公开(公告)号：US20120168220A1

公开(公告)日：2012-07-05

申请号：US13281264

申请日：2011-10-25

Applicant: Han Ul Lee ,  Byung Bae SEO ,  Chang Sup RYU ,  Yong Sam LEE

Inventor： Han Ul Lee ,  Byung Bae SEO ,  Chang Sup RYU ,  Yong Sam LEE

IPC: H05K1/11 ,  H01K3/10

CPC classification number: H05K3/429 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/107 ,  H05K2203/1572 ,  Y10T29/49165

Abstract: Disclosed herein are a multi-layer printed circuit board and a method of manufacturing the same. In the multi-layer printed circuit board and the method of manufacturing the same, circuit layers formed in a plurality of insulating layers are electrically interconnected through vias formed in a lump, thereby making it possible to secure bonding reliability of an interlayer circuit layer and more stably secure performance of the printed circuit board. In addition, since a stacked type via structure may be implemented by performing a via hole drilling process, a desmear process, and a copper plating process only one time after an insulating layer and an circuit layer are stacked, a manufacturing process, a manufacturing time, and manufacturing costs of the stacked type via structure may be reduced.

Abstract translation: 这里公开了多层印刷电路板及其制造方法。 在多层印刷电路板及其制造方法中，形成在多个绝缘层中的电路层通过一体形成的通孔电连接，从而可以确保层间电路层的结合可靠性和更多 稳定地确保印刷电路板的性能。 此外，由于堆叠型通孔结构可以通过在绝缘层和电路层堆叠后一次进行通孔钻孔工艺，去污工艺和镀铜处理来实现，制造工艺，制造时间 ，并且可以减小层叠型通孔结构的制造成本。