PACKAGING STRUCTURE, MANUFACTURING METHOD OF PACKAGING STRUCTURE, AND QUANTUM PROCESSOR

    公开(公告)号:US20230253692A1

    公开(公告)日:2023-08-10

    申请号:US18299181

    申请日:2023-04-12

    Inventor: Hua XU Jin QIN

    CPC classification number: H01P3/003 H05K1/0237

    Abstract: A waveguide includes: a substrate; a first ground wire; a second ground wire; a signal wire; and a compensation structure. The first ground wire, the second ground wire, and the signal wire are disposed on the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire. The compensation structure is configured to contact at least one of the substrate, the first ground wire, the second ground wire, or the signal wire; and the compensation structure comprises a superconducting material.

    METHOD FOR PREPARING A JOSEPHSON JUNCTION, APPARATUS, AND DEVICE, AND SUPERCONDUCTING DEVICE

    公开(公告)号:US20240188451A1

    公开(公告)日:2024-06-06

    申请号:US18419990

    申请日:2024-01-23

    CPC classification number: H10N60/0912 H10N60/12 H10N60/805 H10N69/00

    Abstract: Methods, apparatuses, and devices for Josephson junction preparation includes: obtaining a first pattern structure for generating a first Josephson junction of a first type and a plurality of second pattern structures for generating a plurality of second Josephson junctions of a second type; evaporating a material on the first pattern structure and the plurality of second pattern structures based on a first evaporation direction to generate a first electrode layer for implementing information transmission; forming an insulating layer on the first electrode layer, the insulating layer including a compound corresponding to the material; evaporating the material on the first pattern structure and the plurality of second pattern structures based on a second evaporation direction to generate a second electrode layer for implementing information transmission; and forming the first Josephson junction and the plurality of second Josephson junctions.

    METHOD FOR PREPARING A JOSEPHSON JUNCTION, APPARATUS, AND DEVICE, AND SUPERCONDUCTING DEVICE

    公开(公告)号:US20220140223A1

    公开(公告)日:2022-05-05

    申请号:US17507099

    申请日:2021-10-21

    Abstract: Methods, apparatuses, and devices for Josephson junction preparation includes: obtaining a first pattern structure for generating a first Josephson junction of a first type and a plurality of second pattern structures for generating a plurality of second Josephson junctions of a second type; evaporating a material on the first pattern structure and the plurality of second pattern structures based on a first evaporation direction to generate a first electrode layer for implementing information transmission; forming an insulating layer on the first electrode layer, the insulating layer including a compound corresponding to the material; evaporating the material on the first pattern structure and the plurality of second pattern structures based on a second evaporation direction to generate a second electrode layer for implementing information transmission; and forming the first Josephson junction and the plurality of second Josephson junctions.

    PACKAGING STRUCTURE, MANUFACTURING METHOD OF PACKAGING STRUCTURE, AND QUANTUM PROCESSOR

    公开(公告)号:US20210359384A1

    公开(公告)日:2021-11-18

    申请号:US17319870

    申请日:2021-05-13

    Inventor: Hua XU Jin QIN

    Abstract: A packaging structure, a method of manufacturing a packaging structure, and a quantum processor include a substrate; a coplanar waveguide including a first ground wire, a second ground wire, and a signal wire, wherein the first ground wire, the second ground wire, and the signal wire are disposed on a surface of the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire; an air bridge including a first end connected with the first ground wire and a second end connected with the second ground wire, wherein a gap exists between the air bridge and a surface of the signal wire away from the substrate; and a compensation structure located on the surface of the substrate.

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