公开(公告)号：US20120134631A1

公开(公告)日：2012-05-31

申请号：US13185883

申请日：2011-07-19

Applicant: Cheng-Feng Chiang ,  Jung-Chuan Chiang ,  Wei-Cheng Fu

Inventor： Cheng-Feng Chiang ,  Jung-Chuan Chiang ,  Wei-Cheng Fu

IPC: G02B6/36 ,  B29C45/14 ,  B29C35/08 ,  B29C70/00 ,  H01R43/00

CPC classification number: H05K3/0014 ,  B29C45/0013 ,  B29C45/0053 ,  B29C45/16 ,  B29C2045/0079 ,  B29K2995/0005 ,  B29L2031/3493 ,  C25D5/006 ,  C25D5/02 ,  C25D5/56 ,  H01L23/3677 ,  H01L23/49861 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0236 ,  H05K2203/107 ,  H01L2924/00

Abstract: A molded interconnect device (MID) with a thermal conductive property and a method for production thereof are disclosed. A thermal conductive element is set in a support element to improve the thermal conductivity of the support element, and the support element is a non-conductive support or a metallizable support. A metallization layer is formed on a surface of the support element. If a heat source is set on the metallization layer, heat produced by the heat source will pass out from the metallization layer or the support element with the thermal conductivity material element.

Abstract translation: 公开了一种具有导热性能的模制互连装置（MID）及其制造方法。 将导热元件设置在支撑元件中以改善支撑元件的导热性，并且支撑元件是非导电支撑件或金属化支撑件。 金属化层形成在支撑元件的表面上。 如果在金属化层上设置热源，则由热源产生的热量将从导电材料元件的金属化层或支撑元件中排出。

公开(公告)号：US20120074094A1

公开(公告)日：2012-03-29

申请号：US13206047

申请日：2011-08-09

Applicant: Cheng-Feng Chiang ,  Jung-Chuan Chiang ,  Wei-Cheng Fu

Inventor： Cheng-Feng Chiang ,  Jung-Chuan Chiang ,  Wei-Cheng Fu

IPC: H05K3/10 ,  H05K3/22 ,  B82Y99/00

CPC classification number: H05K3/185 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K2201/0236 ,  H05K2203/0709 ,  H05K2203/107 ,  H01L2924/00

Abstract: A manufacturing method of forming an electrical circuit on a non-conductive carrier comprises following steps. After providing an electrically non-conductive carrier, catalysts are dispersed on or in the electrically non-conductive carrier. A predetermined track structure is formed on the electrically non-conductive carrier to expose the catalysts on the surface of the predetermined track structure. The surface of the predetermined track structure containing the catalysts is metalized to form a conductor track.

Abstract translation: 在非导电载体上形成电路的制造方法包括以下步骤。 在提供非导电载体之后，催化剂分散在非导电载体上或其中。 在非导电载体上形成预定的轨道结构，以暴露预定轨道结构表面上的催化剂。 包含催化剂的预定轨道结构的表面被金属化以形成导体轨迹。