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公开(公告)号：US4806596A
公开(公告)日：1989-02-21
申请号：US871965
申请日：1986-06-09
Applicant: William D. Varnell , Thomas D. Newton , Mark D. Holte
Inventor： William D. Varnell , Thomas D. Newton , Mark D. Holte
IPC: C08F12/32 , C08F279/02 , C08F299/02 , H05K1/03 , C08F261/06
CPC classification number: C08F299/022 , C08F12/32 , C08F279/02 , H05K1/0326 , Y10S525/925
Abstract: Homogeneous thermoset copolymers which may be used in the preparation of laminates for circuitry boards will comprise a poly(vinyl benzyl ether) of a polyphenol and a polyalkadiene in which the alkadiene monomer will contain from 3 to about 8 carbon atoms. The polymers are prepared by admixing a solution of the poly(vinyl benzyl ether) of a polyphenol dissolved in an organic solvent with a solution of the polyalkadiene also dissolved in an organic solvent. The admixing is done at an elevated temperature to form the desired composite. The resulting copolymer will possess desirable characteristics such as high glass transition temperature and low dielectric constant.
Abstract translation: 可用于制备电路板层压板的均相热固性共聚物将包括多酚和聚二烯的聚（乙烯基苄基醚），其中链烯二烯单体将含有3至约8个碳原子。 通过将溶解在有机溶剂中的多酚的聚（乙烯基苄基醚）的溶液与也溶解在有机溶剂中的聚二烯的溶液混合来制备聚合物。 混合在升高的温度下进行以形成所需的复合材料。 所得共聚物将具有所需的特性，例如高玻璃化转变温度和低介电常数。
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2.发明授权Aerogel with reduced dust, static charge, and having reduced fluidity when in granular form 有权气凝胶具有减少的灰尘，静电，并且当颗粒形式时具有降低的流动性公开(公告)号：US08217087B1
公开(公告)日：2012-07-10
申请号：US13372788
申请日：2012-02-14
Applicant: Robert R. Keller , Walter L. Magee, Jr. , William D. Varnell , John W. McKenna , George N. Ghattas , Jonathan A. Beaupre , Janet D. Virr
Inventor： Robert R. Keller , Walter L. Magee, Jr. , William D. Varnell , John W. McKenna , George N. Ghattas , Jonathan A. Beaupre , Janet D. Virr
CPC classification number: C08J9/33 , C08J2205/026 , C08J2205/042 , C08J2205/05 , C08J2383/02
Abstract: An improved aerogel and a process for production of the same. The improved aerogel which has a significantly reduced dust (e.g., aerogel fines) and static charge, as compared with conventional aerogel products. The aerogel also has a “sticky” or “tacky” nature which can be used to attract any available dust, fines and/or particulate matter and also restrict flowability of aerogel granules, for example, out of a breached container and thereby minimize loss of the aerogel product through any breached opening.
Abstract translation: 改进的气凝胶及其生产方法。 与常规气凝胶产品相比，改进的气凝胶具有显着减少的灰尘（例如气凝胶细粉）和静电荷。 气凝胶还具有“粘性”或“粘性”性质，其可用于吸引任何可用的粉尘，细粒和/或颗粒物质，并且还限制气凝胶颗粒例如从破裂的容器中流出的能力，从而最小化 气凝胶产品通过任何破损的开口。
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公开(公告)号：US20120277347A1
公开(公告)日：2012-11-01
申请号：US13411823
申请日：2012-03-05
Applicant: David Bedner , William D. Varnell
Inventor： David Bedner , William D. Varnell
CPC classification number: C09K21/12 , B32B27/04 , C08G59/621 , C08K5/0066 , C08K5/1515 , C08K5/521 , C08L63/00 , C08L71/12 , H05K1/0373 , H05K2201/012 , H05K2203/122 , C08L2666/22
Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a halogen-free or substantially halogen-free epoxide and one or more phosphorated compounds. In some examples, the phosphorated compound comprises an average particle size less than 10 microns. In other examples, the phosphorated compound provides a surface area of 78.5 μm2 to about 1965 μm2. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.
Abstract translation: 公开了无卤素或基本上不含卤素的阻燃组合物。 在某些实例中，组合物包含无卤素或基本上不含卤素的环氧化物和一种或多种磷酸化化合物。 在一些实例中，磷酸化化合物包含小于10微米的平均粒度。 在其他实施例中，磷酸化化合物的表面积为78.5μm2至约1965μm2。 还公开了使用该组合物的预浸料，层压板，模制品和印刷电路板。
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公开(公告)号：US20100108364A1
公开(公告)日：2010-05-06
申请号：US12610004
申请日：2009-10-30
Applicant: Guoren He , William D Varnell , Thomas J Williams
Inventor： Guoren He , William D Varnell , Thomas J Williams
IPC: H05K1/03 , B32B27/42 , B29C65/00 , C08K5/1515
CPC classification number: C08G59/621 , C08K5/0066 , C08K5/1515 , C08K5/521 , C08L63/00 , C08L71/12 , H05K1/0373 , H05K2201/012 , H05K2203/122 , C08L2666/22
Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a polyphenylene ether, a halogen-free or substantially halogen-free polyepoxide, and one or more phosphorated compounds. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.
Abstract translation: 公开了无卤素或基本上不含卤素的阻燃组合物。 在某些实施例中，组合物包含聚苯醚，不含卤素或基本上不含卤素的聚环氧化物，以及一种或多种磷酸化化合物。 还公开了使用该组合物的预浸料，层压板，模制品和印刷电路板。
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Patent Agency Ranking5.发明授权Method for measuring degree of cure of resin in a composite material and process for making the same 失效用于测量复合材料中树脂固化程度的方法及其制备方法
公开(公告)号：US5142151A
公开(公告)日：1992-08-25
申请号：US598512
申请日：1990-10-16
Applicant: William D. Varnell , Mark J. Doty , Scott H. Richgels , Trudie M. Knox , Andrew N. Parfomak
Inventor： William D. Varnell , Mark J. Doty , Scott H. Richgels , Trudie M. Knox , Andrew N. Parfomak
CPC classification number: G01N21/314 , H05K3/022
Abstract: A method for measuring the degree of cure of a resin in a composite material such as a prepreg. The method employs an infrared spectrometer device determining frequency absorbance information of selective frequencies which are representative of the degree of cure of the resin comprised within the prepreg. The method is adaptable for use in on-line production processes for the production of such composite materials.
Abstract translation: 用于测量复合材料如预浸料中树脂的固化程度的方法。 该方法使用红外光谱仪装置来确定选择频率的频率吸收信息，其代表包含在预浸料坯内的树脂的固化程度。 该方法适用于生产这种复合材料的在线生产过程。
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公开(公告)号：US08697864B2
公开(公告)日：2014-04-15
申请号：US13411823
申请日：2012-03-05
Applicant: David Bedner , William D. Varnell
Inventor： David Bedner , William D. Varnell
IPC: C07D251/40
CPC classification number: C09K21/12 , B32B27/04 , C08G59/621 , C08K5/0066 , C08K5/1515 , C08K5/521 , C08L63/00 , C08L71/12 , H05K1/0373 , H05K2201/012 , H05K2203/122 , C08L2666/22
Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a halogen-free or substantially halogen-free epoxide and one or more phosphorated compounds. In some examples, the phosphorated compound comprises an average particle size less than 10 microns. In other examples, the phosphorated compound provides a surface area of 78.5 μm2 to about 1965 μm2. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.
Abstract translation: 公开了无卤素或基本上不含卤素的阻燃组合物。 在某些实例中，组合物包含无卤素或基本上不含卤素的环氧化物和一种或多种磷酸化化合物。 在一些实例中，磷酸化化合物包含小于10微米的平均粒度。 在其他实施例中，磷酸化化合物的表面积为78.5μm2至约1965μm2。 还公开了使用该组合物的预浸料，层压板，模制品和印刷电路板。
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公开(公告)号：US07687556B2
公开(公告)日：2010-03-30
申请号：US10952033
申请日：2004-09-28
Applicant: Guoren He , William D. Varnell , Thomas J. Williams
Inventor： Guoren He , William D. Varnell , Thomas J. Williams
CPC classification number: C08G59/621 , C08K5/0066 , C08K5/1515 , C08K5/521 , C08L63/00 , C08L71/12 , H05K1/0373 , H05K2201/012 , H05K2203/122 , C08L2666/22
Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a polyphenylene ether, a halogen-free or substantially halogen-free polyepoxide, and one or more phosphorated compounds. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.
Abstract translation: 公开了无卤素或基本上不含卤素的阻燃组合物。 在某些实施例中，组合物包含聚苯醚，不含卤素或基本上不含卤素的聚环氧化物，以及一种或多种磷酸化化合物。 还公开了使用该组合物的预浸料，层压板，模制品和印刷电路板。
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8.发明授权Homogeneous thermoset copolymer from poly (vinyl benzyl ether) and dicyanate ester 失效来自聚（乙烯基苄基醚）和二氰酸酯的均相热固性共聚物
公开(公告)号：US4665154A
公开(公告)日：1987-05-12
申请号：US871337
申请日：1986-06-06
Applicant: William D. Varnell , Thomas D. Newton
Inventor： William D. Varnell , Thomas D. Newton
CPC classification number: C08G65/48 , C08F290/062 , C08J5/24 , H05K1/0326 , Y10T428/31504
Abstract: Novel compositions of matter comprise homogeneous thermoset copolymers resulting from the reaction between a poly(vinyl benzyl ether) of a polyphenol and a dicyanate ester of a polyether of a polyphenol may be used as components in laminates which are employed in electronic circuit boards. The copolymers will impart desirable characteristics such as high glass transition temperatures and low dielectric constants to the finished product.
Abstract translation: 物质的新型组合物包括由多酚的聚（乙烯基苄基醚）与多酚的聚醚的双氰酸酯之间的反应产生的均匀的热固性共聚物可以用作电子电路板中使用的层压体中的组分。 共聚物将赋予最终产品所需的特性，例如高玻璃化转变温度和低介电常数。
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公开(公告)号：US08129456B2
公开(公告)日：2012-03-06
申请号：US11269132
申请日：2005-11-08
Applicant: David Bedner , William D. Varnell
Inventor： David Bedner , William D. Varnell
CPC classification number: C09K21/12 , B32B27/04 , C08G59/621 , C08K5/0066 , C08K5/1515 , C08K5/521 , C08L63/00 , C08L71/12 , H05K1/0373 , H05K2201/012 , H05K2203/122 , C08L2666/22
Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a halogen-free or substantially halogen-free epoxide and one or more phosphorated compounds. In some examples, the phosphorated compound comprises an average particle size less than 10 microns. In other examples, the phosphorated compound provides a surface area of 78.5 μm2 to about 1965 μm2. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.
Abstract translation: 公开了无卤素或基本上不含卤素的阻燃组合物。 在某些实例中，组合物包含无卤素或基本上不含卤素的环氧化物和一种或多种磷酸化化合物。 在一些实例中，磷酸化化合物包含小于10微米的平均粒度。 在其他实施例中，磷酸化化合物的表面积为78.5μm2至约1965μm2。 还公开了使用该组合物的预浸料，层压板，模制品和印刷电路板。
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