-
1.发明公开公开(公告)号：US20240060729A1
公开(公告)日：2024-02-22
申请号：US17890317
申请日：2022-08-18
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： CHING-MING YANG , CHUN-LUNG WU , TZE-YANG YEH
CPC classification number: F28F3/022 , F28F13/06 , F28F3/04 , F28F2215/04
Abstract: A liquid-cooling heat dissipation plate with pin-fins and an enclosed liquid cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of rhombus-shaped pin-fins, and a plurality of ellipse-shaped pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface opposite to each other. The first heat dissipation surface is in contact with a heat source, and the second heat dissipation surface is in contact with a cooling fluid. The rhombus-shaped pin-fins and the ellipse-shaped pin-fins are integrally formed on the second heat dissipation surface and in a high density arrangement. The ellipse-shaped pin-fins correspond in position to a relative low temperature region of the heat source, and the rhombus-shaped pin-fins correspond in position to a relative high temperature region of the heat source.
-
公开(公告)号：US20170050263A1
公开(公告)日：2017-02-23
申请号：US14833007
申请日：2015-08-21
Applicant: Amulaire thermal technology, INC.
Inventor： CHUN-LUNG WU , MING-SIAN LIN , WEN-YUAN CHOU
IPC: B23K20/12
CPC classification number: B23K20/1245 , B23K20/1265
Abstract: A friction stir welding device, provided for welding stacked metallic boards together, includes a mounting seat and a plurality of friction-stir tools. The mounting seat is defined with a rotational axis-direction. Each friction-stir tool has a shoulder portion and a stirring probe protruded from the shoulder portion. The friction-stir tools are arranged in the rotational axis-direction and disposed on a bottom surface of the mounting seat. The friction-stir tools can rotate along the rotational axis-direction. When a relative linear motion is applied between the friction-stir tools and the stacked metallic boards, the shoulders of the friction-stir tools produce stirring-coverage zones which are overlapped partially along the linear movement direction, so that the stirring-coverage zones by the friction-stir tools form a planar welding zone. The present disclosure also provides a method of friction stir welding for welding stacked metallic boards together.
Abstract translation: 用于将堆叠的金属板焊接在一起的摩擦搅拌焊接装置包括安装座和多个摩擦搅拌工具。 安装座由旋转轴线方向限定。 每个摩擦搅拌工具具有从肩部突出的肩部和搅拌探针。 摩擦搅拌工具沿旋转轴线方向布置并设置在安装座的底表面上。 摩擦搅拌工具可以沿旋转轴线方向旋转。 当在摩擦搅拌工具和堆叠的金属板之间施加相对直线运动时，摩擦搅拌工具的肩部产生沿着线性移动方向部分重叠的搅拌覆盖区域，从而使搅拌覆盖区域由 摩擦搅拌工具形成平面焊接区域。 本公开还提供了一种用于将堆叠的金属板焊接在一起的摩擦搅拌焊接的方法。
-
3.发明申请公开(公告)号：US20210183730A1
公开(公告)日：2021-06-17
申请号：US16711747
申请日：2019-12-12
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： TZU-HSUAN WANG , TZE-YANG YEH , CHUN-LUNG WU
IPC: H01L23/373 , H01L25/07 , H01L25/18 , H01L23/00
Abstract: An IGBT module with a heat dissipation structure includes a first layer of chips, a second layer of chips, a first bonding layer, a second bonding layer, a first copper layer, a second copper layer, a thermally-conductive and electrically-insulating layer, and a heat dissipation layer. The first copper layer and the second copper layer are disposed on the thermally-conductive and electrically-insulating layer at intervals. The first layer of chips and the second layer of chips are disposed on the first bonding layer and the second bonding layer, respectively. The number of chips of the first layer of chips is larger than that of the second layer of chips such that the first copper layer has a greater thickness than the second copper layer.
-
公开(公告)号：US20150338176A1
公开(公告)日：2015-11-26
申请号：US14287052
申请日：2014-05-25
Applicant: Amulaire thermal technology, INC.
Inventor： RU-LOONG RAYMOND CHEN , CHUN-HOU CHAN , CHUN-LUNG WU
CPC classification number: F28F21/084 , F28F3/022 , F28F13/00 , F28F21/085 , F28F2275/14 , H01L23/3677 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , H01L2924/00
Abstract: A compound heat-dissipating device includes a conductive base and a heat-dissipating body. The conductive base has a first bottom surface, a first top surface, and a plurality of combining portions protruded from the first top surface. Each combining portion has a bottom end connected with the first bottom surface and a top end extended from the bottom end integrally. The top end has a cross-sectional area bigger than that of the bottom end. The heat-dissipating body has a second bottom surface and a second top surface. The second bottom surface has a pair of concave portions corresponding to a contour of the conductive base, and a plurality of combining grooves formed in the concave portion. The shape of the combining grooves is corresponding to that of the combining portions, and the combining portions are correspondingly combined with the combining grooves.
Abstract translation: 复合散热装置包括导电基座和散热体。 导电基底具有第一底面，第一顶面以及从第一顶面突出的多个组合部。 每个组合部分具有与第一底表面连接的底端和从底部整体延伸的顶端。 顶端的截面积大于底端的横截面面积。 散热体具有第二底表面和第二顶表面。 第二底面具有与导电性基体的轮廓对应的一对凹部，以及形成在凹部中的多个组合槽。 组合槽的形状对应于组合部分的形状，并且组合部分与组合槽相应地组合。
-
5.发明公开公开(公告)号：US20240247882A1
公开(公告)日：2024-07-25
申请号：US18100474
申请日：2023-01-23
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： KUO-WEI LEE , CHIEN-CHENG WU , CHUN-LUNG WU , TZE-YANG YEH
CPC classification number: F28F3/02 , F28F9/001 , F28F2215/00 , F28F2275/04 , F28F2275/062
Abstract: A liquid-cooling heat dissipation structure having a nonlinear fin array and a method for manufacturing the same are provided. The liquid-cooling heat dissipation structure includes an upper plate, a lower plate, and a flow guide member. The upper plate has an accommodating groove of which an inner side has an upper joint area formed thereon. The lower plate has a lower joint area. The flow guide member disposed between the upper plate and the lower plate includes a heat dissipation plate body having a first surface and a second surface, and a plurality of heat dissipation columns integrally disposed on the second surface. The upper brazing area is connected to the lower brazing area, and two ends of the flow guide member are respectively connected to the upper joint area and the lower joint area to form an enclosed cavity for accommodating the heat dissipation columns.
-
Patent Agency Ranking
公开(公告)号：US20240230245A9
公开(公告)日：2024-07-11
申请号：US17970728
申请日：2022-10-21
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： CHUN-LI HSIUNG , KUO-WEI LEE , CHIEN-CHENG WU , CHUN-LUNG WU
CPC classification number: F28F3/048 , F28D1/0316 , F28D9/0043
Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.
-
公开(公告)号：US20220251687A1
公开(公告)日：2022-08-11
申请号：US17732502
申请日：2022-04-28
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： CHING-MING YANG , TZE-YANG YEH , CHUN-LUNG WU
Abstract: A method for manufacturing an integrally-formed alloy structure having a brazing surface includes the following steps. Firstly, a magnesium-containing alloy is provided. Next, the magnesium-containing alloy is heat treated to obtain a vacuum heat-treated alloy structure. Then, the top surface of the vacuum heat-treated alloy structure is reduced to expose the brazing surface. Finally, the integrally-formed alloy structure having the brazing surface is formed.
-
公开(公告)号：US20210183731A1
公开(公告)日：2021-06-17
申请号：US16711830
申请日：2019-12-12
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： TZU-HSUAN WANG , TZE-YANG YEH , CHUN-LUNG WU
IPC: H01L23/373 , H01L25/07 , H01L23/00 , H01L23/367
Abstract: An IGBT module with a heat dissipation structure includes a first layer of chips, a second layer of chips, a first bonding layer, a second bonding layer, a first copper layer, a second copper layer, a first polymer composite layer, a second polymer composite layer, a first ceramic layer, a second ceramic layer, and a heat dissipation layer. The first ceramic layer is partially formed on the heat dissipation layer and corresponds in position and in area to the first layer of chips, and the second ceramic layer is partially formed on the heat dissipation layer and corresponds in position and in area to the second layer of chips.
-
公开(公告)号：US20210180889A1
公开(公告)日：2021-06-17
申请号：US16711726
申请日：2019-12-12
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： MIN-HORNG LIU , TZE-YANG YEH , CHUN-LUNG WU
Abstract: A copper-alloy heat-dissipation structure with a milled surface includes a heat-dissipation main body. The heat-dissipation main body has a first milled surface and a second milled surface that are opposite to each other, where heat-dissipation fins are formed on the first milled surface, and the maximum height roughness Rz of the second milled surface ranges from 1.5 μm to 5.4 μm.
-
10.发明公开公开(公告)号：US20240224464A1
公开(公告)日：2024-07-04
申请号：US18147672
申请日：2022-12-28
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： YI-HSIN HUANG , CHUN-LUNG WU , KUO-WEI LEE , TZE-YANG YEH
IPC: H05K7/20
CPC classification number: H05K7/20263 , H05K7/20409
Abstract: A liquid-cooling heat dissipation plate with unequal height pin-fins and an enclosed liquid-cooling cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of full-height pin-fins, and a plurality of non-full-height pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that face away from each other, the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid. The full-height and non-full-height pin-fins are formed at the second heat dissipation surface of the heat dissipation plate body. A first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid.
-
-
-
-
-
-
-
-
-
Search Results
17
records
(took 0.016 seconds)
