公开(公告)号：US20200375064A1

公开(公告)日：2020-11-26

申请号：US16739238

申请日：2020-01-10

Applicant: APACER TECHNOLOGY INC.

Inventor： Chien-Pang CHEN ,  Min-Lung LIN ,  Chih-Hung KUO ,  Sung-Yu TSAI

IPC: H05K7/20 ,  G06F1/20

Abstract: A solid-state drive (SSD) heat dissipation device is disclosed. The SSD heat dissipation device comprises a solid-state drive substrate, a chip heat dissipation component, a memory heat dissipation component, and a spacer. A control IC and a flash memory are disposed on the solid-state drive substrate, the chip heat dissipation component is disposed on the control IC, and the memory heat dissipation component is disposed on the flash memory. The chip heat dissipation component and the memory heat dissipation component are disposed separately.