Abstract:
The present invention sets forth an apparatus for supporting multiple digital display interface standards. In one embodiment, the apparatus includes a graphics processing unit (GPU) configured to determine a display device type of a display device that is in connection with a digital display interconnect, receive a display device information associated with the display device, and output a first data signal to the display device. The display device is of display port (DP) digital display interface standard and the digital display interconnect is of digital visual interface (DVI) digital display interface standard. The apparatus further includes a removable adaptor circuitry between the display device and the digital display interconnect.
Abstract:
One embodiment of the present invention sets forth an electronic assembly, which comprises a printed circuit board having at least one opening, an electronic component mounted on a first side of the printed circuit board, and a thermal dissipation structure including at least one heat sink having a first surface and a second surface. The first surface includes a first region coupled with a surface of the electronic component, and one or more second region provided with at least a heat dissipating member that is exposed through the opening on a second side of the printed circuit board.
Abstract:
A heat dissipation method for microprocessors to dissipate heat for a microprocessor of low power consumption includes a fan directly mounting on the microprocessor. The fan directs external cold air to the microprocessor to perform heat exchange and to achieve heat dissipation object.
Abstract:
An exemplary method for manufacturing a TFT array substrate (20) typically for use in a liquid crystal display (LCD) includes: providing an insulating substrate (30) comprising a TFT area (31), a display area (32) and a capacitor area (33); forming a gate electrode (232) at the TFT area and a capacitor electrode (222) at the capacitor area; forming an insulating layer (203), an amorphous silicon layer (204), and a doped amorphous silicon layer (205) in turn on the insulating substrate; etching the doped amorphous silicon, the amorphous silicon and the insulating layer at the display area and the capacitor area; forming a source electrode (231) and a drain electrode (233) at the TFT area; forming a passivation layer (225) at the capacitor area; and forming a pixel electrode (221) on the substrate, the pixel electrode covering the display area, the capacitor area, and part of the TFT area.
Abstract:
One embodiment of the present invention sets forth an electronic assembly, which comprises a printed circuit board having at least one opening, an electronic component mounted on a first side of the printed circuit board, and a thermal dissipation structure including at least one heat sink having a first surface and a second surface. The first surface includes a first region coupled with a surface of the electronic component, and one or more second region provided with at least a heat dissipating member that is exposed through the opening on a second side of the printed circuit board.
Abstract:
An exemplary method for manufacturing a TFT array substrate (20) typically for use in a liquid crystal display (LCD) includes: providing an insulating substrate (30) comprising a TFT area (31), a display area (32) and a capacitor area (33); forming a gate electrode (232) at the TFT area and a capacitor electrode (222) at the capacitor area; forming an insulating layer (203), an amorphous silicon layer (204), and a doped amorphous silicon layer (205) in turn on the insulating substrate; etching the doped amorphous silicon, the amorphous silicon and the insulating layer at the display area and the capacitor area; forming a source electrode (231) and a drain electrode (233) at the TFT area; forming a passivation layer (225) at the capacitor area; and forming a pixel electrode (221) on the substrate, the pixel electrode covering the display area, the capacitor area, and part of the TFT area.
Abstract:
An exemplary thin film transistor substrate (200) includes a substrate (201), a gate (212), a gate insulating layer (203), an amorphous silicon layer (214), a pixel electrode (216), a drain (217), and a source (218). The gate is formed at the gate. The gate insulating layer is formed at the gate. The amorphous silicon layer is formed at the gate insulating layer. The transparent conductive layer is formed at the amorphous silicon layer. The pixel electrode is formed at the amorphous silicon layer. The drain is formed at the pixel electrode. The source is formed at the transparent conductive layer.
Abstract:
An exemplary method for fabricating a thin film transistor array substrate (200) includes: providing an insulating substrate (201); coating a transparent conductive layer (202) and a gate metal layer (203) on the substrate; forming a gate electrode (213) and a pixel electrode (212) using a first photo-mask process; forming a gate insulating layer (204), an amorphous silicon layer (205), a doped amorphous silicon layer (206), and a source/drain metal layer (207) on the substrate; forming a plurality of source electrodes (227) and a plurality of drain electrodes (228) using a second photo-mask process; depositing a metal layer (208) on the substrate and the pixel electrodes; and forming a passivation layer (209) on the source electrodes, the drain electrodes and the channels and a plurality of metal contact layers (218) using a third photo-mask process.
Abstract:
The present invention provides a device and a method for monitoring a component arranged inside a computer. The monitoring device comprises: a detection unit, an I2C bus, a display panel, a processor, and a regulation unit. The detection unit is used for detecting and acquiring the information of operation statuses of components inside the computer. The I2C bus coupled to the detection unit is used for transmitting the forgoing detected information. The display panel arrange at a shell of the computer is used for displaying the foregoing information. The processor will receive the information from the I2C bus and thereby display the received information on the display panel. The regulation unit will issue a first control signal to the processor for requiring the processor to regulate the operation status of a component arranged inside the computer, and the processor will issue a second control signal to the detection unit through the I2C bus according the first control signal so as to regulate the operation status of a component arranged inside the computer.
Abstract:
A method for manufacturing a LCD panel includes providing a substrate defining a TFT region and a pixel region; forming a transparent conductive layer and a first metal layer on the substrate in that order; forming a gate line in the TFT region, and a pixel electrode within the pixel region via a first photo-etching process; forming an insulating layer and a semiconductor layer on the substrate in that order; removing the insulating layer and the semiconductor layer from the pixel region; removing the first metal layer from the pixel region; forming a second metal layer on the substrate; forming a source electrode and a drain electrode in the TFT region via a second photo-etching process, and forming a protecting layer above the substrate.