公开(公告)号：US3916513A

公开(公告)日：1975-11-04

申请号：US46654974

申请日：1974-05-03

Applicant: AMPEX

Inventor： BALLARD NATHAN THOMAS

IPC: H01R12/51 ,  H05K1/05 ,  H05K3/40 ,  H05K1/04

CPC classification number: H05K3/4046 ,  H05K1/05 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2201/10924 ,  Y10T29/49121 ,  Y10T29/49126

Abstract: Interplane connectors (vias) between circuit layers are fabricated by providing a metal base plate with the desired connectors thereon, forming the connectors at right angles to the base plate and embedding the connectors in a plastic matrix. The base plate is then removed, leaving the plastic with the connectors embedded therein at the desired locations.

Abstract translation: 通过在其上提供具有所需连接器的金属底板来制造电路层之间的平面间连接器（通路），形成与基板成直角的连接器并将连接器嵌入塑料基体中。 然后取下基板，留下塑料，将连接器嵌入其中所需的位置。