公开(公告)号：US10593521B2

公开(公告)日：2020-03-17

申请号：US13798028

申请日：2013-03-12

Applicant: APPLIED MATERIALS, INC.

Inventor： Larry Frazier ,  Cheng-Hsiung Matthew Tsai ,  John C. Forster ,  Mei Po Yeung ,  Michael S. Jackson

IPC: H01L21/67 ,  H01L21/687 ,  H01J37/32

Abstract: Methods and apparatus for processing substrates are disclosed herein. In some embodiments, a substrate support to support a substrate in a processing chamber includes a dielectric insulator plate; a conductive plate supported on the dielectric insulator plate, the conductive plate comprising a top surface and a bottom surface defining a thickness between the top surface and the bottom surface, wherein an edge portion of the conductive plate tapers in a radially outward direction; and a dielectric plate comprising a substrate support surface disposed upon the top surface of the conductor plate.