公开(公告)号：US20170079146A1

公开(公告)日：2017-03-16

申请号：US15341626

申请日：2016-11-02

Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.

Inventor： André BROSSEAU ,  Svitlana GRIGORENKO ,  Ping JIANG ,  Michael B. KORZENSKI

IPC: H05K3/22 ,  C22B3/00 ,  C22B7/00 ,  C25C1/20

CPC classification number: H05K3/22 ,  C22B7/007 ,  C22B7/008 ,  C22B11/046 ,  C23F1/44 ,  C25C1/20 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P10/214 ,  Y02P10/234 ,  Y02P20/582 ,  Y02P70/613 ,  Y02W30/54 ,  Y10T29/49815

Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

Abstract translation: 使用环境友好的组合物回收印刷线路板的方法，其中电子元件，贵金属和贱金属可以被收集用于再利用和再循环。

公开(公告)号：US20150322540A1

公开(公告)日：2015-11-12

申请号：US14803962

申请日：2015-07-20

Applicant: Advanced Technology Materials, Inc.

Inventor： Tianniu CHEN ,  Michael B. KORZENSKI ,  Ping JIANG

IPC: C22B3/02 ,  C22B3/04 ,  C22B1/00 ,  C22B4/00 ,  C22B3/00 ,  C22B7/00

CPC classification number: B23K1/018 ,  B09B3/00 ,  B09B5/00 ,  B23K3/08 ,  B23K37/00 ,  C22B1/005 ,  C22B3/02 ,  C22B3/04 ,  C22B4/00 ,  C22B7/006 ,  C22B11/046 ,  C25C1/00 ,  H05K3/22 ,  H05K2203/178 ,  Y02P10/234 ,  Y02P70/613 ,  Y02W30/82 ,  Y02W30/821 ,  Y02W30/822

Abstract: Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.

Abstract translation: 可以收集用于回收印刷线路板的设备和方法，其中电子元件，贵金属和贱金属可以被收集用于再利用和再循环。 这些设备通常包括机械焊料去除模块和/或热模块，化学焊剂去除模块和贵金属浸出模块，其中模块被附接以使电子废物从模块连续通过模块。

公开(公告)号：US20160035580A1

公开(公告)日：2016-02-04

申请号：US14880698

申请日：2015-10-12

Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.

Inventor： Emanuel I. COOPER ,  Eileen SPARKS ,  William R. BOWERS ,  Mark A. BISCOTTO ,  Kevin P. YANDERS ,  Michael B. KORZENSKI

IPC: H01L21/311 ,  H01L21/02 ,  C09K13/08

CPC classification number: H01L21/31111 ,  B65D85/70 ,  C09K13/08 ,  G03F7/422 ,  H01L21/0206 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Compositions useful for the selective removal of silicon nitride materials relative to polysilicon, silicon oxide materials and/or silicide materials from a microelectronic device having same thereon. The removal compositions include fluorosilicic acid, silicic acid, and at least one organic solvent. Typical process temperatures are less than about 100° C. and typical selectivity for nitride versus oxide etch is about 200:1 to about 2000:1. Under typical process conditions, nickel-based silicides as well as titanium and tantalum nitrides are largely unaffected, and polysilicon etch rates are less than about 1 Å min−1.

Abstract translation: 可用于相对于多晶硅，氧化硅材料和/或硅化物材料从其上具有相同的微电子器件选择性去除氮化硅材料的组合物。 除去组合物包括氟硅酸，硅酸和至少一种有机溶剂。 典型的工艺温度小于约100℃，氮化物与氧化物蚀刻的典型选择性为约200:1至约2000:1。 在典型的工艺条件下，镍基硅化物以及钛和钽氮化物在很大程度上不受影响，多晶硅蚀刻速率小于约1埃min -1。

公开(公告)号：US20160122846A1

公开(公告)日：2016-05-05

申请号：US14993614

申请日：2016-01-12

Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.

Inventor： Michael B. KORZENSKI ,  Ping JIANG ,  James NORMAN ,  John WARNER ,  Laura INGALLS ,  Dinakar GNANAMGARI ,  Fred STRICKLER ,  Ted MENDUM

IPC: C22B3/00 ,  C22B3/16 ,  C22B7/00 ,  C22B15/00 ,  C22B1/00

CPC classification number: C22B11/046 ,  C22B1/005 ,  C22B3/0005 ,  C22B3/16 ,  C22B7/006 ,  C22B7/007 ,  C22B7/008 ,  C22B15/0006 ,  C22B15/0067 ,  C22B15/0069 ,  C22B15/0071 ,  C22B15/0073 ,  C22B15/0078 ,  Y02P10/214 ,  Y02P10/234 ,  Y02W30/54

Abstract: Processes for recycling electronic components removed from printed wire boards, whereby precious metals and base metals are extracted from the electronic components using environmentally friendly compositions. At least gold, silver and copper ions can be extracted from the electronic components and reduced to their respective metals using the processes and compositions described herein.

公开(公告)号：US20150322545A1

公开(公告)日：2015-11-12

申请号：US14803936

申请日：2015-07-20

Applicant: Advanced Technology Materials, Inc.

Inventor： Tianniu CHEN ,  Michael B. KORZENSKI ,  Ping JIANG

IPC: C22B3/00 ,  C22B3/04 ,  C25C1/00 ,  C22B1/00

CPC classification number: B23K1/018 ,  B09B3/00 ,  B09B5/00 ,  B23K3/08 ,  B23K37/00 ,  C22B1/005 ,  C22B3/02 ,  C22B3/04 ,  C22B4/00 ,  C22B7/006 ,  C22B11/046 ,  C25C1/00 ,  H05K3/22 ,  H05K2203/178 ,  Y02P10/234 ,  Y02P70/613 ,  Y02W30/82 ,  Y02W30/821 ,  Y02W30/822

Abstract: Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.

公开(公告)号：US20160095230A1

公开(公告)日：2016-03-31

申请号：US14962250

申请日：2015-12-08

Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.

Inventor： André BROSSEAU ,  Svitlana GRIGORENKO ,  Ping JIANG ,  Michael B. KORZENSKI

IPC: H05K3/22

CPC classification number: H05K3/22 ,  C22B7/007 ,  C22B7/008 ,  C22B11/046 ,  C23F1/44 ,  C25C1/20 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P10/214 ,  Y02P10/234 ,  Y02P20/582 ,  Y02P70/613 ,  Y02W30/54 ,  Y10T29/49815

Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

公开(公告)号：US20150321279A1

公开(公告)日：2015-11-12

申请号：US14802219

申请日：2015-07-17

Applicant: Advanced Technology Materials, Inc.

Inventor： Tianniu CHEN ,  Michael B. KORZENSKI ,  Ping JIANG

IPC: B23K1/018 ,  B23K37/00 ,  B23K3/08

CPC classification number: B23K1/018 ,  B09B3/00 ,  B09B5/00 ,  B23K3/08 ,  B23K37/00 ,  C22B1/005 ,  C22B3/02 ,  C22B3/04 ,  C22B4/00 ,  C22B7/006 ,  C22B11/046 ,  C25C1/00 ,  H05K3/22 ,  H05K2203/178 ,  Y02P10/234 ,  Y02P70/613 ,  Y02W30/82 ,  Y02W30/821 ,  Y02W30/822

Abstract: Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.