公开(公告)号：US20160298255A1

公开(公告)日：2016-10-13

申请号：US15190370

申请日：2016-06-23

Applicant: APPLIED Materials, Inc.

Inventor： Robert B. Moore ,  David Silvetti ,  Paul Wirth ,  Randy Harris

IPC: C25D17/06 ,  H01L21/768 ,  H01L21/687 ,  C25D17/00 ,  C25D7/12

CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/005 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/76879

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

Abstract translation: 在用于电镀半导体晶片和类似衬底的处理系统中，电镀处理器的接触环从处理器的转子移除，并被先前去绝缘的接触环替代。 这允许接触环在系统的环形服务模块中脱落，同时处理器继续工作。 晶圆生产量提高。 接触环可以附接到卡盘，用于使处理器和环形服务模块之间的接触环移动，卡盘可快速地附接和释放到转子上。

公开(公告)号：US10087544B2

公开(公告)日：2018-10-02

申请号：US15190370

申请日：2016-06-23

Applicant: APPLIED Materials, Inc.

Inventor： Robert B. Moore ,  David Silvetti ,  Paul Wirth ,  Randy Harris

IPC: C25D7/12 ,  C25D17/00 ,  C25D17/06 ,  H01L21/687 ,  H01L21/768

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

公开(公告)号：US20140318977A1

公开(公告)日：2014-10-30

申请号：US14259492

申请日：2014-04-23

Applicant: APPLIED Materials, Inc.

Inventor： Robert B. Moore ,  David Silvetti ,  Paul Wirth ,  Randy Harris

IPC: C25D17/06 ,  C25D7/12

CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/005 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/76879

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

Abstract translation: 在用于电镀半导体晶片和类似衬底的处理系统中，电镀处理器的接触环从处理器的转子移除，并被先前去绝缘的接触环替代。 这允许接触环在系统的环形服务模块中脱落，同时处理器继续工作。 晶圆生产量提高。 接触环可以附接到卡盘，用于使处理器和环形服务模块之间的接触环移动，卡盘可快速地附接和释放到转子上。

公开(公告)号：US20180298513A1

公开(公告)日：2018-10-18

申请号：US16013686

申请日：2018-06-20

Applicant: APPLIED Materials, Inc.

Inventor： Robert B. Moore ,  David Silvetti ,  Paul Wirth ,  Randy Harris

IPC: C25D17/06 ,  C25D17/00 ,  H01L21/768 ,  H01L21/687 ,  C25D7/12

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

公开(公告)号：US09399827B2

公开(公告)日：2016-07-26

申请号：US14259492

申请日：2014-04-23

Applicant: APPLIED Materials, Inc.

Inventor： Robert B. Moore ,  David Silvetti ,  Paul Wirth ,  Randy Harris

IPC: C25D17/06 ,  C25D17/00

CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/005 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/76879

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

Abstract translation: 在用于电镀半导体晶片和类似衬底的处理系统中，电镀处理器的接触环从处理器的转子移除，并被先前去绝缘的接触环替代。 这允许接触环在系统的环形服务模块中脱落，同时处理器继续工作。 晶圆生产量提高。 接触环可以附接到卡盘，用于使处理器和环形服务模块之间的接触环移动，卡盘可快速地附接和释放到转子上。