公开(公告)号：US12087623B1

公开(公告)日：2024-09-10

申请号：US18422346

申请日：2024-01-25

Applicant: Yield Engineering Systems, Inc.

Inventor： Ramakanth Alapati ,  M Ziaul Karim ,  Christopher Lane

IPC: H01L21/768 ,  H01L23/15 ,  H01L23/498 ,  H01L23/522 ,  H01L23/532 ,  H01L23/538

CPC classification number: H01L21/76831 ,  H01L21/76822 ,  H01L23/49894 ,  H01L23/5329 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5226 ,  H01L23/5384

Abstract: A method of improving interfacial adhesion of a copper-glass interface in a Through Glass Via (TGV) of an electronic device includes coating an internal wall of a TGV with a curable polymer material having a viscosity less than 30 Poise. The coating is cured to form a dielectric liner having a tensile strength greater than about 8 Mpa and a dielectric loss less than about 0.002. A layer of copper may then be deposited on the dielectric liner.

公开(公告)号：US20240181590A1

公开(公告)日：2024-06-06

申请号：US18075997

申请日：2022-12-06

Applicant: Yield Engineering Systems, Inc.

Inventor： Alan Lee Stone ,  Kevin Bruce McGillivray ,  Christopher Lane

IPC: B24B7/10 ,  B24B7/08 ,  B24B41/00 ,  B24B57/02

CPC classification number: B24B7/10 ,  B24B7/08 ,  B24B41/002 ,  B24B57/02

Abstract: A coating removal apparatus includes multiple pairs of rotatable brushes spaced apart from each other in a first direction. Each pair of brushes may include two opposing brushes that are configured to rotate about a common axis and move towards and away from each other in a second direction transverse to the first direction. When a coated panel is positioned between the two opposing brushes, first portions of the brushes may separably engage with and rotate on opposite surfaces of the coated panel. The apparatus may also include one or more liquid tanks configured to contain a liquid. When the tanks contain the liquid and when the coated panel is positioned between the two opposing brushes, second portions of the two brushes may at least contact the liquid in the liquid tanks.

公开(公告)号：US11444053B2

公开(公告)日：2022-09-13

申请号：US16851977

申请日：2020-04-17

Applicant: Yield Engineering Systems, Inc.

Inventor： M Ziaul Karim ,  Randy Hall ,  Peter Krotov

IPC: B23K1/00 ,  H01L23/00 ,  B23K1/008 ,  B23K1/005 ,  B23K101/40

Abstract: The present disclosure is directed to a compact vertical oven for reflow of solder bumps for backend processes in semiconductor wafer assembly and packaging. This disclosure describes a vertical oven which uses a plurality of wafers (e.g., an example value is 50-100 wafers) in a batch with controlled injection of the reducing agent (e.g. formic acid), resulting in a process largely free of contamination. This disclosure describes controlled formic acid flow through a vertical system using laminar flow technology in a sub-atmospheric pressure environment, which is not currently available in the industry. The efficacy of the process depends on effective formic acid vapor delivery, integrated temperature control during heating and cooling, and careful design of the vapor flow path with exhaust. Zone-dependent reaction dynamics managed by vapor delivery process, two-steps temperature ramp control, and controlled cooling process and formic acid content ensures the effective reaction without any flux.

公开(公告)号：US11367640B2

公开(公告)日：2022-06-21

申请号：US16663319

申请日：2019-10-24

Applicant: Yield Engineering Systems, Inc.

Inventor： William Moffat ,  Craig Walter McCoy

IPC: F27D1/18 ,  H01L21/67 ,  H01L21/673 ,  F27D5/00 ,  H01L21/02 ,  H01L21/677 ,  F27D7/06

Abstract: A process chamber system adapted for both vacuum process steps and steps at pressures higher than atmospheric pressure. The chamber door may utilize a double door seal which allows for high vacuum in the gap between the seals such that the sealing force provided by the high vacuum in the seal gap is higher than the opposing forces due to the pressure inside the chamber and the weight of the components.

公开(公告)号：US20210265301A1

公开(公告)日：2021-08-26

申请号：US16851977

申请日：2020-04-17

Applicant: Yield Engineering Systems, Inc.

Inventor： M Ziaul Karim ,  Randy Hall ,  Peter Krotov

IPC: H01L23/00 ,  B23K1/008 ,  B23K1/005

Abstract: The present disclosure is directed to a compact vertical oven for reflow of solder bumps for backend processes in semiconductor wafer assembly and packaging. This disclosure describes a vertical oven which uses a plurality of wafers (e.g., an example value is 50-100 wafers) in a batch with controlled injection of the reducing agent (e.g. formic acid), resulting in a process largely free of contamination. This disclosure describes controlled formic acid flow through a vertical system using laminar flow technology in a sub-atmospheric pressure environment, which is not currently available in the industry. The efficacy of the process depends on effective formic acid vapor delivery, integrated temperature control during heating and cooling, and careful design of the vapor flow path with exhaust. Zone-dependent reaction dynamics managed by vapor delivery process, two-steps temperature ramp control, and controlled cooling process and formic acid content ensures the effective reaction without any flux.

公开(公告)号：US20210013013A1

公开(公告)日：2021-01-14

申请号：US16888732

申请日：2020-05-31

Applicant: YIELD ENGINEERING SYSTEMS, INC.

Inventor： William Moffat ,  Craig Walter McCoy

IPC: H01J37/32 ,  H01L21/02 ,  H01L21/3065

Abstract: A device and method of spreading plasma which allows for plasma etching over a larger range of process chamber pressures. A plasma source, such as a linear inductive plasma source, may be choked to alter back pressure within the plasma source. The plasma may then be spread around a deflecting disc which spreads the plasma under a dome which then allows for very even plasma etch rates across the surface of a substrate. The apparatus may include a linear inductive plasma source above a plasma spreading portion which spreads plasma across a horizontally configured wafer or other substrate. The substrate support may include heating elements adapted to enhance the etching.

公开(公告)号：US20200234986A1

公开(公告)日：2020-07-23

申请号：US16663319

申请日：2019-10-24

Applicant: Yield Engineering Systems, Inc.

Inventor： William Moffat ,  Craig Walter McCoy

IPC: H01L21/673 ,  H01L21/67 ,  F27D5/00 ,  F27D1/18 ,  H01L21/02 ,  H01L21/677

Abstract: A process chamber system adapted for both vacuum process steps and steps at pressures higher than atmospheric pressure. The chamber door may utilize a double door seal which allows for high vacuum in the gap between the seals such that the sealing force provided by the high vacuum in the seal gap is higher than the opposing forces due to the pressure inside the chamber and the weight of the components.

公开(公告)号：US10147617B2

公开(公告)日：2018-12-04

申请号：US15206318

申请日：2016-07-11

Applicant: YIELD ENGINEERING SYSTEMS, INC.

Inventor： William Moffat

IPC: H01L21/67 ,  B32B27/28

Abstract: A process for the drying, and subsequent imidization, of polyimide precursors which minimizes or eliminates voids and which minimizes or eliminates discoloration. The process uses a sequential set of descending pressure operations that allow for time efficient processing of wafers. The set of descending pressure operations are interspersed with evacuation processes using heated gasses, which combine heating and byproduct evacuation. The process results in layers with reduced or eliminated voiding, discoloration, and solvent retention.

公开(公告)号：US20180308732A1

公开(公告)日：2018-10-25

申请号：US15919169

申请日：2018-03-12

Applicant: YIELD ENGINEERING SYSTEMS, INC.

Inventor： WILLIAM MOFFAT ,  CRAIG WALTER MCCOY

IPC: H01L21/673 ,  H01L21/67 ,  H01L21/02 ,  F27D5/00 ,  F27D1/18

CPC classification number: H01L21/67376 ,  F27D1/1866 ,  F27D5/0037 ,  F27D2007/063 ,  H01L21/02046 ,  H01L21/67034

Abstract: A process chamber system adapted for both vacuum process steps and steps at pressures higher than atmospheric pressure. The chamber door may utilize a double door seal which allows for high vacuum in the gap between the seals such that the sealing force provided by the high vacuum in the seal gap is higher than the opposing forces due to the pressure inside the chamber and the weight of the components.

公开(公告)号：US20250114824A1

公开(公告)日：2025-04-10

申请号：US18377147

申请日：2023-10-05

Applicant: Yield Engineering Systems, Inc.

Inventor： Rajeev Bajaj ,  Al Stone

IPC: B08B1/02 ,  B08B1/00 ,  B08B1/04 ,  B08B3/02 ,  B08B3/08

Abstract: A substrate cleaning device includes a double-sided scrubber that directs a liquid to a substrate as it moves back-and-forth between a pair of rotating brushes. The device may also include a first set of nozzles and a second set of nozzles. The first set of nozzles may be configured to spray a first liquid at an interface between the substrate and rotating brushes and the second set of nozzles may be configured to spray a second liquid at the interface as the substrate moves back-and-forth between the pair of rotating brushes.