公开(公告)号：US5104707A

公开(公告)日：1992-04-14

申请号：US534716

申请日：1990-06-07

Applicant: Akihiko Watanabe ,  Yuuki Numazaki ,  Naoto Kanno ,  Hirokazu Inoguchi

Inventor： Akihiko Watanabe ,  Yuuki Numazaki ,  Naoto Kanno ,  Hirokazu Inoguchi

IPC: B29C45/14 ,  H05K3/20

CPC classification number: B29C45/14827 ,  H05K3/20 ,  B29K2995/0005 ,  H05K2201/09118 ,  H05K2203/0156 ,  Y10S428/901 ,  Y10T428/1438 ,  Y10T428/24917 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31678

Abstract: A transfer sheet for making a printed-wiring board by injection molding which is free from circuit damage during injection molding and has excellent releasability comprises a carrier film, a copper foil circuit, and a releasing layer provided between the carrier film and the copper foil circuit. Preferably, said releasing layer has a T-type peeling strength between the carrier film and the copper foil circuit of 0.025-0.25 kg/25 mm. A method for producing such transfer sheet comprises coating a releasing layer on a carrier film, then contact-bonding a copper foil thereto with heat, pattern-printing an etching resist on the resulting laminate film, and subjecting it to etching to form a copper foil circuit.