公开(公告)号：US20080165514A1

公开(公告)日：2008-07-10

申请号：US11762365

申请日：2007-06-13

Applicant: Yong-won HWANG

Inventor： Yong-won HWANG

IPC: H05K3/00 ,  H05K7/02

CPC classification number: H05K1/0218 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/09345 ,  Y10T29/4913

Abstract: A printed circuit board (PCB) having a multi-layered structure for improving shielding against electromagnetic interference, the PCB including one or more signal layers and an outer grounding layer located on an outermost surface of the PCB. Accordingly, the radiation of electromagnetic waves to the outside from the outer grounding layer is prevented.

Abstract translation: 一种具有用于改善屏蔽电磁干扰的多层结构的印刷电路板（PCB），该PCB包括一个或多个信号层和位于该PCB的最外表面上的外部接地层。 因此，防止了从外部接地层向外部的电磁波的辐射。