公开(公告)号：US20240030037A1

公开(公告)日：2024-01-25

申请号：US18023158

申请日：2021-08-23

Applicant: ADEKA CORPORATION

Inventor： Yutaro AOKI ,  Masayuki KIMURA ,  Atsushi YAMASHITA

IPC: H01L21/311

CPC classification number: H01L21/31122

Abstract: Provided is a method of etching a metal oxide film in a laminate including a substrate and the metal oxide film formed on a surface thereof by an atomic layer etching method, the method including: a first step of introducing, into a treatment atmosphere storing the laminate, at least one oxidizable compound selected from the group consisting of: an alcohol compound; an aldehyde compound; and an ester compound; and a second step of introducing an oxidizing gas into the treatment atmosphere after the first step.