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公开(公告)号:US20200010762A1
公开(公告)日:2020-01-09
申请号:US16572842
申请日:2019-09-17
Applicant: ADEKA CORPORATION
Inventor: Junro ISHIZAKI , Daisuke OMIYA
Abstract: An etching method that includes using the etching liquid composition containing (A) 0.1 to 15 mass % of hydrogen peroxide, (B) 0.01 to 1 mass % of a fluoride ion source, (C) 2-hydroxyethane sulfonic acid or a salt thereof in an amount of 0.1 to 20 mass % in terms of organic sulfonic acid, (D) 0.01 to 5 mass % of at least one compound selected from the group consisting of azole-based compounds and compounds having a structure that has a 6-membered heterocycle including at least one nitrogen atom and three double bonds, and (E) water, is provided.
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公开(公告)号:US20180237923A1
公开(公告)日:2018-08-23
申请号:US15754020
申请日:2016-08-23
Applicant: ADEKA CORPORATION
Inventor: Junro ISHIZAKI , Daisuke OMIYA
IPC: C23F1/20 , C23F1/26 , H01L21/3213 , H01L23/532
CPC classification number: C23F1/20 , C23F1/14 , C23F1/18 , C23F1/26 , C23F1/44 , H01L21/30604 , H01L21/308 , H01L21/32134 , H01L23/53214 , H01L23/53257
Abstract: An etching liquid composition that contains (A) 0.1 to 15 mass % of hydrogen peroxide, (B) 0.01 to 1 mass % of a fluoride ion source, (C) an organic sulfonic acid compound represented by general formula (I) described in the specification or a salt thereof in an amount of 0.1 to 20 mass % in terms of organic sulfonic acid, (D) 0.01 to 5 mass % of at least one type of compound selected from among azole-based compounds and compounds having a structure that has a 6-membered heterocycle including at least one nitrogen atom and three double bonds, and (E) water; and an etching method that includes using the etching liquid composition are provided.
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