公开(公告)号：US10002771B1

公开(公告)日：2018-06-19

申请号：US15728604

申请日：2017-10-10

Applicant: APPLIED MATERIALS, INC.

Inventor： Prayudi Lianto ,  Kuma Hsiung ,  Eric J. Bergman ,  John L. Klocke ,  Mohamed Rafi ,  Muhammad Azim ,  Guan Huei See ,  Arvind Sundarrajan

IPC: H01L21/3105 ,  H01L21/687

CPC classification number: H01L21/31053 ,  H01L21/31058 ,  H01L21/68764

Abstract: A polymer layer on a substrate may be treated with ozone gas or with deionized water and ozone gas to increase a removal rate of the polymer layer in a chemical mechanical polishing (CMP) process. The ozone gas may be diffused directly into the polymer layer or through a thin layer of deionized water on the surface of the polymer layer and into the polymer layer. The deionized water may also be heated during the process to further enhance the diffusion of the ozone gas into the polymer layer.