公开(公告)号：US20240317967A1

公开(公告)日：2024-09-26

申请号：US18262521

申请日：2022-01-25

Applicant: ADEKA CORPORATION

Inventor： Takeshi ENDO ,  Yasuyuki MORI ,  Ken-ichi TAMASO ,  Ryo OGAWA ,  Junji UEYAMA

IPC: C08K5/3415 ,  C08G59/50

CPC classification number: C08K5/3415 ,  C08G59/5073

Abstract: A curing resin composition well balanced in curing properties and storage stability. The composition contains (A) an epoxy resin, (B) a curing agent, and (C) at least one of imide compounds represented by formulae (1-1), (1-2), and (1-3), wherein R11 represents an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.; R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, etc.; and R12 and R13 each independently represent a hydrogen atom, an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.

公开(公告)号：US20240109869A1

公开(公告)日：2024-04-04

申请号：US18262337

申请日：2022-01-25

Applicant: ADEKA CORPORATION

Inventor： Takeshi ENDO ,  Yasuyuki MORI ,  Ippei OKANO ,  Ryo OGAWA ,  Junji UEYAMA

IPC: C07D403/06 ,  C08G59/50 ,  H01B1/12

CPC classification number: C07D403/06 ,  C08G59/5073 ,  H01B1/121

Abstract: Disclosed is a charge transfer complex capable of obtaining a curable resin composition having an excellent balance between curability and storage stability when used as an epoxy-resin curing agent. The charge transfer complex has an imidazole moiety as an electron donor moiety. The charge transfer complex may be an assembly wherein electrons included in a compound (a) having an imidazole moiety are accepted by a compound (b) having an electron acceptor moiety, or may be a compound having an imidazole moiety and an electron acceptor moiety in its molecule, and the electron acceptor moiety accepts electrons included in the imidazole moiety.