公开(公告)号：US20240355530A1

公开(公告)日：2024-10-24

申请号：US18762731

申请日：2024-07-03

Applicant: ABB SCHWEIZ AG

Inventor： Wengong Deng ,  Huan Shi ,  Wei Liu

IPC: H01F27/28

CPC classification number: H01F27/2804 ,  H01F2027/2833

Abstract: Embodiments of present disclosure relate to an input/output (I/O) module and a control system. The I/O module includes at least two coreless communication transformers arranged in parallel, each coreless communication transformer which includes a printed circuit board. The I/O module also includes a primary winding and a secondary winding disposed on opposite sides of the PCB, and at least two closed wires disposed coaxially on the PCB and arranged around the primary winding or inside the primary winding. The crosstalk of the I/O module is reduced and the communication robustness of the I/O module is improved.