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    MULTILAYER PRESSURE-SENSITIVE ADHESIVE ASSEMBLY AND RELATED PROCESS
    2.
    发明申请
    MULTILAYER PRESSURE-SENSITIVE ADHESIVE ASSEMBLY AND RELATED PROCESS 有权

    公开(公告)号：US20240409790A1

    公开(公告)日：2024-12-12

    申请号：US18699456

    申请日：2022-10-07

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Roman Konietzny ,  Pierre R. Bieber ,  René Kuhlmann ,  Thomas Apeldorn ,  Achim Boehme ,  Michael Kempf ,  Stijn A.M. D'Hollander

    IPC: C09J7/38 ,  C09J7/26

    Abstract: The multilayer pressure sensitive adhesive assembly includes a polymeric foam layer and a first pressure sensitive adhesive layer. The polymeric foam includes a plurality of activated carbon particles. The first pressure sensitive adhesive layer includes a multi-arm block copolymer in an amount greater than 20 percent by weight, based on the weight of the first pressure sensitive adhesive layer, and at least one hydrocarbon tackifier. The multi-arm block copolymer has formula Qn-Y, in which Q represents an arm of the multi-arm block copolymer, each arm independently having the formula G-R, n represents the number of arms and is at least 3, and Y is the residue of a multifunctional coupling agent. Each R is independently a rubbery block including a polymerized conjugated diene, a hydrogenated derivative of a polymerized conjugated diene, or combinations thereof, and each G is a glassy block including a polymerized monovinyl aromatic monomer.

    Pressure-sensitive adhesive compositions for manufacturing electronic devices
    3.
    发明授权
    Pressure-sensitive adhesive compositions for manufacturing electronic devices 有权

    公开(公告)号：US11286407B2

    公开(公告)日：2022-03-29

    申请号：US16471595

    申请日：2017-12-20

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： John W. McAllister ,  Jingjing Ma ,  Zhong Chen ,  Pierre R. Bieber ,  Petra M. Stegmaier ,  Eike H. Klünker

    IPC: H01L29/08 ,  C09J11/08 ,  C09J7/28 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56

    Abstract: The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.

    HOT MELT PROCESS FOR MANUFACTURING A PRESSURE SENSITIVE ADHESIVE HAVING LOW VOC CHARACTERISTICS
    4.
    发明申请
    HOT MELT PROCESS FOR MANUFACTURING A PRESSURE SENSITIVE ADHESIVE HAVING LOW VOC CHARACTERISTICS 有权

    公开(公告)号：US20210324247A1

    公开(公告)日：2021-10-21

    申请号：US17247194

    申请日：2019-06-20

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Niklas M. Matzeit ,  Eike H. Klünker ,  Pierre R. Bieber

    IPC: C09J133/08

    Abstract: The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus; b) providing a hot melt processable pressure sensitive adhesive composition contained within a packaging material and forming a packaged pressure sensitive adhesive composition; c) providing a thermal crosslinking system; d) mixing the hot melt processable pressure sensitive adhesive composition and the thermal crosslinking system in the hot melt mixing apparatus thereby forming a hot melt blend, wherein the packaging material is melted and mixable with the hot melt blend; e) removing the hot melt blend from the hot melt mixing apparatus; and f) optionally, thermally crosslinking the hot melt blend. In another aspect, the present disclosure relates to a pressure sensitive adhesive comprising a hot melt processable pressure sensitive adhesive composition and a thermal crosslinking system as described above, and wherein the pressure sensitive adhesive has a Volatile Organic Compound (VOC) value of less than 1500 ppm, less than 1200 ppm, less than 1000 ppm, less than 800 ppm, less than 600 ppm, less than 500 ppm, less than 400 ppm, or even less than 300 ppm, when measured by thermal desorption analysis according to test method VDA278.

    Adhesives comprising reaction product of halogenated poly(isobutylene) copolymers and polyamines
    8.
    发明授权
    Adhesives comprising reaction product of halogenated poly(isobutylene) copolymers and polyamines 有权
    包括卤化聚（异丁烯）共聚物和多胺的反应产物的粘合剂

    公开(公告)号：US09422464B2

    公开(公告)日：2016-08-23

    申请号：US14394342

    申请日：2013-02-06

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Hae-Seung Lee ,  Pierre R. Bieber ,  Joon Chatterjee ,  Siegfried R. Goeb ,  Babu N. Gaddam

    IPC: C09J7/02 ,  C09J123/20 ,  C09J123/36 ,  C09J123/22 ,  C08L23/22

    CPC classification number: C09J123/36 ,  C08L23/22 ,  C09J7/20 ,  C09J123/20 ,  C09J123/22 ,  C09J2423/00 ,  Y10T428/2852

    Abstract: Adhesive composition are described comprising the reaction product of at least one halogenated copolymer of isobutylene wherein halogen atoms of the copolymer are replaced by a polyamine having a melting point greater than 25° C., thereby crosslinking the copolymer. The isobutylene copolymer comprises halogenated repeat units derived from isoprene, butadiene, para-alkyl styrene, or a combination thereof. The adhesive composition comprises a copolymer of isobutylene repeat units and second repeat units selected from alkene repeat units, para-methyl styrene repeat units, or a combination thereof wherein at least a portion of the second repeat units are directly bonded to one another with a polyamine crosslinker having a melting point greater than 25° C. Also described are adhesive articles, such as tapes, comprising such adhesives.

    Abstract translation: 描述了粘合剂组合物，其包含至少一种异丁烯的卤化共聚物的反应产物，其中共聚物的卤素原子被熔点大于25℃的多胺代替，从而使共聚物交联。 异丁烯共聚物包含衍生自异戊二烯，丁二烯，对 - 烷基苯乙烯或其组合的卤代重复单元。 粘合剂组合物包含异丁烯重复单元和选自烯烃重复单元，对甲基苯乙烯重复单元或其组合的第二重复单元的共聚物，其中至少一部分第二重复单元通过多胺直接键合 具有熔点大于25℃的交联剂。还描述了包含这种粘合剂的粘合剂制品，例如胶带。

    PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS FOR MANUFACTURING ELECTRONIC DEVICES
    9.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS FOR MANUFACTURING ELECTRONIC DEVICES 有权

    公开(公告)号：US20210130661A1

    公开(公告)日：2021-05-06

    申请号：US16471595

    申请日：2017-12-20

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： John W. McAllister ,  Jingjing Ma ,  Zhong Chen ,  Pierre R. Bieber ,  Petra M. Stegmaier ,  Eike H. Klünker

    IPC: C09J11/08 ,  C09J7/28 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56

    Abstract: The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.

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