公开(公告)号：US20200224324A1

公开(公告)日：2020-07-16

申请号：US16641869

申请日：2018-08-23

Applicant: ADEKA CORPORATION

Inventor： Shinichi TANAKA ,  Shouhei TOYODA ,  Shinya ISHIWATA ,  Takuya TAKAHASHI ,  Yong Gyun KIM

IPC: C25D3/38 ,  C07C237/10 ,  C08G83/00

Abstract: The present invention provides an additive for electrolytic plating solutions, containing at least one selected from compounds represented by the chemical formulas (1) to (4) given in the present description, an electrolytic plating solution containing the additive for electrolytic plating solutions, and an electrolytic plating method that uses the electrolytic plating solution.