交替的导电层和绝缘层。 最外面的三层形成由围绕绝缘涂覆的导电层的两个导电层构成的互连结构。 各层的厚度被优化以具有增加的抗机械冲击的抵抗力，例如由硬质表面上的液滴引起的机械冲击。 此外，优化的PWB结构具有最小化的厚度和改善的耐循环热负载引起的连接故障。