公开(公告)号：US20240365515A1

公开(公告)日：2024-10-31

申请号：US18388202

申请日：2023-11-09

Applicant: ACBEL POLYTECH INC.

Inventor： Chia-Hao LIN ,  Tse-Jung KUO ,  Min-Che TU

IPC: H05K7/20

CPC classification number: H05K7/2039

Abstract: A heat dissipating structure of a power supply is disposed on an inner side of a casing and has two heat dissipating covers configured to be connected with each other, and a heat dissipating sleeve annularly mounted on and around the two heat dissipating covers and disposed between the heat dissipating covers and the casing. The heat dissipating sleeve is able to be bent according to an internal structure of the casing for attaching to the casing and increasing contact area between the heat dissipating sleeve and the casing. The heat from an interior of the power supply can be conducted to the two heat dissipating covers for a first heat spreading and then to the heat dissipating sleeve for a second heat spreading. Thus, speed of heat dissipation to an exterior of the casing can be increased and temperature inside the power supply can be effectively reduced.

公开(公告)号：US20240396253A1

公开(公告)日：2024-11-28

申请号：US18388199

申请日：2023-11-09

Applicant: ACBEL POLYTECH INC.

Inventor： Chia-Hao LIN ,  Tse-Jung KUO ,  Min-Che TU

IPC: H01R13/502

Abstract: A power plug with thermal insulation-function has an output connector having a wire connecting end, an internal module, a housing, and an external module. The internal module has an outer surface and encloses the wire connecting end of the output connector. A plurality of recesses are concavely formed on the outer surface of the internal module. The housing encloses the outer surface of the internal module, wherein a plurality of gas cells are formed between the housing and each of the plurality of recesses. The external module encloses the housing and the internal module. Air can be stored in the gas cells for insulating thermal conduction from inside to outside. Heat can hardly transfer from the internal module to the external module to dissipate via the outer surface of the external module, thereby lowering the surface temperature of the external module to avoid burning the user.