公开(公告)号：US20140251217A1

公开(公告)日：2014-09-11

申请号：US13785866

申请日：2013-03-05

Applicant: APPLIED MATERIAL, INC.

Inventor： THANH X. NGUYEN ,  YONG CAO ,  MUHAMMAD RASHEED ,  XIANMIN TANG

IPC: H01J37/34 ,  C23C14/34

CPC classification number: H01J37/3423 ,  C23C14/3407 ,  H01J37/32403 ,  H01J37/3414 ,  H01J37/3417 ,  H01J37/3435 ,  Y10T428/21

Abstract: Embodiments of apparatus for physical vapor deposition are provided. In some embodiments, a target assembly for use in a substrate processing system to process a substrate includes a plate having a first side and an opposing second side, wherein the second side comprises a target supporting surface extending from the second side in a direction normal to the second side, wherein the target supporting surface has a first diameter and is bounded by a first edge; and a target having a first side bonded to the target supporting surface, wherein a diameter of the target is greater than the first diameter of the target supporting surface.

Abstract translation: 提供了用于物理气相沉积的设备的实施例。 在一些实施例中，用于处理衬底的衬底处理系统中的目标组件包括具有第一侧和相对的第二侧的板，其中第二侧包括从第二侧沿垂直于 所述第二侧，其中所述目标支撑表面具有第一直径并且由第一边缘限定; 以及具有接合到所述目标支撑表面的第一侧的靶，其中所述靶的直径大于所述靶支撑表面的第一直径。