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1.发明申请公开(公告)号：US20220267660A1
公开(公告)日：2022-08-25
申请号：US17662066
申请日：2022-05-04
Applicant: AMOGREENTECH CO., LTD.
Inventor： Jin Hyoung LEE
Abstract: Disclosed is a heat dissipation sheet. The heat dissipation sheet according to an embodiment of the present invention is implemented to include a matrix formed of a main resin including a rubber-based resin, and a heat dissipation filler dispersed in the matrix and having a modified surface. Accordingly, as the compatibility between dissimilar materials forming the heat dissipation sheet increases, the heat dissipation performance is more improved. In addition, although it is designed to have excellent heat dissipation performance, the cracking, shrinkage, and pore generation of the sheet can be minimized or prevented, so that the sheet can have excellent flexibility.
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公开(公告)号：US20220340802A1
公开(公告)日：2022-10-27
申请号：US17762495
申请日：2020-09-16
Applicant: AMOGREENTECH CO., LTD.
Inventor： Jin Hyoung LEE
Abstract: Provided is an RF heat dissipation plastic. The heat dissipation plastic according to one embodiment of the present invention is implemented by including: a polymer matrix comprising a base resin; and hollow first fillers dispersed in the polymer matrix. Accordingly, the RF heat dissipation plastic has the advantageous effect of simultaneously exhibiting low permittivity and excellent mechanical strength due to the hollow fillers included therein. In addition, despite the low permittivity and excellent mechanical strength designed for the RF heat dissipation plastic, the RF heat dissipation plastic exhibits excellent heat dissipation performance due to non-hollow fillers included therein, which exhibit heat dissipation performance. According to the present invention, the RF heat dissipation plastic exhibiting the low permittivity and the excellent mechanical strength and heat dissipation performance can minimize performance degradation or functional loss of a repeater cabinet which may be affected by transmission and reception of high-frequency band signals according to permittivity, and thus can be widely applied to various products across all industries.
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公开(公告)号：US20220232727A1
公开(公告)日：2022-07-21
申请号：US17613306
申请日：2020-05-25
Applicant: AMOGREENTECH CO., LTD
Inventor： Jin Hyoung LEE
Abstract: A housing for repeater having an accommodation part accommodating therein a device for repeating an RF signal, and at least a portion of the housing is implemented with heat dissipation plastic having, at a frequency of 28 GHz, a relative permittivity of less than or equal to 4 and a thermal conductivity of greater than or equal to 3 W/mK. Accordingly, as the housing has a high heat dissipation performance against high heat generated from various types of devices provided inside the repeater for transmitting and receiving a signal in a high frequency band and minimizes the interference of transmission and reception of the signal in the high frequency band, the housing can be widely used as a housing for repeater in the mobile communication field or the like using a signal in a high frequency band.
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Patent Agency Ranking
公开(公告)号：US20220348813A1
公开(公告)日：2022-11-03
申请号：US17762492
申请日：2020-09-16
Applicant: AMOGREENTECH CO., LTD.
Inventor： Jin Hyoung LEE
Abstract: An RF heat dissipation plastic including a polymer matrix comprising a polymer resin; and a first filler that is dispersed in the polymer matrix, and includes a high-strength filler, which is a polymer containing at least one hydroxy group in the repeating unit thereof, and an inorganic coating layer formed on at least a part of the surface of the high-strength filler. Therefore, the RF heat dissipation plastic has a low dielectric constant and excellent mechanical strength are simultaneously exhibited.
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公开(公告)号：US20220095486A1
公开(公告)日：2022-03-24
申请号：US17419888
申请日：2020-01-03
Applicant: AMOGREENTECH CO., LTD.
Inventor： Seung Jae HWANG , Jin Hyoung LEE
Abstract: A method of manufacturing a heat dissipation sheet including preparing a preliminary sheet including a matrix-forming component, a crosslinking agent, and a heat dissipation filler, and crosslinking the matrix-forming component included in the preliminary sheet and thus obtaining a heat dissipation sheet. The heat dissipation sheet manufactured has remarkably excellent heat dissipation properties because it contains a high content of heat dissipation filler. Due to the material properties of the matrix-forming component and the crosslinking of the matrix-forming component and the resulting matrix formation, the occurrence of cracking, shrinkage, pore formation, thickness change, and the like is minimized or prevented, and excellent flexibility can be attained. Moreover, since processability is improved through processes such as cooling when manufacturing the heat dissipation sheet, productivity is excellent, and the sheet can be suitable for mass production.
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6.发明申请APPARATUS AND METHOD FOR FORMING ORGANIC THIN FILM AND MANUFACTURING METHOD OF ORGANIC THIN FILM DEVICE USING THE SAME 有权用于形成有机薄膜的装置和方法及使用其的有机薄膜装置的制造方法公开(公告)号：US20150263286A1
公开(公告)日：2015-09-17
申请号：US14715878
申请日：2015-05-19
Applicant: AMOGREENTECH CO., LTD.
Inventor： Jin Hyoung LEE , Geun Sik CHO , Il Soo MOON , Yong Sul SONG
CPC classification number: H01L51/0007 , B05B7/16 , H01L51/0003 , H01L51/0008 , H01L51/0029 , H01L51/0097 , H01L51/5012 , H01L51/5056 , H01L51/5072 , H01L51/5092 , H01L51/5206 , H01L51/5221 , H01L51/56 , H01L2251/5338 , Y02E10/549 , Y02P70/521
Abstract: Provided is an organic thin film forming apparatus, an organic thin film forming method, and a method of manufacturing an organic thin film device using the same, in which an organic light-emitting layer (photoactive layer) and/or an electron transport layer can be formed on a substrate when an organic light emitting diode (OLED) or an organic solar cell is manufactured. The organic thin film forming apparatus includes: a solution spray unit for spraying a solution on a substrate; and a hot gas spray unit for spraying a hot gas onto fine liquid droplets that have been sprayed from the solution spray unit and that are in flight, to thereby evaporate a solvent contained in the fine liquid droplets.
Abstract translation: 本发明提供一种有机薄膜形成装置，有机薄膜形成方法和使用该薄膜形成方法的有机薄膜器件的制造方法，其中有机发光层（光活性层）和/或电子传输层可以 当制造有机发光二极管（OLED）或有机太阳能电池时，在基板上形成。 有机薄膜形成装置包括：溶液喷射单元，用于将溶液喷射在基板上; 以及热气体喷射单元，用于将热气体喷射到已经从溶液喷射单元喷射并处于飞行状态的细小液滴上，从而蒸发细液滴中所含的溶剂。
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公开(公告)号：US20220267659A1
公开(公告)日：2022-08-25
申请号：US17636864
申请日：2020-08-21
Applicant: AMOGREENTECH CO., LTD.
Inventor： Jin Hyoung LEE
Abstract: A heat-dissipating plastic is provided. The heat-dissipating plastic according to an exemplary embodiment of the present invention is implemented by including a polymer matrix formed by including a main resin; and a carbon-based filler which is provided by being dispersed in the polymer matrix, and includes a fibrous carbon-based filler and a granular carbon-based filler.
According to the above, the heat-dissipating plastic has remarkably excellent heat dissipation characteristics due to the remarkably excellent thermal conductivity, and it has an effect that the mechanical strength is remarkably excellent even though it is designed to have remarkably excellent heat dissipation characteristics. Accordingly, the implemented heat-dissipating plastic can be widely applied in various technical fields where excellent heat-dissipating performance and mechanical strength are required at the same time.-
公开(公告)号：US20220263214A1
公开(公告)日：2022-08-18
申请号：US17662067
申请日：2022-05-04
Applicant: AMOGREENTECH CO., LTD.
Inventor： Jin Hyoung LEE
Abstract: Disclosed is a heat dissipation sheet for a low frequency antenna. The heat dissipation sheet according to an embodiment of the present invention is a heat dissipation sheet for a low frequency antenna having an operating frequency of 50 kHz to 350 kHz, and is implemented by including a matrix and a heat dissipation filler dispersed in the matrix and having graphite. According to this, the heat generated from the antenna can be quickly transferred to the outside without deterioration of the characteristics of the antenna operating in the low frequency band, so that it can be widely applied to various articles in the industry, such as electronic devices.
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