Integral Interface Seal
    1.
    发明申请

    公开(公告)号:US20250112003A1

    公开(公告)日:2025-04-03

    申请号:US18476829

    申请日:2023-09-28

    Applicant: ABB Schweiz AG

    Abstract: An integrally formed interface seal, including a base including a sidewall configured to surround at least a portion of a disconnector switch housing configured to house an interface pad, a first lip extending inward relative to the sidewall, and a second lip from the first lip and away from the first lip parallel to the sidewall. The second lip is configured to be compressed against the disconnector switch housing to hermetically seal a conductor secured to the interface pad from an external environment.

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